Find Your Technical Solution Below

Tekdis products are categorised into the groups below. Once you select the correct category use the filters to locate the best product for your application.

Depending on the category there are numerous filters to help you identify the ideal solution. If you have other questions or requests we are always available via phone or email and will aim to respond within the hour.

Tekdis can "build to order" a complete solution including Operating System and SSD imaging so systems will be preconfigured out of the box. 

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1-24 of 34 Items

  1. EPD-2501 Public Information e-Ink Display
    EPD-2501 Public Information e-Ink Display

     

    Onboard Intel Celeron SoC BGA Processor N3350

     

    Key Features: 

    • 25.3” E Ink Black/White/Red/Yellow
    • 25.3” E Ink Gallery Plus Full colour 55K (Typ.)
    • ​25.3" E Ink Kaleido with colour 4096
    • Onboard Intel® Celeron® SoC BGA Processor N3350
    • DDR3L 1866MTs SO-DIMM up to 8GB,
    • 2.5” SATA3 SSD 64GB  
    • 2 x HDMI, 1 x COM, 2 x LAN, 4 x USB 3.1(Gen1)
    • Front Cover Glass, Optional PMMA, support IP54
    • Super Slim Bezel Design
    • E Ink SDK / API support
    • Optional WiFi Module
    • Operating Temp 0~40C
  2. CAXA0 10.1" Semi-Rugged Tablet with Celeron N3350
    CAXA0 10.1" Semi-Rugged Tablet with Celeron N3350

    10.1" Semi-Rugged Tablet with Intel Celeron Processor N3350

    Key Features:

    • Semi-rugged design with Intel Celeron N3350
    • Medical certified
    • MIL-STD-810G & IP65 certified, 4-feet drop resistance
    • 10.1” TFT color LCD 1280 x 800 HD
    • Corning Gorilla Glass, 10-point projected capacitive multi-touch panel
    • High mobility with multiple connectivities including WLAN, Bluetooth, NFC
    • Light Design, Weight only 1Kg with Battery
    • G-sensor, light sensor, 2M/8M Camera
    • Option SCR, 1D/2D Barcode scanner
  3. EMS-TGL Fanless Rugged Embedded System 11th Gen
    EMS-TGL Fanless Rugged Embedded System 11th Gen

    11th Gen. Core i7/i5/i3 BGA Processor, Rich I/O, support 5G module, fanless operation temperature -40°C ~ 70°C

    Key Features:

    • On board 11th Gen. Intel Core i7/i5/i3 BGA Processor
    • 2x 260-pin SODIMM socket Max. up to 64GB DDR4 3200MT/s
    • Rich I/O, 4-USB3.1, 1-DP, 1-HDMI, 2-COM, 2-LAN, 1-8bit GPIO.
    • Support 5G (Sub-6G) module, M.2 NVMe SSD Gen. III x 4, HDMI 2.0b (4K @ 60Hz), LAN 2.5G BaseTx GbE
    • Fanless operation temperature from -40°C ~ 70°C (WT) / 0°C ~ 70°C (ST)
    • CE, FCC Class B, IP50
    • Wide range DC power input from +9~32V
    • Support HW TPM 2.0
    • Support vPro
  4. NUC-APL-SLIM Fanless NUC Slim System J3455/N3350
    NUC-APL-SLIM Fanless NUC Slim System J3455/N3350

    Intel Apollo Lake J3455/N3350 Up to 8GB DDR3

    Key Features:

    • Onboard Intel Celeron Processor J3455/N3350
    • Single DRAM Socket, Max. Up to 8GB DDR3 1866MHz
    • Rich I/O, 1 x COM, 2 x HDMI, 2 x LAN, 4 x USB3.0, 1 x Audio, 2 x Antennal Mounting
    • Expansion Slot,  M.2 Key-B,  M.2 Key-E
    • Fanless Operating from 0°C ~ 50°C
    • DC Power Input +12V
    • Compact Size, 115mm x 111mm x 45mm
    • Supports VESA/Din-Rail Kit
    • TPM 2.0 (Factory Option)
  5. NUC-APL Fanless NUC System J3455/N3350
    NUC-APL Fanless NUC System J3455/N3350

    Intel Apollo Lake Celeron Processor J3455/N3350 Up to 8GB DDR3

    Key Features:

    • Onboard Intel Celeron Processor J3455/N3350
    • Single DRAM Socket, Max. Up to 8GB DDR3 1866MHz
    • Rich I/O, 2 x COM, 2 x LAN, 4 x USB3.0, 1 x Audio, 2 x Antennal Mounting
    • Triple Display, 2 x HDMI, 1 x DP (DVI-I/VGA Factory Option)
    • Expansion Slot,  M.2 Key-B,  M.2 Key-E
    • Fanless Operating from 0°C ~ 60°C
    • DC Power Input +12V
    • Compact Size, 115mm x 111mm x 58mm
    • Supports VESA/Din-Rail Kit
    • TPM 2.0 (Factory Option)
  6. ACS10-TGU 11th Gen Intel Fanless Compact System
    ACS10-TGU 11th Gen Intel Fanless Compact System

    Compact and easy to set up, highly expandable I/O interfaces and flexible storage design, and supports high-resolution graphics

    Key Features:

    • 11th Gen Intel Core i5/i3 Tiger Lake-UP3 Processor
    • Intel Iris Xe/ UHD Graphics Engine
    • 1-260-pin DDR4 3200MHz SO-DIMM, Supports Up to 32GB
    • 2-Gigabit Ethernet, 1 x 2.5GbE, 1 x 1GbE
    • 2-COM Port (RS-232/422/485 & RS-232)
    • 2-Audio Jack (Line-Out & Mic-In)
    • 2-Storage (M.2 Key-M NVMe & M.2 Key-B SATA)
    • 2-Expansion Slot (M.2 Key-E, Key-B)
    • 6-USB Port (3-USB 3.2 & 3-USB 2.0)
    • CE, FCC Class A, UKCA
  7. AirLink RV55 Rugged LTE-A Pro Router
    AirLink RV55 Rugged LTE-A Pro Router

    The industry's most rugged, compact, LTE-A Pro router, designed for connecting critical remote assets & infrastructure, and vehicles.

    Key Features:

    • LTE-A PRO up to 600/150Mps
    • Dual SIM automatic network failover
    • High performance GNSS
    • 1 x GbE, 2 x RS232 (DB9), 1 x Digital inputs
    • Optional Dual-Band – Dual Chipset Wi-Fi
    • -30 ~ +70°C operation
    • MIL 810-G, IP64 rated
    • 7~36VDC input
    • Remote, secure network management: Cloud – ALMS, Hosted – AMM
  8. Airlink MP70 High Performance LTE Vehicle Router
    Airlink MP70 High Performance LTE Vehicle Router

    High-performance, LTE-Advanced vehicle router with GPS+CAN for mission-critical applications.

    Key Features:

    • LTE-A up to 300/50Mps, LTE-A PRO version 600/150Mbps
    • Dual SIM automatic network failover
    • Opt. Dual band 2.4/5GHz 802.11ac Wifi AP/Client/WAN mode 
    • GNSS - GPS, GLONASS, Galileo, Beidou
    • 4 x GbE with WAN failover
    • OBD II/ J1939/ J1708 interface over serial
    • -30 ~ +70°C operation
    • MIL 810-G, IP64 rated
    • 7~36VDC input
    • Remote, secure network management - Cloud – ALMS, Hosted – AMM
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