Find Your Technical Solution Below

Tekdis products are categorised into the groups below. Once you select the correct category use the filters to locate the best product for your application.

Depending on the category there are numerous filters to help you identify the ideal solution. If you have other questions or requests we are always available via phone or email and will aim to respond within the hour.

Tekdis can "build to order" a complete solution including Operating System and SSD imaging so systems will be preconfigured out of the box. 

Products
Filter  
  1. Operating Temp +140°F (+60°C) Remove This Item
  2. Memory Up to 32GB Remove This Item
Clear All
Category  
  1. Products 29 items
  1. Mobile Computing 5 items
  2. Digital Signage 6 items
  3. Industrial Computing 22 items
  4. Panel PCs & Industrial Displays 1 item
  5. Cellular & RF 0 items
  6. Medical Solutions 0 items
  7. Cameras & LiDAR 0 items
  8. Storage & Memory 0 items
Screen Size  
CPU  
Intel Gen.  
Screen Size  
Rail/EN50155 Certified  
Brightness  
DIN-Mountable  
Application  
Fanless  
PCIe Expansion  
IP Rating  
Operating Temp  
Mounting  
Touchscreen Technology  
LAN Ports  
POE Ports  
Screen Ratio  
Memory  
Operating System  
Board Type  
brand  

1-24 of 29 Items

  1. SR700-X4D IP65 MXM-GPU Military Computer Xeon E-2276ME w/ GPU
    SR700-X4D IP65 MXM-GPU Military Computer Xeon E-2276ME w/ GPU

    Quadro RTX A2000 GPU with DTL38999 connector, 9th Gen Intel® Xeon E-2276ME (6C,4.5Ghz) 

    Key Features:

    • IP65 MXM-GPU MIlitary Computer 
    • MIL-STD 810 Thermal, shock, vibration, Humidity, EMI 
    • Quadro® RTX A2000 (CUDA 2560, GDDR6-8GB) ; Options for GTX1050 Ti
    • 9th Gen Intel® Xeon E-2276ME (6C,4.5Ghz) 
    • Up to DDR4-64GB, Options for DDR4-128GB
    • 9V to 36V DC, Options for MIL-STD-461 18V~36V
    • Extended operating temp. -40°C to 60°C
    • Dimension : 360 x 230 x 86 mm (WxDxH)
  2. IB4-271 Long Life Cycle Thin Mini-ITX Motherboard
    IB4-271 Long Life Cycle Thin Mini-ITX Motherboard

    Giada IB4-271, a slim Mini-ITX motherboard featuring Elkhart Lake Celeron J6412 with a 10W TDP, is aligned with Intel® IOTG's roadmap, ensuring a 7+ years lifespan and notable performance enhancements.

    Key Features:

    • Elkhart Lake platform delivers up to 1.7x improvement in single-thread and 1.5x improvement in multi-thread performance.
    • Three display outputs (DP, HDMI, LVDS) with 4K support via HDMI (4096 x 2160 @60 Hz) and DP (4096 x 2160 @60 Hz) powered by Intel® UHD Graphics.
    • Wi-Fi 5/6 support for high-speed data transfer and seamless connectivity to various peripherals.
    • Fanless design with a passive thermal cooling system reduces failure rates, ensuring noise-free and dustproof operation for mission-critical applications.
  3. AV800-D27-A45S4 IP65 Military Server Xeon D-2796NT w/ GPU
    AV800-D27-A45S4 IP65 Military Server Xeon D-2796NT w/ GPU

    Designed to meet MIL-810, MIL-461 EMC/EMI, IP65 Sealed with External Cooling Blade

    Key Features:

    • Ultra High-Performance Intel Xeon Ice Lake-D, D-2796NT (20xCores)
    • NVIDIA MXM-GPU Quadro RTX4500 5888 CUDA
    • MIL-STD 810 Thermal, Vibration, Shock, Humidity
    • 1x 25GbE SFP28, 1x10GbE, 2x 1GbE LAN
    • Up to 512GB LRDIMM/256GB RDIMM
    • 2x NVMe PCIe Gen 4.0 U.2
    • Dual Removable Anti-Drop Solid-State Disk
    • IP65 Sealed with External Cooling Blade
    • MIL-STD-810 Thermal, Shock, Vibration, Humidity
    • MIL-STD 461 EMI/EMC 18V~36V DC-IN(28VDC)
    • Extreme Temperature Support -20~+60°C
  4. Neu-X303mini Edge Computing System 12th Gen CPU
    Neu-X303mini Edge Computing System 12th Gen CPU

    12th Gen. Core CPU, 4 x 4K@60Hz display output, DP, HDMI 2.1, 2 x USB 3.2 Type-C, Dual 2.5G LAN ports, 4 x USB 3.2 and 2 x USB 3.2 Type-C ports for easy connection

    Key Features:

    • 12th Generation Intel Core (Alder Lake - PS) processor SoC
    • Four 4K@60Hz display output, DP, HDMI 2.1 and 2 x USB 3.2 Type-C
    • Dual 2.5G LAN ports, 4 x USB 3.2 and 2 x USB 3.2 Type-C ports for easy connection
    • Onboard M.2 2280 Key M with PCIe signal for storage modules
    • Onboard M.2 2230 Key E for optional Wi-Fi modules
    • Compact design (L: 183mm, W: 137.9mm, H: 47.9mm)
    • 12V DC in
  5. NISE-70 Celeron/Core Fanless System
    NISE-70 Celeron/Core Fanless System

    Intel Celeron 6305E Processor Dual Core Fanless System

    Key Features:

    • Onboard Intel Celeron 6305E Processor
    • 4 x HDMI
    • 3 x USB 3.0, 1 x USB 2.0
    • 1 x RS232/422/485, 1 x RS232
    • 3 x GbE LAN ports; support WoL, teaming and PXE
    • Onboard TPM 2.0 chip
    • 1 x M.2 socket for storage/4G LTE/5G modules
    • 1 x mini-PCIe socket support optional mSATA/Wi-Fi/BT/4G LTE module
    • Support operating temperature from-5 to 55 Celsius degree
    • Support+12V to 24VDC input; support ATX power mode
  6. NDiS-B561 12th Gen Fanless Edge PC PoE Option
    NDiS-B561 12th Gen Fanless Edge PC PoE Option

    Visual Edge PC 12th Gen Core Processor -20~60°C 1 x HDMI 2.1 2 x HDMI 2.0 8 x USB 3.2 4 x COM

    Key Features:

    • Support 12th Gen Intel Core i9/i7/i5/i3 LGA socket type embedded processor, up to 35W
    • Intel Q670E
    • Intel integrated UHD graphic engine driven by Xe architecture
    • Support 3 independent 4K2K@60Hz display outputs. HDMI 2.1 resolution can be up to 8K@60Hz
    • 1 x HDMI 2.1, 2 x HDMI 2.0
    • 8 x USB 3.2, 4 x COM,
    • 1 x GbE LAN, 2 x 2.5G GbE LAN (PoE for B561-PoE)
    • Support M.2 Key B/E/M
    • Support extended temperature -20~60°C (B561 only)
    • Fanless design
  7. eBOX671B Fanless Embedded System with 13th/12th Gen
    eBOX671B Fanless Embedded System with 13th/12th Gen

    eBOX671B Fanless Embedded System 13th/12th Gen Intel® Core™ 2.5GbE M.2 Key M&E&B USB3.2

    Key Features:

    • 13th/12th Gen Intel Core i9/i7/i5/i3 and Celeron
    • processors with Intel R680E chipset (Alder Lake S)
    • Dual DDR5 SO-DIMM for up to 64GB of memory
    • 4 LAN with optional PoE supported
    • Dual 2.5" SATA HDD drive bays with RAID 0 & 1
    • Supports MXM 3.1 Type A, up to 5 display outputs
    • -40 °C to +65 °C wide operating temperatures
    • Wide range power input from 9 to 36 VDC
    • Flexible I/O window supported via mPCIe modules
  8. eBOX630A Fanless Embedded System with 11th Gen Core
    eBOX630A Fanless Embedded System with 11th Gen Core

    Fanless Embedded System with 11th Gen Intel Core i7/i5/i3 or Celeron Processor, 2 HDMI, 1 DisplayPort, 3 LANs, 6 USB, 4 COM, and 9 to 48 VDC

    Key Features:

    • 11th gen Intel Core i7/i5/i3 or Celeron Quad-core ULT processor (Tiger Lake UP3)
    • Dual-channel DDR4-3200 SO-DIMM for up to 64GB of memory
    • Supports 3x 2.5 GbE, 6 USB, 4 COM
    • -40°C to +60°C wide operating temperatures
    • 9 to 48 VDC wide range DC power input
    • Supports triple displays with 2 HDMI, and 1 DisplayPort++
    • Intel Iris Xe integrated graphics (i7 & i5 SKUs)
    • Trusted platform module (TPM 2.0 onboard)
  9. NDiS-B560 8/9th Gen Fanless Embedded PC
    NDiS-B560 8/9th Gen Fanless Embedded PC

    Wide Temp Fanless Embedded PC - 8th/9th Gen Intel Core - 3 x HDMI

    Key Features:

    • Support 9th and 8th Gen Intel Core i9/i7/i5/i3 LGA socket type embedded processor, up to 35W
    • Intel integrated UHD 630 graphic engine
    • Support 3 x independent 4K2K 60Hz display output
    • 3 x HDMI 2.0, 6 x USB 3.0, 2 x GbE LAN, 4 x COM, 1 x Line-out, 1 x Mic-in
    • Support M.2 Key B/E/M
    • Fanless design
    • Support extended temperature -20~60°C
  10. NDiS-B338 Fanless Embedded PC Celeron J6412
    NDiS-B338 Fanless Embedded PC Celeron J6412

    Slim/fanless player with extended temperature durability, HDMI display, USB 3.0 ports, and a RS232/RS422/RS485 interface

    Key Features:

    • Intel Celeron J6412 processor
    • Support 3 x HDMI 2.0 output
    • Support 12V~24V DC input
    • Compact and slim design (H: 38.8mm)
    • 2 x DDR4 up to 32G
    • 1 x M.2 2280 Key M for optional storage device
    • 1 x M.2 3042/3052 Key B for optional LTE or 5G modules
    • 1 x mini-PCIe for optional Wi-Fi and LTE
    • Fanless design
  11. eBOX671-521-FL Fanless Embedded System 9th/8th Gen
    eBOX671-521-FL Fanless Embedded System 9th/8th Gen

    Fanless Embedded System with LGA1151 9th/8th Gen Intel® Core™ i7/i5/i3 & Celeron® Processor, 4-CH PoE and MXM 3.1 Type A

    Key Features:

    • 9th/8th gen Intel Core i7/i5/i3 & Celeron with Intel Q370 chipset (Coffee Lake/Coffee Lake Refresh-S)
    • 4-CH PoE (IEEE802.3at compliance)
    • Dual swappable 2.5" SATA HDD drive bays with RAID 0 &1
    • Supports MXM 3.1 type A graphics module (optional)
    • DVI-I, HDMI, and DisplayPort with triple-view supported
    • AMS.AXView intelligent remote monitoring software for IIoT
  12. TANK-880-Q370 High-Performance 8th/9th Gen PC
    TANK-880-Q370 High-Performance 8th/9th Gen PC

    Ruggedized Fanless embedded system with Intel®  i7-9700TE  1.8GHz, (up to 3.8GHz, 8-core, TDP 35W), 8GB DDR4 pre-installed memory, 1 x PCIe by 16 & 2 x PCIe by 4 & 1 x PCIe by 1 expansion, HDMI/DP, 9~36V DC, RoHS

    Key Features:

    • 8th/9th Gen Intel Core processor platform with Intel® Q370 chipset and DDR4 memory
    • Dual independent displays with high-resolution support
    • Rich high-speed I/O interfaces
    • On-board internal power connector for providing power to add-on cards
    • Four accessible 2.5” HDD/SSD SATA 6 Gb/s bay (with RAID 0/1/5/10 support)
    • Great flexibility for hardware expansion
Page
per page