NDiS-B360 - 11th Gen Core Slim Wide Temp Embedded Computer

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Brand: Nexcom

11th Gen Core Wide Temp -20~60°C embedded PC


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CPU Support Onboard 11th Generation Intel® Core™ i3-1115G4E Processor, Dual Core, 2.2 GHz base Frequency, 6M Cache (Formerly Tiger Lake-UP3 )
Onboard 11th Generation Intel® Core™ i5-1145G7E Processor, Dual Core, 1.5 GHz base Frequency, 8M Cache (by Request)
On board 11th Generation Intel® Core™ i7 1185G7E Processor Quad Core,
1.8 GHz base Frequency, 12M Cache (by Request)
Chipset SoC (codenamed Tiger Lake-UP3)
Main Memory 1 x 260-pin DDR4 SO-DIMM, supports non-ECC, un-buffered memory up to 32G
Graphics & Display

Intel® UHD Graphics 630 on i3 processor

Intel® Iris® Xe Graphics on i5 processor

1 x DP++, support 4096 x 2304 @ 60Hz

1 x HDMI 2.0, support 4096 x 2160 @ 60Hz

I/O Interface-Front 1 x Power button1 x Line out1 x COM (RS232)
I/O Interface-Rear 1 x 12V DC Jack2 x RJ45 Intel Gigabit LAN port
- 1 x Intel® I219-LM GbE PHY
- 1 x Intel® I210-AT GbE LAN
1 x DP++1 x HDMI 2.04 x USB 3.01 x COM (RS232/422/485)
I/O Interface-Internal

4 x USB 2.0 internal pin header

1 x Mic-in connector

1 x Speaker out with 2W/4Ω amplifier, internal connector

8 x GPIO pin header for 4x GPI and 4x GPO

1 x 4-pin connector for PWM Smart FAN

1 x 12V, 2A power output coming from the main power source to additional module use

1 x eDP, support 4096 x 2160 @ 60Hz

TPM2.0: optional feature by request

Storage 1 x M.2 2242/2280 Key M, support PCIex4, SATA signal
Expansion 1 x M.2 2230 Key E, support optional Wi-Fi modules
Power Supply

1 x External 65W AC/DC power adapter

Input: 100VAC to 240VACOutput: DC+12VDC

Environment Operating temperature: -20°C to 60°CStorage temperature: -20°C to 80°CHumidity: 10 to 90% (non-condensing)
Certification CE ApprovalFCC Class A
Dimensions 200mm (W) x 132.6mm (D) x 36mm (H)
Operating System Support Win 10/Linux