eBOX671B Fanless Embedded System with 13th/12th Gen
eBOX671B Fanless Embedded System 13th/12th Gen Intel® Core™ 2.5GbE M.2 Key M&E&B USB3.2
Key Features:
- 13th/12th Gen Intel Core i9/i7/i5/i3 and Celeron
- processors with Intel R680E chipset (Alder Lake S)
- Dual DDR5 SO-DIMM for up to 64GB of memory
- 4 LAN with optional PoE supported
- Dual 2.5" SATA HDD drive bays with RAID 0 & 1
- Supports MXM 3.1 Type A, up to 5 display outputs
- -40 °C to +65 °C wide operating temperatures
- Wide range power input from 9 to 36 VDC
- Flexible I/O window supported via mPCIe modules
The eBOX671B Fanless Embedded System supports a wide variety of processors on the LGA1700 socket from Intel® Core i9™ to Celeron® configurations available. Capable of up to 64GB of DDR5 system memory across dual sockets alongside four GbE LAN connectors (with PoE available). A variety of M.2 interfaces allow for additional network features like Wi-Fi 6E and 5G to be added. Capable of operating in tempretures between,-40°C and +65°C.
Key Features:
- 13th/12th Gen Intel® Core™ i9/i7/i5/i3 and Celeron®
- processors with Intel® R680E chipset (Alder Lake S)
- Dual DDR5 SO-DIMM for up to 64GB of memory
- 4 LAN with optional PoE supported
- Dual 2.5" SATA HDD drive bays with RAID 0 & 1
- Supports MXM 3.1 Type A, up to 5 display outputs
- -40 °C to +65 °C wide operating temperatures
- Wide range power input from 9 to 36 VDC
- Flexible I/O window supported via mPCIe modules
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Standard Color |
Silver |
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Construction |
Aluminum extrusion and heavy-duty steel, IP40 |
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CPU |
LGA1700 socket 13th/12th Gen Intel® Core™ i9/i7/i5/i3 & Celeron® processor (35W/65W) |
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System Memory |
2 x 262-pin DDR5-4800 SO-DIMM, up to 64GB |
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Chipset |
Intel® R680E |
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BIOS |
AMI |
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System I/O Outlet |
Front side 2 x HDMI 1.4b (1 x lockable) 1 x DisplayPort 1.4a 2 x DisplayPort 1.4a via optional MXM kit 2 x USB 3.2 Gen1 1 x Power button 1 x Remote switch 1 x Front access SIM slot with cover (for M.2 Key B) 1 x Reset switch connector 3 x Antenna opening 1 x Audio (MIC-in/Line-out); by request |
Rear side 4 x USB 3.2 Gen2 3 x 2.5 GbE (Intel® i226-IT)* 1 x GbE LAN (Intel® i219-LM)* 2 x RS-232/422/485 with autoflow 2 x RS-232 1 x Phoenix type VDC power input connector 1 x Flexible IO window (Default: 2 x DB9 half-cut bracket) 1 x Grounding screw 2 x Antenna opening |
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Watchdog Timer |
255 levels, 1 to 255 sec. |
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Storage |
2 x 2.5" SATA HDD/SSD (up to 15 mm height; RAID 0,1 supported) 1 x NVMe by M.2 Key M 2280 1 x mSATA (enable in BIOS setting) |
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Expansion Interface |
1 x Full-size PCI Express Mini Card slot (USB 2.0 + PCIe + SIM + mSATA signal) 1 x M.2 Key M 2280 socket (for storage) 1 x M.2 Key E 2230 socket (for Wi-Fi 6E) 1 x M.2 Key B 3052 socket (for 5G) 1 x Internal SIM slot for PCIe Mini Card slot 1 x MXM3.1 type A connector |
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TPM |
TPM 2.0 |
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System Indicator |
1 x Green LED for system power 1 x Orange LED for HDD active 4 x Programmable Green LED |
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Power Input |
9 to 36 VDC with ACC ignition |
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Operating Temperature |
Without MXM module: -40°C to +65°C (-40°F to +140°F) (with W.T. DRAM & SSD, CPU TDP 35W) -40°C to +55°C (-40°F to +122°F) (with W.T. DRAM & SSD, CPU TDP 65W) With MXM module: -40°C to +55°C (-40°F to +122°F) (with W.T. DRAM & SSD & MXM kit, CPU TDP 35W) |
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Humidity |
10% - 90%, non-condensing |
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Shock Vibration |
IEC 60068-2-27 (w/ SSD: 50G, half-sine, 11 ms duration) |
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Vibration Endurance |
IEC 60068-2-64 (w/ SSD: 3Grms STD, random, 5 - 500 Hz, 1 hr/axis) |
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Package Vibration |
MIL-STD-810G 514.6C-II compliance |
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Dimensions |
280 mm (11.02") (W) x 210 mm (8.26") (D) x 80.5 mm (3.16") (H) |
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Weight (net/gross) |
4.9 kg (10.8 lb)/7 kg (15.43 lb) |
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Certifications |
CE, FCC Class A, UKCA |
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EOS Support |
Win 10 IoT, Win 11 IoT, Linux |
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* 4 PoE by request (PoE IEEE802.3at, up to 60W) |
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