SR700-X4D IP65 MXM-GPU Military Computer Xeon E-2276ME w/ GPU

In stock
SKU
SR700-X4x

Quadro RTX A2000 GPU with DTL38999 connector, 9th Gen Intel® Xeon E-2276ME (6C,4.5Ghz) 

Key Features:

  • IP65 MXM-GPU MIlitary Computer 
  • MIL-STD 810 Thermal, shock, vibration, Humidity, EMI 
  • Quadro® RTX A2000 (CUDA 2560, GDDR6-8GB) ; Options for GTX1050 Ti
  • 9th Gen Intel® Xeon E-2276ME (6C,4.5Ghz) 
  • Up to DDR4-64GB, Options for DDR4-128GB
  • 9V to 36V DC, Options for MIL-STD-461 18V~36V
  • Extended operating temp. -40°C to 60°C
  • Dimension : 360 x 230 x 86 mm (WxDxH)
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Introduction

The SR700-X4D rugged system is a high-performance computing solution equipped with a 9th Gen Intel® Xeon® / Core™ processor that features up to 6 cores and operates with a power-efficient TDP of 45W/25W, coupled with an onboard chipset. This configuration ensures an impressive level of CPU performance.

The system utilizes a Processor Core i7-9850HE in combination with the Intel® CM246 chipset, delivering impressive clock speeds of up to 4.40GHz. Notably, the SR700-X4D stands out for its remarkable versatility, allowing for easy CPU and GPU upgrades without being restricted by limited space or power constraints within its chassis.

In addition to its robust design and exceptional functionality, the SR700-X4D is built to meet stringent MIL-STD-810 and IP65 protection standards. This makes it highly adaptable to challenging environmental conditions, including dust, humidity, shock, vibration, extreme temperatures, and electromagnetic interference.

The SR700-X4D is the ideal solution for military applications, including defence, marine navigation, and aviation technology. Its rugged construction ensures it can withstand and thrive in the most demanding environments, with the ability to operate effectively within a wide temperature range, from -40 to 60℃.

 

Features

  • X1 : DC-IN with DTL38999 connector
  • X2 : 2 x USB2.0 with DTL38999 connector 
  • X3 : 1 x 1GbE LAN with DTL38999 connector 
  • X4 : 1 x 1GbE LAN with DTL38999 connectors
  • X5 : 1 x RS232/485 with DTL38999 connector
  • X6 : 1 x mDP with DTL38999 connector​​

 

Thermal Solution for Fanless System Design

7StarLake's stack rack series features a distinctive design that seamlessly combines horizontal and vertical placement options. To ensure efficient heat dissipation, it employs a dual-sided aluminium heat sink that effectively disperses extreme heat. This design integrates top-notch heat-radiating materials with precision CNC cutting, resulting in an exceptional cooling system.

The fanless cooling method relies on precise calculations to optimize the efficiency of each heat-dissipating component. This superior fanless design ensures silent operation, enhancing mobility flexibility and preventing the intrusion of dust and debris. Moreover, the SR700-X4D model can operate within a wide temperature range, from -40°C to 60°C, guaranteeing ultimate reliability and stability.

 

Wire Rope Vibration Isolator Design for Higher Vibration Resistance

7StarLake has specifically designed a Wire Rope Vibration Isolator for the SR700-X4D model, enhancing the product's ability to withstand high levels of vibration. This Wire Rope Vibration Isolator is particularly popular in military equipment applications due to its capacity to absorb and shield objects from vibration-induced damage along multiple axes. Consequently, it significantly extends the operational lifespan of products exposed to prolonged periods of vibration and vibration shock. Notably, this isolator is a low-maintenance, long-lasting tool that can be easily disengaged when needed. Moreover, Wire Rope Vibration Isolators can endure extreme conditions, including temperature variations, corrosion, radioactivity, extreme dryness, high humidity, and UV radiation exposure.

 

MIL-STD 810 Compliant & Full IP65 Anti-water / Dust Protection

SR, short for Stack & Rack, signifies the capability of our SR series systems to be both stacked and mounted in a rack cabinet. With crucial components like the CPU, memory, and storage devices all soldered directly onto the board, the potential risk of damage from sudden impacts or vibrations is significantly minimized. The MIL-STD tests, mandated by the US government, are designed to replicate the harsh environmental conditions that materials might face.

The SR700-X4D has undergone rigorous field testing to ensure it not only meets but surpasses the stringent MIL-STD810 and IP65 criteria for withstanding extreme temperatures, humidity, shocks, and vibrations. This makes the SR700-X4D exceptionally rugged and reliable. In fact, it boasts complete resistance to dust and water, enhancing its ruggedness. It can ward off dust intrusion, accidental contact, and even water, achieving a Dust Tight rating, which guarantees comprehensive protection against ingress. Even the force of a high-pressure water jet poses no threat to its durability – a true embodiment of ruggedness.

 














▲ Block diagram of MIL-STD-461 test configuration▲ Block diagram of MIL-STD-461 test configuration
▲ Block diagram of MIL-STD-461 test configuration

System

High Power Processor

Intel® Core™ i7-9850HE, 45W, Coffee Lake 9th Gen, 6C, Freq. 2.7/4.4 GHz, 9M Cache, 

Intel® Core™ i7-9850HL, 25W, Coffee Lake 9th Gen, 6C, Freq. 1.9/4.1 GHz, 9M Cache, 

Intel® Xeon® E-2276ME, 45W, Coffee Lake 9th Gen, 6C, Freq. 2.8/4.5 GHz, 12M Cache, 

Intel® Xeon® E-2276ML, 25W, Coffee Lake 9th Gen, 6C, Freq. 2.0/4.2 GHz, 12M Cache

Chipset

CM246

memory type

4 x DDR4 2666 MHz SO-DIMM up to 128GB 

Graphic

Geforce® 1050Ti CUDA 768 GDDR5-4GB Quadro® RTX A2000 CUDA 2560 GDDR6-8GB 

Ethernet

I219LM +3 x I210iT

Audio codec

ALC887

Power Type

DC-DC 9V~36V, Options for MIL-STD 461 18V~36V DC

Storage

2 x SSD

Expansion slot

M.2

1 x M.2 (M-key, type:2280, SATA/PCIe 3.0x4 NVMe)

Mini-PCI

2 x Full size (PCIe x1,USB 2.0 and micro SIM Card)

Front I/O

X1

DC-IN with DTL38999 connector

X2

2 x USB2.0 with DTL38999 connector 

X3

1 x 1GbE LAN with DTL38999 connector 

X4

1 x 1GbE LAN withDTL38999 connectors

X5

1 x RS232/485 with DTL38999 connector

X6

1 x mDP with DTL38999 connector

Applications, Operating System

Applications

Military Platforms Requiring Compliance to MIL-STD-810 where Harsh Temperature, Shock, Vibration, Altitude, Dust and EMI Conditions.

Operating System

Windows 10 32/64BitUbuntu13.04, Ubuntu13.10, Ubuntu14.04, Fedora 20

Physical

Dimension

360 x 230 x 86 mm (WxDxH)

Weight

8.6 Kg ( 18.9 lbs )

Chassis

Aluminum Alloy, Corrosion Resistant

Heatsink

Aluminum Alloy, Corrosion Resistant

Finish

Anodic aluminium oxide ( Color Iron grey)

Cooling

Natural Passive Convection/Conduction. No Moving Parts.

Connectors

IP65 Waterproof  Connectors

Ingress Protection

IP65

Environmental

Operating Temp.

-40°C to 60°C

Storage Temp.

-40°C to 85°C

Relative Humidity

5% to 95%, non-condensing

MIL-STD-810

Method 507.5, Procedure II ( Temperature & Humidity )

Method 516.6 Shock-Procedure V Non-Operating ( Mechanical Shock )

Method 516.6 Shock-Procedure I Operating ( Mechanical Shock )

Method 514.6 Vibration Category 24/Non-Operating ( Category 20 & 24, Vibration )

Method 514.6 Vibration Category 20/Operating ( Category 20 & 24, Vibration )

Method 501.5, Procedure I ( Storage/High Temperature )

Method 501.5, Procedure II ( Operation/High Temperature )

Method 502.5, Procedure I ( Storage/Low Temperature )

Method 502.5, Procedure II ( Operation/Low Temperature )

Method 503.5, Procedure I ( Temperature shock )

Reliability

No Moving Parts; Passive Cooling.Designed and manufactured using ISO 9001 / 2000 Certified Quality Program.

MIL-STD-461

CE102  :   10 KHz - 10 MHzRE102-4 : 1.5 MHz -30 MHz - 5 GHzRS103 :    200 MHz - 3.0 GHz - 5.0 GHz, 50 V/m equal for all frequencies

Green Product

RoHS, WEEE compliance