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73-96 of 100 Items

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  1. AIE100-ONX Fanless Edge AI System w/ NVIDIA Jetson Orin NX SoM
    AIE100-ONX Fanless Edge AI System w/ NVIDIA Jetson Orin NX SoM

    Fanless Edge AI System with NVIDIA Jetson Orin NX SoM, 1 x HDMI, 1 x GbE LAN, 1 x GbE PoE and 2 x USB, Remote Management Service Empowered by Allxon

    Key Features:

    • NVIDIA Jetson Orin NX with 1024-core NVIDIA Ampere GPU
    • High AI computing performance for GPU-accelerated processing
    • Ideal for edge AI smart city applications
    • Supports one 15W GbE PoE for camera
    • Wide operating temperature from -30°C to +50°C
    • JetPack supported
    • Supports 24/7 secure remote monitoring, control, and OTA deployment empowered by Allxon
  2. AIE900A-AO Fanless Edge AI System w/ NVIDIA Jetson AGX Orin
    AIE900A-AO Fanless Edge AI System w/ NVIDIA Jetson AGX Orin

    Fanless Edge AI System with NVIDIA Jetson AGX Orin, 2 2.5GbE, 8 PoE, and 2 COM/CAN for 5G and Robotics Applications

    Key Features:

    • NVIDIA Jetson AGX Orin with 1792-core NVIDIA Ampere GPU
    • 1 M.2 Key B slot for 5G/LTE, 1 M.2 Key E slot for Wi-Fi 6(E)
    • 24 VDC with ignition power control
    • Supports eight PoE for IP cameras and LiDAR connectivity
    • -30°C to +50°C operating temperature range
    • Supports device management and optional OTA deployment powered by Allxon
  3. NISE-70 Celeron/Core Fanless System
    NISE-70 Celeron/Core Fanless System

    Intel Celeron 6305E Processor Dual Core Fanless System

    Key Features:

    • Onboard Intel Celeron 6305E Processor
    • 4 x HDMI
    • 3 x USB 3.0, 1 x USB 2.0
    • 1 x RS232/422/485, 1 x RS232
    • 3 x GbE LAN ports; support WoL, teaming and PXE
    • Onboard TPM 2.0 chip
    • 1 x M.2 socket for storage/4G LTE/5G modules
    • 1 x mini-PCIe socket support optional mSATA/Wi-Fi/BT/4G LTE module
    • Support operating temperature from-5 to 55 Celsius degree
    • Support+12V to 24VDC input; support ATX power mode
  4. NDiS-B338 Fanless Embedded PC Celeron J6412
    NDiS-B338 Fanless Embedded PC Celeron J6412

    Slim/fanless player with extended temperature durability, HDMI display, USB 3.0 ports, and a RS232/RS422/RS485 interface

    Key Features:

    • Intel Celeron J6412 processor
    • Support 3 x HDMI 2.0 output
    • Support 12V~24V DC input
    • Compact and slim design (H: 38.8mm)
    • 2 x DDR4 up to 32G
    • 1 x M.2 2280 Key M for optional storage device
    • 1 x M.2 3042/3052 Key B for optional LTE or 5G modules
    • 1 x mini-PCIe for optional Wi-Fi and LTE
    • Fanless design
  5. eBOX710A Fanless Embedded System 11th/10th Gen
    eBOX710A Fanless Embedded System 11th/10th Gen

    Fanless Embedded System with LGA1200 Socket 11th/10th Gen Intel Core i9/i7/i5/i3 or Celeron Processor, Intel H420E, HDMI, DisplayPort, 6 USB, 4 LAN, PCIe x4 slot, and 9 to 48 VDC

    Key Features:

    • 10th/11th gen Intel Core i9/i7/i5/i3 or Celeron processor up to 65W
    • 4 GbE LAN and 4 COM ports
    • Dual 2.5" SATA HDD drive bays
    • 2 HDMI and 1 DisplayPort with dual view supported
    • -40 °C to +70 °C wide operating temperatures
    • Wide range power input from 9 to 48 VDC
    • 1 PCIe x4 slot for I/O card
    • Flexible I/O window slot for mPCIe modules
  6. ICO120-E3350 DIN-rail Fanless Embedded System Celeron N3350
    ICO120-E3350 DIN-rail Fanless Embedded System Celeron N3350

    DIN-rail Fanless Embedded System with Intel Celeron Processor N3350, COM/CAN/DIO, 2 LAN, 2 USB, and HDMI

    Key Features:

    • Extreme cost-effective with fanless and cableless design
    • Intel Celeron processor N3350, reliable F1 stepping version CPU
    • COM/CAN/DIO, 2 USB, and 2 GbE LAN
    • Wide operating temperature range from -40°C to +70°C
    • 9 to 36 VDC wide range power input (typical: 12-24 VDC)
    • OVP, UVP, OCP, RPP power protection design
    • eAPI for intelligent remote monitoring software integration
  7. eBOX630A Fanless Embedded System with 11th Gen Core
    eBOX630A Fanless Embedded System with 11th Gen Core

    Fanless Embedded System with 11th Gen Intel Core i7/i5/i3 or Celeron Processor, 2 HDMI, 1 DisplayPort, 3 LANs, 6 USB, 4 COM, and 9 to 48 VDC

    Key Features:

    • 11th gen Intel Core i7/i5/i3 or Celeron Quad-core ULT processor (Tiger Lake UP3)
    • Dual-channel DDR4-3200 SO-DIMM for up to 64GB of memory
    • Supports 3x 2.5 GbE, 6 USB, 4 COM
    • -40°C to +60°C wide operating temperatures
    • 9 to 48 VDC wide range DC power input
    • Supports triple displays with 2 HDMI, and 1 DisplayPort++
    • Intel Iris Xe integrated graphics (i7 & i5 SKUs)
    • Trusted platform module (TPM 2.0 onboard)
  8. ACS10-TGU 11th Gen Intel Fanless Compact System
    ACS10-TGU 11th Gen Intel Fanless Compact System

    Compact and easy to set up, highly expandable I/O interfaces and flexible storage design, and supports high-resolution graphics

    Key Features:

    • 11th Gen Intel Core i5/i3 Tiger Lake-UP3 Processor
    • Intel Iris Xe/ UHD Graphics Engine
    • 1-260-pin DDR4 3200MHz SO-DIMM, Supports Up to 32GB
    • 2-Gigabit Ethernet, 1 x 2.5GbE, 1 x 1GbE
    • 2-COM Port (RS-232/422/485 & RS-232)
    • 2-Audio Jack (Line-Out & Mic-In)
    • 2-Storage (M.2 Key-M NVMe & M.2 Key-B SATA)
    • 2-Expansion Slot (M.2 Key-E, Key-B)
    • 6-USB Port (3-USB 3.2 & 3-USB 2.0)
    • CE, FCC Class A, UKCA
  9. EPD-2501 Public Information e-Ink Display
    EPD-2501 Public Information e-Ink Display

     

    Onboard Intel Celeron SoC BGA Processor N3350

     

    Key Features: 

    • 25.3” E Ink Black/White/Red/Yellow
    • 25.3” E Ink Gallery Plus Full colour 55K (Typ.)
    • ​25.3" E Ink Kaleido with colour 4096
    • Onboard Intel® Celeron® SoC BGA Processor N3350
    • DDR3L 1866MTs SO-DIMM up to 8GB,
    • 2.5” SATA3 SSD 64GB  
    • 2 x HDMI, 1 x COM, 2 x LAN, 4 x USB 3.1(Gen1)
    • Front Cover Glass, Optional PMMA, support IP54
    • Super Slim Bezel Design
    • E Ink SDK / API support
    • Optional WiFi Module
    • Operating Temp 0~40C
  10. ICO520 Fanless Embedded System 12th Gen i7/i5/i3
    ICO520 Fanless Embedded System 12th Gen i7/i5/i3

    Axiomtek ICO520 DIN-Rail Fanless Embedded-System 12th-Gen Intel®-Core™ 4x2.5GbE, 4xIsolated-COM, Isolated DIO (8-in/8-out)

    Key Features:

    • High performance with fanless and DIN-rail design
    • 12th Gen Intel® Core™ i7/i5/i3 or Celeron® processor (Alder Lake-P)
    • 4 isolated COM, isolated DIO (8-in/8-out), 4 2.5 GbE LAN
    • Wide operating temperature range from -40°C to +70°C
    • 9 to 36 VDC, typical 12-24V power input with OVP, UVP, OCP, RPP
    • Supports TPM 2.0
    • Supports cold boot at -40°C
  11. NUC-APL Fanless NUC System J3455/N3350
    NUC-APL Fanless NUC System J3455/N3350

    Intel Apollo Lake Celeron Processor J3455/N3350 Up to 8GB DDR3

    Key Features:

    • Onboard Intel Celeron Processor J3455/N3350
    • Single DRAM Socket, Max. Up to 8GB DDR3 1866MHz
    • Rich I/O, 2 x COM, 2 x LAN, 4 x USB3.0, 1 x Audio, 2 x Antennal Mounting
    • Triple Display, 2 x HDMI, 1 x DP (DVI-I/VGA Factory Option)
    • Expansion Slot,  M.2 Key-B,  M.2 Key-E
    • Fanless Operating from 0°C ~ 60°C
    • DC Power Input +12V
    • Compact Size, 115mm x 111mm x 58mm
    • Supports VESA/Din-Rail Kit
    • TPM 2.0 (Factory Option)
  12. NUC-APL-SLIM Fanless NUC Slim System J3455/N3350
    NUC-APL-SLIM Fanless NUC Slim System J3455/N3350

    Intel Apollo Lake J3455/N3350 Up to 8GB DDR3

    Key Features:

    • Onboard Intel Celeron Processor J3455/N3350
    • Single DRAM Socket, Max. Up to 8GB DDR3 1866MHz
    • Rich I/O, 1 x COM, 2 x HDMI, 2 x LAN, 4 x USB3.0, 1 x Audio, 2 x Antennal Mounting
    • Expansion Slot,  M.2 Key-B,  M.2 Key-E
    • Fanless Operating from 0°C ~ 50°C
    • DC Power Input +12V
    • Compact Size, 115mm x 111mm x 45mm
    • Supports VESA/Din-Rail Kit
    • TPM 2.0 (Factory Option)
  13. EMS-TGL Fanless Rugged Embedded System 11th Gen
    EMS-TGL Fanless Rugged Embedded System 11th Gen

    11th Gen. Core i7/i5/i3 BGA Processor, Rich I/O, support 5G module, fanless operation temperature -40°C ~ 70°C

    Key Features:

    • On board 11th Gen. Intel Core i7/i5/i3 BGA Processor
    • 2x 260-pin SODIMM socket Max. up to 64GB DDR4 3200MT/s
    • Rich I/O, 4-USB3.1, 1-DP, 1-HDMI, 2-COM, 2-LAN, 1-8bit GPIO.
    • Support 5G (Sub-6G) module, M.2 NVMe SSD Gen. III x 4, HDMI 2.0b (4K @ 60Hz), LAN 2.5G BaseTx GbE
    • Fanless operation temperature from -40°C ~ 70°C (WT) / 0°C ~ 70°C (ST)
    • CE, FCC Class B, IP50
    • Wide range DC power input from +9~32V
    • Support HW TPM 2.0
    • Support vPro
  14. AIE100-ONA Fanless Edge AI System with NVIDIA Jetson Orin Nano SoM
    AIE100-ONA Fanless Edge AI System with NVIDIA Jetson Orin Nano SoM

    Axiomtek AIE100-ONA Fanless NVIDIA® Jetson Orin™ Nano SoM, 1 HDMI, 1 GbE LAN, 1 GbE PoE, and 2 USB, Allxon Remote Management

    Key Features:

    • NVIDIA® Jetson Orin™ Nano, up to 1024-core NVIDIA Ampere GPU
    • High AI computing performance for GPU-accelerated processing
    • Ideal for edge AI smart city applications
    • Supports one 15W GbE PoE for camera
    • Wide operating temperature from -20°C to +50°C
    • JetPack supported
    • Supports 24/7 secure remote monitoring, control, and OTA deployment empowered by Allxon
  15. Neu-X303mini Edge Computing System 12th Gen CPU
    Neu-X303mini Edge Computing System 12th Gen CPU

    12th Gen. Core CPU, 4 x 4K@60Hz display output, DP, HDMI 2.1, 2 x USB 3.2 Type-C, Dual 2.5G LAN ports, 4 x USB 3.2 and 2 x USB 3.2 Type-C ports for easy connection

    Key Features:

    • 12th Generation Intel Core (Alder Lake - PS) processor SoC
    • Four 4K@60Hz display output, DP, HDMI 2.1 and 2 x USB 3.2 Type-C
    • Dual 2.5G LAN ports, 4 x USB 3.2 and 2 x USB 3.2 Type-C ports for easy connection
    • Onboard M.2 2280 Key M with PCIe signal for storage modules
    • Onboard M.2 2230 Key E for optional Wi-Fi modules
    • Compact design (L: 183mm, W: 137.9mm, H: 47.9mm)
    • 12V DC in
  16. ATC3520-IP7-4C/AI4CR NVIDIA Jetson Orin Nano
    ATC3520-IP7-4C/AI4CR NVIDIA Jetson Orin Nano

    Discover the ATC3520-IP7-4C/AI4CR: Your Edge AI computing solution with NVIDIA Jetson Orin Nano, IP67 design, and certifications for industrial needs.

    Key Features:

    • Edge AI in-vehicle/rail computer
    • Built-in NVIDIA Jetson Orin Nano SOM, up to 40(sparse) INT8 TOPS
    • 4-Port GbE PoE+ for IP CAM/LiDAR sensors
    • HEVC/H.265 hardware CODEC, 11x 1080p30 compute power (decoded)
    • Wide range operating temperature of -30~70°C
    • Rugged, fanless design with an IP67 rating
    • Ultra-speed PCIe 4.0 x4 NVMe SSD for data integrity
    • NEXCOM Acceleration Linux (NAL) OS w/ JetPack 5.1.1 integrated
    • Expansible for LTE/5G NR & Wi-Fi 5/6
    • 9~36V DC-in with ignition control & OCP/OVP
    • CE/FCC, UKCA, Emark/EN50155 certified
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