Find Your Technical Solution Below
Tekdis products are categorised into the groups below. Once you select the correct category use the filters to locate the best product for your application.
Depending on the category there are numerous filters to help you identify the ideal solution. If you have other questions or requests we are always available via phone or email and will aim to respond within the hour.
Tekdis can "build to order" a complete solution including Operating System and SSD imaging so systems will be preconfigured out of the box.
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IMB760 EATX Motherboard Xeon scalable 4 PCIe x16, 2 PCIe x8, VGA, NVMe, and IPMIEATX Motherboard with Dual LGA4189 Socket 3rd Gen Intel Xeon Scalable Processors, Intel C621A/C627A, 4 PCIe x16, 2 PCIe x8, VGA, NVMe, and IPMI
Key Features:
- Dual 3rd gen Intel® Xeon® Scalable processors (Ice Lake-SP)
- 16 288-pin DDR4-3200 RDIMM for up to 1TB of memory
- 4 PCIe x16 and 2 PCIe x8
- Supports 2 M.2 Key M slots for NVMe with RAID 0 & 1
- Supports TPM 2.0 module (optional)
- Two 10GbE ports
- IPMI (optional)
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AFL3-W19C-ULT5 PoE Panel PCWide 18.5”250 cd/m² 1366x768 Panel PC with Intel® 14nm 8th Whiskey Lake Core™ i5-8365UE (15W) on-board Processor (ULT) , POE option , 802.11a/b/g/n/ac WiFi module, PCAP touch, 2M camera, microphone,1*4GB DDR4 RAM , with AG, R10
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NDiS-M538 OPS-Based Digital Signage Player 4K2K Resolution 8th GenOPS-Based Digital Signage Platform, 4K2K Resolution Embedded Computer Powered by 8th Gen. Intel® Core™ Processor
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RN28 Fanless 12th Gen Network ApplianceDesigned for efficiency and connectivity, the RN28 features Intel Alder Lake-N processors, robust Gigabit and PoE support, and a fanless design for noise-sensitive environments.
Key Features:
- Powered by Intel Alder Lake-N processors on the Intel 7 process, RN28 offers superior processing power with energy efficiency.
- Processor N100 with 4 Cores and 4 threads, TDP under 15W.
- Robust connectivity with two Gigabit RJ-45 (BYPASS pair on Lan 1-2) and four Gigabit RJ-45 supporting PoE for fast, direct connections.
- Wireless flexibility with support for Wi-Fi 5/6/6E.
- Four RJ45 ports supporting Power over Ethernet (PoE), each capable of delivering up to 30W.
- Simplified network setup by combining data connectivity and power delivery.
- Fanless design is ideal for noise-sensitive environments.
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SSD470P & SSD470P-I 2.5" SATA SSDsPower Loss Protection (PLP) SSD, SATA III 6Gb/s interface and 112-layer 3D NAND flash
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MTE662P & MTE662P-I PCIe M.2 SSDsPCI Express (PCIe) Gen 3 x4 interface, compatible with NVM Express (NVMe) 1.3, 3D NAND technology
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MTE662A PCIe M.2 SSDPCI Express (PCIe) Gen 3 x4 interface and compatible with NVM Express (NVMe), 3D NAND technology
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OPS500-501-H, 7th gen LGA1151 CPU, Intel H110Open Pluggable Specification (OPS) Digital Signage Player with LGA1151 Socket 7th/6th Gen Intel® Core™ i7/i5/i3 & Celeron® Processor and Intel® H110
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BQ612 Mini Desktop PC 12th/13th Gen CPUMini-PC with desktop CPU (12th/13th gen.) and nine USB ports
Key Features:
- Intel LGA1700 Socket 12th/13th Gen. Processors
- 1 x HDMI (Max. 4096 x 2160 @60 Hz)
- 1 x VGA, Optional: 1 x DP
- RTC
- Watchdog Timer
- Chassis Intrusion
- Support NVMe SSD
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SATA III M.2 SSDs MTS560T & MTS560T-IM.2 DRAM-less SSD MTS560T SATA III 6Gb/s interface 3D NAND technology
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NDiS V1000 Multi-Display Fanless Embedded ComputerMulti-Display Embedded Computer Powered by AMD V Series Quad APU Processor
Key Features:
- Onboard AMD V1605B APU processor
- Graphics operating at up to 1.1 GHz
- Dual DDR4 SO-DIMM, up to 32G
- Support 4 x HDMI 2.0 for video wall application
- Support M.2 M Key, 2280/2242 size storage device
- 4 x USB 3.0 support
- M.2 E key slot for optional Wi-Fi module
- 1 x Onboard TPM 2.0 IC
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HID-2334 23.8" Medical Cart Panel PC23.8” Full HD PCAP Multi touch, 7th Generation Intel® Core Kaby Lake i5 Processor, LED reading light bar
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OPS500-501 7th gen LGA1151 i series CPU, Intel Q170Open Pluggable Specification (OPS) Digital Signage Player with LGA1151 Socket 7th/6th Gen Intel® Core™ i7/i5/i3 & Celeron® Processor, Intel® Q170 and Intel® AMT 11.0
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MTE672A PCIe M.2 SSDPCIe M.2 SSD 112-layer 3D NAND flash and a PCI Express (PCIe) Gen 3 x4 interface
Key Features:
- Compliant with RoHS 2.0 standards
- Compliant with NVM Express specification 1.3
- Compliant with PCI Express specification 3.1
- Space-saving M.2 form factor (80mm) – ideal for mobile computing devices
- PCIe Gen 3 x4 interface
- Endurance: 3K P/E cycles (Program/Erase cycles) guaranteed
- Key components fortified by default with Corner Bond technology
- 30µ" PCB gold finger
- Anti-sulfur technology implemented to prevent sulfurization in the environment
- Power Shield (PS) to ensure data transfer integrity and minimize data corruption in the drive during an abnormal power outage
- Promised operational reliability in an extended temperature range (from -20°C to 75°C)
