Find Your Technical Solution Below
Tekdis products are categorised into the groups below. Once you select the correct category use the filters to locate the best product for your application.
Depending on the category there are numerous filters to help you identify the ideal solution. If you have other questions or requests we are always available via phone or email and will aim to respond within the hour.
Tekdis can "build to order" a complete solution including Operating System and SSD imaging so systems will be preconfigured out of the box.
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SCM140 RISC Embedded SMARC v2.1 SoM with Qualcomm QCS6490
RISC Embedded SMARC v2.1 SoM with Qualcomm® QCS6490 Octa-core Processor, up to 2.7GHz
Key Features:
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SMARC 2.1 (82 x 50 mm)
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Qualcomm QCS6490 Octa-core processor
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Qualcomm AI Engine, up to 13 TOPS
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LPDDR4x, up to 8GB
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UFS, up to 128GB
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HDMI1.4
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10/100/1000 Mbps Ethernet
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USB 3.2
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MIPI-CSI
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VTC6231 Atom x7433RE Fanless In-Vehicle Computer
Intel Atom x7433RE Fanless In-Vehicle Computer with E-Mark Conformity
Key Features:
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Intel Atom processor quad-core x7433RE, 1.5GHz
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Eight SIM cards + four WWAN modules support
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Built-in u-blox-M9N GPS, Built-in CAN FD
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1 x External storage (compatible with 9mm disk)
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3 x M.2 + 2 x mPCIe socket expansion
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Wide voltage input 9~36 VDC
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Three video outputs, one VGA, one HDMI, and one DP
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Neu-X60 Palm-sized Fanless Edge Computer
Intel N50 processor, Palm-sized Fanless Edge Computing System
Key Features:
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Intel® Processor N50
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Small footprint in Palm size
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Pre-installed 4G memory
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Pre-installed 64G M.2 storage
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Support 1x Intel I226-V 2.5GbE LAN
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1x HDMI, 1x RS232/422/485, 2x USB3.2
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1x mini PCIe full size for optional wireless module
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Great value for indoor applications
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ATC3750-IP7-WI8MR NVIDIA Jetson AGX Orin Edge AI Computer
NVIDIA Jetson AGX Orin Edge AI Computer for Rail
Key Features:
- Built-in NVIDIA® Jetson AGX Orin™ SOM, up to 200/275 TOPS (INT8)
- Designed to be IP67-rated, rugged, and compact
- 8 MIPI/GMSL2 & 2.5GbE (X-coded) for MIPI CAM/IP CAM/LiDAR
- HEVC/H.265 hardware DECODE, supporting up to 7 x 4K30
- Wide range operating temperature of -25°C~70°C
- Ultra-speed PCIe 4.0 x4 NVMe SSD for data integrity
- Expansible for GNSS, LTE/5G NR & Wi-Fi 5/6
- 24~110VDC w/ isolation, ignition control & OCP/OVP
- NEXCOM Acceleration Linux (NAL) integrated w/ JetPack 5.1.1
- Military standard of MIL-STD-810H for anti-vibration/shock
- CE/FCC, UKCA, EN50155 (EN55011, EN50121-3-2, EN61373, OT3), EN45545-2 certified
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AirLink XR60 Rugged 5G Router
AirLink® XR60, the world’s smallest rugged 5G router is compact yet powerful.
Key Features:
- 4x4 5G + LTE Cat-20
- 2x2 Wi-Fi 6 (optional)
- Dual-Band GNSS
- Single Serial / Single
- Ethernet (1 Gbps) or Dual Ethernet (1 Gbps + 5 Gbps)
- IP64 and MIL-STD-810H Rated
- Powered by AirLink OS and AirLink Complete
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EPD-2501 Public Information e-Ink Display
Onboard Intel Celeron SoC BGA Processor N3350
Key Features:
- 25.3” E Ink Black/White/Red/Yellow
- 25.3” E Ink Gallery Plus Full colour 55K (Typ.)
- 25.3" E Ink Kaleido with colour 4096
- Onboard Intel® Celeron® SoC BGA Processor N3350
- DDR3L 1866MTs SO-DIMM up to 8GB,
- 2.5” SATA3 SSD 64GB
- 2 x HDMI, 1 x COM, 2 x LAN, 4 x USB 3.1(Gen1)
- Front Cover Glass, Optional PMMA, support IP54
- Super Slim Bezel Design
- E Ink SDK / API support
- Optional WiFi Module
- Operating Temp 0~40C
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MTS952P & MTS952P-I SATA III M.2 SSDs
SATA III 6Gb/s interface 3D NAND technology -20°C to 75°C
Key Features:
- Dynamic thermal throttling
- Built-in LDPC ECC (Error Correction Code) functionality
- Advanced Garbage Collection
- Supports S.M.A.R.T. function to conduct health monitoring, analysis, and reporting for storage devices
- TRIM command for better performance
- NCQ command for better performance
- Power-saving DevSleep (Device Sleep) mode
- Compliant with RoHS 2.0 standards
- Space-saving M.2 form factor (80mm) – ideal for mobile computing devices
- DDR3 DRAM Cache embedded
- Endurance: 3K P/E cycles (Program/Erase cycles) guaranteed
- Key components fortified by default with Corner Bond technology
- 30µ" PCB gold finger
- Power Loss Protection (PLP) to prevent data loss in the event of a sudden power outage
- Extended Temp. (-20°C ~ 75°C) and Wide Temp. (-40°C ~ 85°C) options available
- Supports Transcend Scope Pro software
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USD240I microSD Cards
112-layer 3D NAND flash with SLC Mode technology -40℃~85℃ microSDXC memory card
Key Features:
- Built-in LDPC ECC (Error Correction Code) functionality
- Early Move
- Supports S.M.A.R.T. function to conduct health monitoring, analysis, and reporting for storage devices
- Wear-Levelling
- Compliant with RoHS 2.0 standards
- Electrostatic protection (ESD IEC 61000-4-2)
- Compliant with SD specification 6.1
- Compliant with UHS-I
- Compliant with Video Speed Class 30 (V30)
- Compliant with Application Performance Class 2 (A2)
- Endurance: 100K P/E cycles (Program/Erase cycles) guaranteed
- Promised operational reliability in a wide temperature range (from -40°C to 85°C)
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MTE712A & MTE712A-I M.2 SSD
Features the 112-layer 3D NAND flash and the PCI Express (PCIe) Gen 4 x4 interface
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P710 10.4" XGA TFT LCD Railway Touchscreen Monitor
10.4" XGA TFT LCD Railway Touchscreen Monitor (-25°C to +55°C)
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Rheda 220H AIO/MTD 21.5" Multi-Touch Panel PC
Intel® Core i5-6300U, Processor/8GB DDR4/128GB, SSD/PCAP touch/Wi-Fi/2xGLAN/, 4xUSB3.0/2xCOM/19V Adapter
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D210-11KS 21.5" Celeron/Core Panel PC
21.5" Touch Panel PC / Intel® Kabylake ULV Core i
Key Features:
- Industrial-grade 21.5" Full HD TFT LCD with 40,000 backlight lifetime
- True-flat touchscreen with projected capacitive multi-touch control
- Front panel IP65-rated, fanless design
- Support multiple mounting modules(webcam, NFC/RFID, barcode)
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GEOA104AU-OD01-AT Open Frame Touch Display 10.4"
10.4” 230nit, PCAP Touch for Industrial & Digital Signage
Key Features:-
Full control of all relevant display and interface parameters via OSD
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Compliant with safety regulations
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VGA / DVI
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High reliability against humidity, temperature & impact
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Colour of the frame is optimized and the best solution for the environment
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ATC3750-IP7-8M NVIDIA Jetson AGX Orin Edge AI Computer
NVIDIA Jetson AGX Orin Solution Performance Edge AI Computer for Rail
Key Features:
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Built-in NVIDIA Jetson AGX Orin SOM, up to 200/275 TOPS (INT8) performance
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Designed to be IP67-rated, rugged, and compact
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8 MIPI/GMSL2 & 2.5GbE (X-coded) for MIPI CAM/IP CAM/LiDAR sensors
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HEVC/H.265 hardware DECODE, supporting up to 7 x 4K30
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Wide range operating temperature of -25°C~70°C
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Ultra-speed PCIe 4.0 x4 NVMe SSD for data integrity
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Expansible for GNSS, LTE/5G NR & Wi-Fi 5/6
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9~36VDC & 24V rail combined, ignition control & OCP/OVP
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NEXCOM Acceleration Linux (NAL) integrated w/ JetPack 5.1.1
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Military standard of MIL-STD-810H for anti-vibration/shock
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CE/FCC, UKCA, E-mark, EN50155 (EN55011, EN50121-3-2, EN61373, OT3) certified
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PC613 High Performance OPS Player 8K
High-Performance OPS Player, Intel 13th Gen. i3/i5 Onboard, 8K Resolution
Key Features:
- Intel Raptor Lake-U 13th Gen. processors
- JAE support HDMI/DP output 1 x HDMI (4096 x 2160 @60 Hz)
- Support Wi-Fi/BT module
- Optional Intel® vPro® technology
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DDR5-5600 Unbuffered SO-DIMM
Compliant with JEDEC standards, Unbuffered long DIMMs and small outline DIMMs are suitable for embedded desktops
Key Features:
- 1.1V low power supply
- Power management IC (PMIC), high energy efficiency
- On-die ECC
- Burst Length: 16, 32
- 16-bit pre-fetch
- Multi-Purpose Command (MPC)
- Decision Feedback Equalization (DFE)
- SPD Hub with Thermal Sensor
- 100% tested for stability, compatibility and performance
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BM370A-A01 37" 700nit Android Bar Display
Android 7.1, 1920 × 540 Resolution, Full Metal Shell
Key Features:
- ADSDS Panel Technology
- 1920 × 540 Resolution
- 700nits Brightness
- Android 7.1
- Quad Core SoC
- Slim Design
- Full Metal Shell
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USD460T & USD460I microSD Cards
microSD Cards Utilizing top-quality 3D NAND Flash and rated to endure 3K P/E cycles
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ATC3520-IP7-3M NVIDIA Jetson Orin Nano Edge AI Computer
NVIDIA Jetson Orin Nano Accelerated Edge AI Computer for In-Vehicle/Rail
Key Features:
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Built-in NVIDIA® Jetson Orin™ Nano SOM, up to 40(sparse) INT8 TOPS computer
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3-CH MIPI SerDes, 1080p60/4Kp30 over 15m cable for MIPI CAM
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HEVC/H.265 hardware CODEC, 11x 1080p30 compute power (decoded)
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Wide range operating temperature of -30~70°C
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Rugged, fanless design with an IP67 rating
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Ultra-speed PCIe 4.0 x4 NVMe SSD for data integrity
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NEXCOM Acceleration Linux (NAL) OS w/ JetPack 5.1.1 integrated
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Expansible for LTE/5G NR & Wi-Fi 5/6
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9~36V DC-in with ignition control & OCP/OVP
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eBOX671A Fanless Embedded System with LGA1200 Socket 11th/10th Gen
With LGA1200 Socket 11th/10th Gen Intel Xeon, Core i9/i7/i5/i3 or Celeron Processor, Intel W480E, 2 HDMI, DisplayPort, 6 USB, 4 LAN, and 9 to 48 VDC
Key Features:
- LGA1200 11th/10th gen Intel® Xeon®, Core™ i9/i7/i5/i3 or Celeron® with Intel® W480E chipset (Comet Lake-S)
- 4 GbE LAN with optional PoE supported
- Dual 2.5" SATA HDD drive bays with RAID 0 & 1
- 2 HDMI and 1 DisplayPort for triple-view
- -40°C to +70°C wide range operation temperature
- Wide range power input from 9 to 48 VDC
- Flexible I/O window supported via mPCIe modules
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F108D Booksize Fanless Signage Player 4K Display
Compact, fanless Intel Alder Lake-N powered PC for digital signage and kiosks. Features versatile I/O ports, high-quality graphics, and reliable operation in mission-critical scenarios.
Key Features:
- Powered by Intel® Alder Lake-N processors (6-15W) for low-power efficiency.
- Book-size design tailored for digital signage and kiosk applications.
- Rich I/O ports, including dual COM ports, 6 USB Type-A, and dual LAN ports.
- Easily integrates into vending machines, self-service kiosks, and check-in kiosks.
- Intel® UHD Graphics with DP and two HDMI ports supporting resolutions up to 4096 x 2160@60Hz.
- Fanless design with passive thermal cooling for noise-free and dustproof operation.
- Ideal for mission-critical applications with reduced failure rates.
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AV600-THT Military IP66 Mission GPU Computer
MIL-STD 810 Thermal, shock, vibration, Humidity/EMI/EMC conditions, IP66 Chassis with D38999 connectors
Key Features:
- MIL-STD 810 Thermal, shock, vibration, Humidity / EMI / EMC conditions
- IP66 Chassis with D38999 connectors
- Intel® 11th Gen. Tiger Lake(H) W-11865MRE Processors, up to 8 cores
- Up to 96GB DDR4 SO-DIMM, non-ECC and ECC
- NVIDIA RTX™ A4500 8GB/16GB GDDR6 memory 5888 CUDA cores
- Soldered 64 GB NVMe
- IP65 2 x 2.5” SATA SSD Easy Swap Tray
- MIL-STD 461 18V~36V DC-Input (Options for MIL-704/1275)
- Extreme Temperature : -40°C to 70°C
- Dimensions : 246(L) x 313.5 (W) x 100 (H) mm