MTE662P & MTE662P-I PCIe M.2 SSDs

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SKU
TSxxxxMTE662P/-I
Brand: Transcend

PCI Express (PCIe) Gen 3 x4 interface, compatible with NVM Express (NVMe) 1.3, 3D NAND technology

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Transcend's MTE662P M.2 SSD features the PCI Express (PCIe) Gen 3 x4 interface and is compatible with NVM Express (NVMe) 1.3 specifications to achieve never-before-seen transfer speeds. The MTE662P features state-of-the-art 3D NAND technology, which allows 96 layers of 3D NAND flash chips to be vertically stacked. Compared to 3D NAND at 64 layers, this density breakthrough greatly improves storage efficiency, and its built-in DRAM cache allows faster access. Applied with 30µ" gold finger PCB and Corner Bond technology, the MTE662P is fully tested in-house, boasting an endurance rating of 3K Program/Erase cycles and an extended operating temperature ranging from -20°C~75°C. The built-in Power Loss Protection (PLP) further ensures data integrity in mission-critical applications.

Transcend also offers the MTE662P-I with wide temperature (-40℃ ~ 85℃) capabilities to ensure sustained functionality, enhanced endurance, and optimal reliability in mission-critical applications.

Key Features:

  • Supports NVM command
  • SLC caching technology
  • Dynamic thermal throttling
  • Built-in LDPC ECC (Error Correction Code) functionality
  • Advanced Global Wear-Leveling and Block management for reliability
  • Advanced Garbage Collection
  • Supports S.M.A.R.T. function to conduct health monitoring, analysis, and reporting for storage devices
  • Full drive encryption with Advanced Encryption Standard (AES) (optional)
  • Compliant with RoHS 2.0 standards
  • Compliant with NVM Express specification 1.3
  • Compliant with PCI Express specification 3.1
  • Space-saving M.2 form factor (80mm) – ideal for mobile computing devices
  • PCIe Gen 3 x4 interface
  • DDR4 DRAM Cache embedded
  • Endurance: 3K P/E cycles (Program/Erase cycles) guaranteed
  • Key components fortified by default with Corner Bond technology
  • 30µ" PCB gold finger
  • Power Loss Protection (PLP) to prevent data loss in the event of a sudden power outage
  • Extended Temp. (-20°C ~ 75°C) and Wide Temp. (-40°C ~ 85°C) options available
  • Supports Transcend Scope Pro software

Appearance

Dimensions

80 mm x 22 mm x 3.88 mm (3.15" x 0.87" x 0.15")

Weight

9 g (0.32 oz)

M.2 Type
  • 2280-D2-M (Double-sided)

Form Factor
  • M.2 2280

Interface

Bus Interface
  • NVMe PCIe Gen3 x4

Storage

Capacity
  • 128 GB/

  • 256 GB/

  • 512 GB/

  • 1 TB

Flash Type
  • 3D NAND flash

Operating Environment

Operating Voltage
  • 3.3V±5%

Operating Temperature
  • Extended Temp.

    -20°C (-4°F) ~ 75°C (167°F)

  •  
  • Wide Temp.

    -40°C (-40°F) ~ 85°C (185°F)

Storage Temperature

-55°C (-67°F) ~ 85°C (185°F)

Humidity

5% ~ 95%

Shock
  • 1500 G, 0.5 ms, 3 axis

Vibration (Operating)

20 G (peak-to-peak), 7 Hz ~ 2000 Hz (frequency)

Power

Power Consumption (Operation)

3.4 watt(s)

Power Consumption (IDLE)

1.0 watt(s)

Performance

Sequential Read/Write (CrystalDiskMark)

Read: up to 3,400 MB/s

Write: up to 2,300 MB/s

4K Random Read/Write (IOmeter)

Read: up to 340,000 IOPS

Write: up to 355,000 IOPS

Mean Time Between Failures (MTBF)

3,000,000 hour(s)

Terabytes Written (TBW)

up to 2,200 TBW

Drive Writes Per Day (DWPD)

2 (3 yrs)

Note
  • Speed may vary due to host hardware, software, usage, and storage capacity.

  • The workload used to rate DWPD may be different from your actual workload, which may vary due to host hardware, software, usage, and storage capacity.

  • Terabytes Written (TBW) expresses the endurance under the highest capacity.