Find Your Technical Solution Below

Tekdis products are categorised into the groups below. Once you select the correct category use the filters to locate the best product for your application.

Depending on the category there are numerous filters to help you identify the ideal solution. If you have other questions or requests we are always available via phone or email and will aim to respond within the hour.

Tekdis can "build to order" a complete solution including Operating System and SSD imaging so systems will be preconfigured out of the box. 

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  1. Products 48 items
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1-24 of 48 Items

  1. AV600X-CH Military IP66 Mission GPU Computer
    AV600X-CH Military IP66 Mission GPU Computer

    MIL-STD 810 Thermal, shock, vibration, Humidity/EMI/EMC conditions, IP66 Chassis with D38999 connectors

    Key Features:

    • MIL-STD 810 Thermal, shock, vibration, Humidity/EMI/EMC conditions
    • IP66 Chassis with D38999 connectors
    • Intel® 9th Gen. Coffee Lake (H) Xeon® E-2276ML processor
    • Up to 128GB DDR4 SO-DIMM, non-ECC and ECC
    • NVIDIA RTX™ A1000, 2048 CUDA® cores, 4GB GDDR6 memory
    • NVMe 3.0 512GB.(MB/sec, Max.) 3,400/3,200 MB
    • MIL-STD-461 18V~36V DC-Input (Options for MIL-704/1275)
    • Extreme Temperature : -40°C to 55°C
    • Optional with External GPU Turbo Kit
    • Dimensions : 250(L) x 313.5 (W) x 100 (H) mm
  2. AV600-THT Military IP66 Mission GPU Computer
    AV600-THT Military IP66 Mission GPU Computer

    MIL-STD 810 Thermal, shock, vibration, Humidity/EMI/EMC conditions, IP66 Chassis with D38999 connectors

    Key Features:

    • MIL-STD 810 Thermal, shock, vibration, Humidity / EMI / EMC conditions
    • IP66 Chassis with D38999 connectors
    • Intel® 11th Gen. Tiger Lake(H) W-11865MRE Processors, up to 8 cores
    • Up to 96GB DDR4 SO-DIMM, non-ECC and ECC
    • NVIDIA RTX™ A4500 8GB/16GB GDDR6 memory 5888 CUDA cores
    • Soldered 64 GB NVMe
    • IP65 2 x 2.5” SATA SSD Easy Swap Tray
    • MIL-STD 461 18V~36V DC-Input (Options for MIL-704/1275)
    • Extreme Temperature : -40°C to 70°C
    • Dimensions : 246(L) x 313.5 (W) x 100 (H) mm
  3. AV600TH Military IP66 Mission GPU Computer
    AV600TH Military IP66 Mission GPU Computer

    MIL-STD 810 Thermal, shock, vibration, Humidity/EMI/EMC conditions, IP66 Chassis with D38999 connectors

    Key Features:

    • MIL-STD 810 Thermal, shock, vibration, Humidity / EMI / EMC conditions
    • IP66 Chassis with D38999 connectors
    • Intel® 11th Gen. Tiger Lake(H) W-11865MLE Processors, up to 8 cores
    • 64GB DDR4 SO-DIMM ECC or non ECC support
    • NVIDIA RTX™ A2000 MXM 8GB GDDR6 2560 CUDA cores
    • 2.5” SATA SSD
    • 1x 3G-SDI Capture Card (Options)
    • MIL-STD-461 18V~36V DC-Input
    • Extreme Temperature: -20 to 55°C degrees
  4. eBOX570 Fanless Embedded System with 13th Gen
    eBOX570 Fanless Embedded System with 13th Gen

    Fanless Embedded System with 13th Gen Intel Core i7/i5/Celeron Processor, 2 HDMI, 1 DisplayPort++, 2 LANs, 8 USB, 2 COM, and 12 VDC

    Key Features:

    • 13th gen Intel Core processor (Raptor Lake P)
    • Fanless design with operating temperature from -20°C to 60°C
    • 1 DDR4 SO-DIMM for up to 32GB of memory
    • Supports the USB power on/off control function
    • Supports high-speed NVMe storage (M.2 Key M 2280)
    • Supports Intel® vPro and TPM 2.0
  5. nROK7271 Fanless Vehicle PC 12/13th Gen CPU
    nROK7271 Fanless Vehicle PC 12/13th Gen CPU

    Introducing nROK 7271 (Preliminary): A fanless, rugged rolling stock computer with 12/13th Gen Intel® Core™ CPU, DDR5, 5G/Wi-Fi, and PoE support, designed for industrial computing.

    Key Features:

    • Powered by 12/13th Gen Intel® Core™ CPU
    • Fanless, compact and rugged design
    • Designed with DDR5, excellent memory bandwidth, lower latency
    • 2 x 2.5” SSD for data integrity (compatible with 15mm disk)
    • 5G/Wi-Fi, PoE, 10GbE, daughter board expansion support
    • 4 x Independent 10/100/1000/2500 Mbps PoE 802.3af/at, total 60W (nROK 7271-WIC4) / 30W (nROK 7271-WIC4-C8S)
    • Additional 8-port LAN M12 X-coded, 10/100/1000 Mbps Ethernet Switch GbE, PoE 802.3af/at, max. 30W (nROK7271-WIC4-C8S)
    • EN 50155, class OT3 conformity
    • Wide voltage input 24~110VDC (w/ isolation)
    • Optional up to 3-sec protection against temporary voltage dips
  6. nROK7270 Fanless Vehicle PC 12/13th Gen CPU
    nROK7270 Fanless Vehicle PC 12/13th Gen CPU

    Introducing the nROK 7270: a fanless rolling stock computer with a powerful Intel Core CPU, DDR5 memory, 5G/Wi-Fi, PoE support, and military-standard durability.

    Key Features:

    • Powered by 12/13th Gen Intel Core CPU

    • Fanless, compact and rugged design

    • Designed with DDR5, excellent memory bandwidth, lower latency

    • 2 x 2.5” SSD for data integrity (compatible with 15mm disk)

    • 5G/Wi-Fi, PoE, 10GbE, daughter board expansion support

    • Two video outputs, one VGA and one HDMI

    • 4 x Independent 10/100/1000/2500 Mbps PoE 802.3 af/at, total 60W (nROK 7270-AC4/nROK 7270-AC4-C8S)

    • Additional 8-port LAN M12 X-coded, 10/100/1000 Mbps Ethernet Switch GbE, PoE 802.3af/at, max. 60W (nROK 7270-AC4-C8S)

    • Military standard for anti-vibration/shock

    • EN 50155, class OT3 conformity

  7. Neu-X303mini Edge Computing System 12th Gen CPU
    Neu-X303mini Edge Computing System 12th Gen CPU

    12th Gen. Core CPU, 4 x 4K@60Hz display output, DP, HDMI 2.1, 2 x USB 3.2 Type-C, Dual 2.5G LAN ports, 4 x USB 3.2 and 2 x USB 3.2 Type-C ports for easy connection

    Key Features:

    • 12th Generation Intel Core (Alder Lake - PS) processor SoC
    • Four 4K@60Hz display output, DP, HDMI 2.1 and 2 x USB 3.2 Type-C
    • Dual 2.5G LAN ports, 4 x USB 3.2 and 2 x USB 3.2 Type-C ports for easy connection
    • Onboard M.2 2280 Key M with PCIe signal for storage modules
    • Onboard M.2 2230 Key E for optional Wi-Fi modules
    • Compact design (L: 183mm, W: 137.9mm, H: 47.9mm)
    • 12V DC in
  8. Neu-X304 Edge Computer System 13/12th Gen CPU
    Neu-X304 Edge Computer System 13/12th Gen CPU

    Unleash the potential of multiple AI and edge applications with the Neu-X304

    Key Features:

    • 13/12th Gen Intel® Core™ i9/i7/i5/i3 processors, up to 35W
    • Dual channel DDR5 SO-DIMM, max up to 64GB
    • Support 3 x HDMI 2.0 output, 4K@60Hz
    • Dual Intel® LAN ports
    • Rich Interface : 2 x COM ports, 8 x USB port, Mic-in, Line-out
    • TPM 2.0 onboard
    • Support Intel® AMT technology (Q670E only)
    • Multiple expansion slots: M.2 2280 Key M for storage, M. 2 2230 Key E for Wi-Fi module,
    • M.2 3052 Key B for LTE/5G module
    • Power Input:12V DC or 12~24V DC (Q670E only)
  9. NISE-70 Celeron/Core Fanless System
    NISE-70 Celeron/Core Fanless System

    Intel Celeron 6305E Processor Dual Core Fanless System

    Key Features:

    • Onboard Intel Celeron 6305E Processor
    • 4 x HDMI
    • 3 x USB 3.0, 1 x USB 2.0
    • 1 x RS232/422/485, 1 x RS232
    • 3 x GbE LAN ports; support WoL, teaming and PXE
    • Onboard TPM 2.0 chip
    • 1 x M.2 socket for storage/4G LTE/5G modules
    • 1 x mini-PCIe socket support optional mSATA/Wi-Fi/BT/4G LTE module
    • Support operating temperature from-5 to 55 Celsius degree
    • Support+12V to 24VDC input; support ATX power mode
  10. NDiS-B561 12th Gen Fanless Edge PC PoE Option
    NDiS-B561 12th Gen Fanless Edge PC PoE Option

    Visual Edge PC 12th Gen Core Processor -20~60°C 1 x HDMI 2.1 2 x HDMI 2.0 8 x USB 3.2 4 x COM

    Key Features:

    • Support 12th Gen Intel Core i9/i7/i5/i3 LGA socket type embedded processor, up to 35W
    • Intel Q670E
    • Intel integrated UHD graphic engine driven by Xe architecture
    • Support 3 independent 4K2K@60Hz display outputs. HDMI 2.1 resolution can be up to 8K@60Hz
    • 1 x HDMI 2.1, 2 x HDMI 2.0
    • 8 x USB 3.2, 4 x COM,
    • 1 x GbE LAN, 2 x 2.5G GbE LAN (PoE for B561-PoE)
    • Support M.2 Key B/E/M
    • Support extended temperature -20~60°C (B561 only)
    • Fanless design
  11. EMS-TGL Fanless Rugged Embedded System 11th Gen
    EMS-TGL Fanless Rugged Embedded System 11th Gen

    11th Gen. Core i7/i5/i3 BGA Processor, Rich I/O, support 5G module, fanless operation temperature -40°C ~ 70°C

    Key Features:

    • On board 11th Gen. Intel Core i7/i5/i3 BGA Processor
    • 2x 260-pin SODIMM socket Max. up to 64GB DDR4 3200MT/s
    • Rich I/O, 4-USB3.1, 1-DP, 1-HDMI, 2-COM, 2-LAN, 1-8bit GPIO.
    • Support 5G (Sub-6G) module, M.2 NVMe SSD Gen. III x 4, HDMI 2.0b (4K @ 60Hz), LAN 2.5G BaseTx GbE
    • Fanless operation temperature from -40°C ~ 70°C (WT) / 0°C ~ 70°C (ST)
    • CE, FCC Class B, IP50
    • Wide range DC power input from +9~32V
    • Support HW TPM 2.0
    • Support vPro
  12. ACS10-TGU 11th Gen Intel Fanless Compact System
    ACS10-TGU 11th Gen Intel Fanless Compact System

    Compact and easy to set up, highly expandable I/O interfaces and flexible storage design, and supports high-resolution graphics

    Key Features:

    • 11th Gen Intel Core i5/i3 Tiger Lake-UP3 Processor
    • Intel Iris Xe/ UHD Graphics Engine
    • 1-260-pin DDR4 3200MHz SO-DIMM, Supports Up to 32GB
    • 2-Gigabit Ethernet, 1 x 2.5GbE, 1 x 1GbE
    • 2-COM Port (RS-232/422/485 & RS-232)
    • 2-Audio Jack (Line-Out & Mic-In)
    • 2-Storage (M.2 Key-M NVMe & M.2 Key-B SATA)
    • 2-Expansion Slot (M.2 Key-E, Key-B)
    • 6-USB Port (3-USB 3.2 & 3-USB 2.0)
    • CE, FCC Class A, UKCA
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