AV600TH Military IP66 Mission GPU Computer
MIL-STD 810 Thermal, shock, vibration, Humidity/EMI/EMC conditions, IP66 Chassis with D38999 connectors
Key Features:
- MIL-STD 810 Thermal, shock, vibration, Humidity / EMI / EMC conditions
- IP66 Chassis with D38999 connectors
- Intel® 11th Gen. Tiger Lake(H) W-11865MLE Processors, up to 8 cores
- 64GB DDR4 SO-DIMM ECC or non ECC support
- NVIDIA RTX™ A2000 MXM 8GB GDDR6 2560 CUDA cores
- 2.5” SATA SSD
- 1x 3G-SDI Capture Card (Options)
- MIL-STD-461 18V~36V DC-Input
- Extreme Temperature: -20 to 55°C degrees
The AV600TH-A20-PA1 is powered by Intel® 11th Gen Tiger Lake-H Processors, which include integrated Intel® UHD Graphics based on the Xe architecture. The Tiger Lake H processor is built using 10nm SuperFin Technology and boasts up to 8 CPU cores, operating at a frequency of 4.5 GHz. This processor offers high computing performance and flexibility, making it suitable for demanding IoT workloads. Compared to previous generations, this platform delivers significant performance improvements, with a remarkable 32 per cent increase in single-thread performance. Additionally, it offers high-speed I/O capabilities for expansion and peripheral connectivity.
The AV600TH-A20-PA1 stands out due to its rugged design and extensive functionality. It is equipped with MIL-STD Amphenol type connectors and boasts full IP66 protection, making it capable of withstanding harsh environmental conditions. Furthermore, the AV600TH-A20-PA1 supports an extended temperature range, from -40°C to 70°C, and features a MIL-STD-461 18V~36V DC-input power supply. This power supply safeguards the system against voltage surges, ensuring the reliability of critical components and the system itself.
ARINC 429
ARINC 429 is a globally recognized standard for data transmission in aircraft electronics. It is primarily used in commercial and transport aircraft for various communication and guidance purposes, such as altitude reference and flight management. To achieve a successful flight, these systems must work in harmony. The physical connections in ARINC 429 involve twisted pairs of wires that carry balanced differential signalling.
The unit of transmission in ARINC 429 is a fixed-length 32-bit frame, referred to as a 'word' in the standard. The individual bits within an ARINC 429 word are sequentially labelled from Bit Number 1 to Bit Number 32.
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CPU |
Intel® 11th Gen. Tiger Lake-H Processors, up to 8 cores, integrated Intel® UHD Graphics - Intel® Xeon® W-11865MLE, 25W Tiger Lake 11th Gen, 8C, Freq. 1.5/4.5 GHz, 24MB cache |
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Memory type |
Up to 96GB DDR4 SO-DIMM, non-ECC and ECC |
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CHIPSET |
Intel® RM590E (support ECC, with Xeon CPU) /QM580E |
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GPU |
NVIDIA RTX™ A1000/A2000 4GB/8GB GDDR6 memory, 2048/2560 CUDA cores |
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Expansion Slot |
2x Full-size mini PCIe (1 with mSATA supported) -1 with mSATA/USB2.0/PCIeX1 support -1 with SIM/USB2.0/PCIeX1 support 1x 2280 M key (SATA only) |
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Storage |
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SATA |
1x 2.5” SSD, Hot Swappable SSD/HDD slot |
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M.2 |
1x 2280 M key (SATA only) |
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Ethernet |
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Ethernet (Internal) |
2x 10/100/1000 Ethernet Ports |
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Front I/O |
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X1 |
2x GbE LAN + 2x USB2.0 + 1x COM(RS232) with D38999 connector |
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X2 |
1x VGA+ 4x DI/4x DO +3x RS422, with D38999 connector |
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X3 |
1x USB3.0 , with D38999 connector |
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X4 |
1x USB3.0 , with D38999 connector |
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X5 |
1x DC-in, with D38999 connector |
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LED |
1x SSD/HDD LED indicator |
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switch |
1x IP65 power button, with LED indicator |
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SSD |
2x 2.5” Easy swap SSD Tray |
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Power |
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Power input |
MIL-STD -461 18V~36V DC-Input |
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Application, Operating System |
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Application |
Military Platforms Requiring Compliance to MIL-STD-810 Where Harsh Temperature, Shock, Vibration, Altitude, Dust and MIL-461 EMI Conditions. |
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Operating System |
Windows® 10 64-bit / Linux (support by request) |
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Physical |
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Dimension |
250 x 325 x 100 mm (LxWxH) |
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Weight |
11 KG |
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Chassis |
Aluminum Alloy |
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Heatsink |
Heatsink Aluminum Alloy, Corrosion Resistant |
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Environmental |
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Green Product |
RoHS, WEEE compliance |
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Operating Temp. |
-20 to 55°C |
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Storage Temp. |
-40 to 85°C |
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Relative Humidity |
5% to 95%, non-condensing |
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MIL-STD-810 |
Method 507.5, Procedure II ( Temperature & Humidity ) Method 516.6 Shock-Procedure V Non-Operating ( Mechanical Shock ) Method 516.6 Shock-Procedure I Operating ( Mechanical Shock ) Method 514.6 Vibration Category 24/Non-Operating ( Category 20 & 24, Vibration ) Method 514.6 Vibration Category 20/Operating ( Category 20 & 24, Vibration ) Method 501.5, Procedure I ( Storage/High Temperature ) Method 501.5, Procedure II ( Operation/High Temperature ) Method 502.5, Procedure I ( Storage/Low Temperature ) Method 502.5, Procedure II ( Operation/Low Temperature ) Method 503.5, Procedure I ( Temperature shock ) |
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Reliability |
No Moving Parts; Passive Cooling. Designed and manufactured using ISO 9001 / 2000 Certified Quality Program. |
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MIL-STD-461 |
CE102: 10 KHz - 10 MHz RE102-4: 1.5 MHz -30 MHz - 5 GHz RS103: 200 MHz - 3.0 GHz - 5.0 GHz, 50 V/m equal for all frequencies |
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Designed to Meet Items (Options) |
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CS101, CS114, CS115, CS116 |
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CE106, RE103, RS101 |
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MIL-STD-1275 |
Steady State |
20V-33V |
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Surge Low |
18V/500ms |
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Surge High |
100V/500ms |
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