AV600X-CH Military IP66 Mission GPU Computer
MIL-STD 810 Thermal, shock, vibration, Humidity/EMI/EMC conditions, IP66 Chassis with D38999 connectors
Key Features:
- MIL-STD 810 Thermal, shock, vibration, Humidity/EMI/EMC conditions
- IP66 Chassis with D38999 connectors
- Intel® 9th Gen. Coffee Lake (H) Xeon® E-2276ML processor
- Up to 128GB DDR4 SO-DIMM, non-ECC and ECC
- NVIDIA RTX™ A1000, 2048 CUDA® cores, 4GB GDDR6 memory
- NVMe 3.0 512GB.(MB/sec, Max.) 3,400/3,200 MB
- MIL-STD-461 18V~36V DC-Input (Options for MIL-704/1275)
- Extreme Temperature : -40°C to 55°C
- Optional with External GPU Turbo Kit
- Dimensions : 250(L) x 313.5 (W) x 100 (H) mm
The AV600X-CH is powered by Intel® 9th Gen Coffee Lake-H Xeon Processors. These processors are fabricated using Intel's cutting-edge 14 nm technology, offering up to 6 CPU cores. They provide exceptional computing performance and flexibility, making them well-suited for demanding IoT workloads. The H-series processors are particularly designed for space-constrained and purpose-built applications. They offer a variety of options for scalable performance, delivering significant improvements over the previous generation with up to 6 cores.
The AV600X-CH is distinguished by its robust design and high functionality. The system is equipped with MIL-STD Amphenol type connectors and boasts full IP66 protection, enabling it to withstand even the harshest environmental conditions. Additionally, the AV600X-CH supports an extended temperature range from -40°C to 55°C and features a MIL-STD-461 compliant 18V~36V DC-input power supply. This power supply safeguards the system against damage from voltage surges, further enhancing the reliability of its critical components and the system itself.
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System |
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CPU |
Intel® Xeon® E-2276ME, 45W Coffee Lake 9th Gen, 6C , Freq. 2.8 /4.5 GHz, 12MB cache Intel® Xeon® E-2276ML, 25W Coffee Lake 9th Gen, 6C , Freq. 2.0 / 4.2 GHz, 12MB cache |
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Memory type |
4 x 260 Pin DDR4 2400MHz SO-DIMM (up to 128GB, XEON®SKU support ECC) |
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CHIPSET |
CM246 |
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GPU |
NVIDIA RTX™ A1000/A2000 embedded graphics - Standard MXM 3.1 Type A (82 x 70 mm) - 2048/2560 CUDA® cores, 16 RT Cores, and 64 Tensor Cores - 6.66TFLOPS peak FP32 performance - 4GB/8GB GDDR6 memory, 128-bit |
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On board Storage |
NVMe 3.0 512GB.(MB/sec, Max.) 3,400/3,200 MB |
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Expansion Slot |
1 x M.2(M-key,Type: 2280 , SATA/PCIe 3.0 x 4 NVMe) 2 x Mini PCIe Full size (USB / PCIe and 1 x micro SIM Card) 1 x PCIe/104, 1 x FPE |
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TPM |
TPM 2.0 (SLB9665) |
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VIDEO INPUT |
4 Channel capture module for 4 x SMA male connectors >(optional) |
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Storage |
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SATA |
1 x 2.5” SSD |
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M.2 |
1 x 2280 M key (SATA only) |
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Front I/O |
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DC-in |
1 x DC-in , with D38999 connector |
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X1 |
1 x DVI , with D38999 connector |
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X2 |
1 x DVI , with D38999 connector |
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X3 |
2 x GLAN + 3 x USB 2.0, with D38999 connector |
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X4 |
4 x RS232/422/485 + 4 BIT DIO, with D38999 connector |
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LED |
1 x SSD/HDD LED indicator |
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switch |
1 x IP65 power button, with LED indicator |
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Power |
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Power input |
MIL-STD -461 18V~36V DC-Input |
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Application, Operating System |
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Application |
Military Platforms Requiring Compliance to MIL-STD-810 Where Harsh Temperature, Shock, Vibration, Altitude, Dust and MIL-461 EMI Conditions. |
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Operating System |
Windows® 10 64-bit / Linux (support by request) |
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Physical |
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Dimension |
250(L) x 325 (W) x 88 (H)mm |
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Weight |
10.5 Kg |
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Chassis |
Aluminum Alloy |
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Heatsink |
Heatsink Aluminum Alloy, Corrosion Resistant |
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Environmental |
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Green Product |
RoHS, WEEE compliance |
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Operating Temp. |
-40 to 55°C |
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Storage Temp. |
-40 to 85°C |
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Relative Humidity |
5% to 95%, non-condensing |
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MIL-STD-810 |
Method 507.5, Procedure II ( Temperature & Humidity ) Method 516.6 Shock-Procedure V Non-Operating ( Mechanical Shock ) Method 516.6 Shock-Procedure I Operating ( Mechanical Shock ) Method 514.6 Vibration Category 24/Non-Operating ( Category 20 & 24, Vibration ) Method 514.6 Vibration Category 20/Operating ( Category 20 & 24, Vibration ) Method 501.5, Procedure I ( Storage/High Temperature ) Method 501.5, Procedure II ( Operation/High Temperature ) Method 502.5, Procedure I ( Storage/Low Temperature ) Method 502.5, Procedure II ( Operation/Low Temperature ) Method 503.5, Procedure I ( Temperature shock ) |
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Reliability |
No Moving Parts; Passive Cooling. Designed and manufactured using ISO 9001 / 2000 Certified Quality Program. |
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MIL-STD-461 |
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Designed to Meet Items (Options) |
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CS101, CS114, CS115, CS116 |
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CE106, RE103, RS101 |
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MIL-STD-1275 |
Steady State |
20V-33V |
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Surge Low |
18V/500ms |
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Surge High |
100V/500ms |
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