Find Your Technical Solution Below
Tekdis products are categorised into the groups below. Once you select the correct category use the filters to locate the best product for your application.
Depending on the category there are numerous filters to help you identify the ideal solution. If you have other questions or requests we are always available via phone or email and will aim to respond within the hour.
Tekdis can "build to order" a complete solution including Operating System and SSD imaging so systems will be preconfigured out of the box.
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IPC920 Fanless Industrial Computer with 13th/12th Gen
Fanless Industrial System with LGA1700 Socket 13th/12th Gen Intel Core i9/i7/i5/i3 or Celeron Processor, Intel H610E/R680E, and Front-access I/O
Key Features:
- Intelligent power management:
- Ignition
- USB power on/off control - Supports Intel® RAID (R680E)
- Easy expansion via flexible I/O window
- Supports connectors with pull-resistance design
- Optional DIN-rail, bookshelf, and wall mount kit
- EN 61000-6-2 certified
- Intelligent power management:
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ATC3750-IP7-WI8MR NVIDIA Jetson AGX Orin Edge AI Computer
NVIDIA Jetson AGX Orin Edge AI Computer for Rail
Key Features:
- Built-in NVIDIA® Jetson AGX Orin™ SOM, up to 200/275 TOPS (INT8)
- Designed to be IP67-rated, rugged, and compact
- 8 MIPI/GMSL2 & 2.5GbE (X-coded) for MIPI CAM/IP CAM/LiDAR
- HEVC/H.265 hardware DECODE, supporting up to 7 x 4K30
- Wide range operating temperature of -25°C~70°C
- Ultra-speed PCIe 4.0 x4 NVMe SSD for data integrity
- Expansible for GNSS, LTE/5G NR & Wi-Fi 5/6
- 24~110VDC w/ isolation, ignition control & OCP/OVP
- NEXCOM Acceleration Linux (NAL) integrated w/ JetPack 5.1.1
- Military standard of MIL-STD-810H for anti-vibration/shock
- CE/FCC, UKCA, EN50155 (EN55011, EN50121-3-2, EN61373, OT3), EN45545-2 certified
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AV600X-CH Military IP66 Mission GPU Computer
MIL-STD 810 Thermal, shock, vibration, Humidity/EMI/EMC conditions, IP66 Chassis with D38999 connectors
Key Features:
- MIL-STD 810 Thermal, shock, vibration, Humidity/EMI/EMC conditions
- IP66 Chassis with D38999 connectors
- Intel® 9th Gen. Coffee Lake (H) Xeon® E-2276ML processor
- Up to 128GB DDR4 SO-DIMM, non-ECC and ECC
- NVIDIA RTX™ A1000, 2048 CUDA® cores, 4GB GDDR6 memory
- NVMe 3.0 512GB.(MB/sec, Max.) 3,400/3,200 MB
- MIL-STD-461 18V~36V DC-Input (Options for MIL-704/1275)
- Extreme Temperature : -40°C to 55°C
- Optional with External GPU Turbo Kit
- Dimensions : 250(L) x 313.5 (W) x 100 (H) mm
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ATC3750-IP7-8M NVIDIA Jetson AGX Orin Edge AI Computer
NVIDIA Jetson AGX Orin Solution Performance Edge AI Computer for Rail
Key Features:
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Built-in NVIDIA Jetson AGX Orin SOM, up to 200/275 TOPS (INT8) performance
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Designed to be IP67-rated, rugged, and compact
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8 MIPI/GMSL2 & 2.5GbE (X-coded) for MIPI CAM/IP CAM/LiDAR sensors
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HEVC/H.265 hardware DECODE, supporting up to 7 x 4K30
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Wide range operating temperature of -25°C~70°C
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Ultra-speed PCIe 4.0 x4 NVMe SSD for data integrity
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Expansible for GNSS, LTE/5G NR & Wi-Fi 5/6
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9~36VDC & 24V rail combined, ignition control & OCP/OVP
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NEXCOM Acceleration Linux (NAL) integrated w/ JetPack 5.1.1
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Military standard of MIL-STD-810H for anti-vibration/shock
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CE/FCC, UKCA, E-mark, EN50155 (EN55011, EN50121-3-2, EN61373, OT3) certified
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AV600-THT Military IP66 Mission GPU Computer
MIL-STD 810 Thermal, shock, vibration, Humidity/EMI/EMC conditions, IP66 Chassis with D38999 connectors
Key Features:
- MIL-STD 810 Thermal, shock, vibration, Humidity / EMI / EMC conditions
- IP66 Chassis with D38999 connectors
- Intel® 11th Gen. Tiger Lake(H) W-11865MRE Processors, up to 8 cores
- Up to 96GB DDR4 SO-DIMM, non-ECC and ECC
- NVIDIA RTX™ A4500 8GB/16GB GDDR6 memory 5888 CUDA cores
- Soldered 64 GB NVMe
- IP65 2 x 2.5” SATA SSD Easy Swap Tray
- MIL-STD 461 18V~36V DC-Input (Options for MIL-704/1275)
- Extreme Temperature : -40°C to 70°C
- Dimensions : 246(L) x 313.5 (W) x 100 (H) mm
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AV600TH Military IP66 Mission GPU Computer
MIL-STD 810 Thermal, shock, vibration, Humidity/EMI/EMC conditions, IP66 Chassis with D38999 connectors
Key Features:
- MIL-STD 810 Thermal, shock, vibration, Humidity / EMI / EMC conditions
- IP66 Chassis with D38999 connectors
- Intel® 11th Gen. Tiger Lake(H) W-11865MLE Processors, up to 8 cores
- 64GB DDR4 SO-DIMM ECC or non ECC support
- NVIDIA RTX™ A2000 MXM 8GB GDDR6 2560 CUDA cores
- 2.5” SATA SSD
- 1x 3G-SDI Capture Card (Options)
- MIL-STD-461 18V~36V DC-Input
- Extreme Temperature: -20 to 55°C degrees
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nROK7271 Fanless Vehicle PC 12/13th Gen CPU
Introducing nROK 7271 (Preliminary): A fanless, rugged rolling stock computer with 12/13th Gen Intel® Core™ CPU, DDR5, 5G/Wi-Fi, and PoE support, designed for industrial computing.
Key Features:
- Powered by 12/13th Gen Intel® Core™ CPU
- Fanless, compact and rugged design
- Designed with DDR5, excellent memory bandwidth, lower latency
- 2 x 2.5” SSD for data integrity (compatible with 15mm disk)
- 5G/Wi-Fi, PoE, 10GbE, daughter board expansion support
- 4 x Independent 10/100/1000/2500 Mbps PoE 802.3af/at, total 60W (nROK 7271-WIC4) / 30W (nROK 7271-WIC4-C8S)
- Additional 8-port LAN M12 X-coded, 10/100/1000 Mbps Ethernet Switch GbE, PoE 802.3af/at, max. 30W (nROK7271-WIC4-C8S)
- EN 50155, class OT3 conformity
- Wide voltage input 24~110VDC (w/ isolation)
- Optional up to 3-sec protection against temporary voltage dips
- Powered by 12/13th Gen Intel® Core™ CPU
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nROK7270 Fanless Vehicle PC 12/13th Gen CPU
Introducing the nROK 7270: a fanless rolling stock computer with a powerful Intel Core CPU, DDR5 memory, 5G/Wi-Fi, PoE support, and military-standard durability.
Key Features:
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Powered by 12/13th Gen Intel Core CPU
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Fanless, compact and rugged design
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Designed with DDR5, excellent memory bandwidth, lower latency
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2 x 2.5” SSD for data integrity (compatible with 15mm disk)
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5G/Wi-Fi, PoE, 10GbE, daughter board expansion support
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Two video outputs, one VGA and one HDMI
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4 x Independent 10/100/1000/2500 Mbps PoE 802.3 af/at, total 60W (nROK 7270-AC4/nROK 7270-AC4-C8S)
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Additional 8-port LAN M12 X-coded, 10/100/1000 Mbps Ethernet Switch GbE, PoE 802.3af/at, max. 60W (nROK 7270-AC4-C8S)
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Military standard for anti-vibration/shock
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EN 50155, class OT3 conformity
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AE613 Wide Temp Fanless Media Player
Semi-industrial computer with Intel 13th Gen., Supports vPro Technology
Key Features:
- Intel Raptor Lake-U Core processors
- 1 x DP (7680 x 4320 @60 Hz)
- 2 x HDMI (4096 x 2304 @60 Hz)
- Support Intel® vPro® technology
- Fanless design
- Wide temperature and voltage
- VESA mountable
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AV600-RH Military IP66 AI Edge GPU Computer
Military IP66 with D38999 connectors VIDIA RTX A1000/A2000, 2048/2560 CUDA
Key Features:
- MIL-STD 810 Thermal, shock, vibration, Humidity / EMI / EMC conditions
- IP66 Chassis with D38999 connectors
- Intel 13th Gen. Raptor Lake (H) i7-13800HE/HRE, 14C , 2.5/5.0 GHz Processor
- Up to 64GB DDR5 SO-DIMM, non-ECC and ECC
- NVIDIA RTX A1000/A2000, 2048/2560 CUDA,4GB/8GB GDDR6 RAM
- MIL-STD-461 EMI Filter18V~36V DC-Input
- Extreme Temperature : -40°C to 60°C
- Dimensions : 250(L) x 325 (W) x 100 (H) mm
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IMB760 EATX Motherboard Xeon scalable 4 PCIe x16, 2 PCIe x8, VGA, NVMe, and IPMI
EATX Motherboard with Dual LGA4189 Socket 3rd Gen Intel Xeon Scalable Processors, Intel C621A/C627A, 4 PCIe x16, 2 PCIe x8, VGA, NVMe, and IPMI
Key Features:
- Dual 3rd gen Intel® Xeon® Scalable processors (Ice Lake-SP)
- 16 288-pin DDR4-3200 RDIMM for up to 1TB of memory
- 4 PCIe x16 and 2 PCIe x8
- Supports 2 M.2 Key M slots for NVMe with RAID 0 & 1
- Supports TPM 2.0 module (optional)
- Two 10GbE ports
- IPMI (optional)
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Neu-X303mini Edge Computing System 12th Gen CPU
12th Gen. Core CPU, 4 x 4K@60Hz display output, DP, HDMI 2.1, 2 x USB 3.2 Type-C, Dual 2.5G LAN ports, 4 x USB 3.2 and 2 x USB 3.2 Type-C ports for easy connection
Key Features:
- 12th Generation Intel Core (Alder Lake - PS) processor SoC
- Four 4K@60Hz display output, DP, HDMI 2.1 and 2 x USB 3.2 Type-C
- Dual 2.5G LAN ports, 4 x USB 3.2 and 2 x USB 3.2 Type-C ports for easy connection
- Onboard M.2 2280 Key M with PCIe signal for storage modules
- Onboard M.2 2230 Key E for optional Wi-Fi modules
- Compact design (L: 183mm, W: 137.9mm, H: 47.9mm)
- 12V DC in
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AFL3-W22C-ADLP 21.5” Fanless Touch Panel PC
Wide 21.5" 350cd/m² 1920x1080 Panel PC with 12th Gen. Intel Core ion-board processor, PCAP touch, 2M camera, microphone
Key Features:
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12th Gen Intel Core Mobile i7/i5/i3 Processors
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Full HD capacitive touchscreen
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Anti-AG and Anti-UV PCAP
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One E-Window that supports an additional connector interface
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Support WiFi 6E and Bluetooth 5.2
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Neu-X304 Edge Computer System 13/12th Gen CPU
Unleash the potential of multiple AI and edge applications with the Neu-X304
Key Features:
- 13/12th Gen Intel® Core™ i9/i7/i5/i3 processors, up to 35W
- Dual channel DDR5 SO-DIMM, max up to 64GB
- Support 3 x HDMI 2.0 output, 4K@60Hz
- Dual Intel® LAN ports
- Rich Interface : 2 x COM ports, 8 x USB port, Mic-in, Line-out
- TPM 2.0 onboard
- Support Intel® AMT technology (Q670E only)
- Multiple expansion slots: M.2 2280 Key M for storage, M. 2 2230 Key E for Wi-Fi module,
- M.2 3052 Key B for LTE/5G module
- Power Input:12V DC or 12~24V DC (Q670E only)
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BQ612 Mini Desktop PC 12th/13th Gen CPU
Mini-PC with desktop CPU (12th/13th gen.) and nine USB ports
Key Features:
- Intel LGA1700 Socket 12th/13th Gen. Processors
- 1 x HDMI (Max. 4096 x 2160 @60 Hz)
- 1 x VGA, Optional: 1 x DP
- RTC
- Watchdog Timer
- Chassis Intrusion
- Support NVMe SSD
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NDiS V1000 Multi-Display Fanless Embedded Computer
Multi-Display Embedded Computer Powered by AMD V Series Quad APU Processor
Key Features:
- Onboard AMD V1605B APU processor
- Graphics operating at up to 1.1 GHz
- Dual DDR4 SO-DIMM, up to 32G
- Support 4 x HDMI 2.0 for video wall application
- Support M.2 M Key, 2280/2242 size storage device
- 4 x USB 3.0 support
- M.2 E key slot for optional Wi-Fi module
- 1 x Onboard TPM 2.0 IC
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NDiS-B561 12th Gen Fanless Edge PC PoE Option
Visual Edge PC 12th Gen Core Processor -20~60°C 1 x HDMI 2.1 2 x HDMI 2.0 8 x USB 3.2 4 x COM
Key Features:
- Support 12th Gen Intel Core i9/i7/i5/i3 LGA socket type embedded processor, up to 35W
- Intel Q670E
- Intel integrated UHD graphic engine driven by Xe architecture
- Support 3 independent 4K2K@60Hz display outputs. HDMI 2.1 resolution can be up to 8K@60Hz
- 1 x HDMI 2.1, 2 x HDMI 2.0
- 8 x USB 3.2, 4 x COM,
- 1 x GbE LAN, 2 x 2.5G GbE LAN (PoE for B561-PoE)
- Support M.2 Key B/E/M
- Support extended temperature -20~60°C (B561 only)
- Fanless design
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aROK5510 - EN50155 2U 8/9th Gen CPU Rail Server
Intel Core 8/9th Gen/Xeon CPU with Rich Storage Powerful Platform for AI Application and Storage Server
Key Features:
- Intel Coffee Lake S/Refresh 8th/9th-Gen Core/Xeon LGA1151 socket-type CPU
- 100W power consumption graphics card support
- Eight SIM cards + four WWAN modules support
- LTE/5G WWAN module support
- 6 x External SSD for RAID 0, 1, 5, 10
- PCle 3.0 x4 NVMe 1.3 high-performance SSD support
- EN 50155, class OT4 conformity
- 3 x mini-PCIe + 3 x M.2 socket expansion
- Smart fan design with temperature-based RPMs
- Optional expansion module for 4 x PoE M12 or 2 x 10GbE SFP+
- Rackmount platform
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VTC7270 Fanless AI Powered Vehicle Computer
12/13th Gen Intel Core CPU 2 x 2.5GbE, 1 x GbE, 6 x USB 3.2, 2 x CAN FD & 4 x Serials, extra 4 x 2.5GbE PoE
Key Features:
- Powered by 12/13th Gen Intel® Core™ i with DDR5, excellent memory bandwidth, lower latency
- Rich I/Os, 2 x 2.5GbE, 1 x GbE, 6 x USB 3.2, 2 x CAN FD & 4 x Serials, extra 4 x 2.5GbE PoE (option)
- 2 x 2.5” SSD, 1 x NVMe ultra-speed SSD for data integrity
- Up to 4 WWAN/WLAN combinations for mobile router applications
- Up to two Hailo AI accelerator (26TOPS workload each) computing power in option
- 9~36V DC-IN with ignition control & OCP/OVP
- Wide range operating temperature of -40°C~70°C (fanless@35W CPU)
- Military standard for anti-vibration/shock
- CE/FCC, UKCA, Emark Certified
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VTC7260-x Fanless AI-Aided Vehicle Computer
Fanless AI-aided Vehicle Computer with Intel Core 11th Gen CPU
Key Features:
- Intel 11th Gen Tiger Lake UP3, cost-efficient performance
- Compact, rugged and fanless design
- Rich I/Os, 2 x 2.5GbE, GbE, 4 x USB 3.2/2.0 & 3 x RS232/422/485
- 1 x 2.5” SSD, 1 x mSATA and 1 x NVMe SSD for data integrity
- Up to 3 combinations of LTE/5G, and Wi-Fi 5/6 for mobile router function
- Triple display, VGA, HDMI and DP for multi video-out
- 9~36V DC-IN with ignition control & OCP/OVP
- Wide range operating temperature of -30°C~65°C (15W TDP)
- Military standard of anti-vibration/shock for OHV applications
- CE/FCC, UKCA, Emark Certified
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VTC7252-7C4IP - IP65 Fanless 4-CH PoE IP65 Vehicle Computer Intel Core 9th CPU
Fanless 4-CH PoE IP65 Vehicle Computer with Intel® Core™ 9th CPU
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NDiS-V1100 Fanless Embedded Computer 11th Gen
Fanless Embedded Computer Powered by 11th Gen Intel Core Processor
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MANO522 Mini-ITX SBC 9th/8th Gen i7/i5/i3
Mini-ITX SBC with LGA1151 8th Gen Intel Core i7/i5/i3 Processor, HDMI, VGA, LVDS, USB 3.2 Gen 1, mSATA, M.2 and Dual GbE LAN
Key Features:
- LGA1151 9th/8th gen Intel Core i7/i5/i3 processor
- Intel H310 chipset
- 2 DDR4 SO-DIMM for up to 64GB of memory
- 4 USB 3.2 Gen 1 and 2 USB 2.0
- 6 COM ports
- 2 SATA-600 and 1 mSATA
- PCIe x16 and M.2 Key E
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VTC7260-5HBIoT/7HBIoT Fanless AI-Aided Vehicle Computer
Fanless AI-aided Vehicle Computer with Intel Core 11th Gen CPU 9~36V DC-IN with ignition control
Key Features:
- Intel 11th Gen Tiger Lake UP3, cost-efficient performance
- Compact, rugged and fanless design
- Rich I/Os, 2 x 2.5GbE, GbE, 4 x USB 3.2/2.0 & 3 x RS232/422/485
- 1 x 2.5” SSD, 1 x mSATA and 1 x NVMe SSD for data integrity
- Up to 3 combinations of LTE/5G, Wi-Fi 5/6 for mobile router function
- Triple display, VGA, HDMI and DP for multi video-out
- 9~36V DC-IN with ignition control & OCP/OVP
- Wide range operating temperature of -30°C~65°C (15W TDP)
- Military standard of anti-vibration/shock for OHV applications
- CE/FCC, UKCA, Emark Certified