Find Your Technical Solution Below

Tekdis products are categorised into the groups below. Once you select the correct category use the filters to locate the best product for your application.

Depending on the category there are numerous filters to help you identify the ideal solution. If you have other questions or requests we are always available via phone or email and will aim to respond within the hour.

Tekdis can "build to order" a complete solution including Operating System and SSD imaging so systems will be preconfigured out of the box. 

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1-24 of 86 Items

  1. ATC3750-IP7-WI8MR NVIDIA Jetson AGX Orin Edge AI Computer
    ATC3750-IP7-WI8MR NVIDIA Jetson AGX Orin Edge AI Computer

    NVIDIA Jetson AGX Orin Edge AI Computer for Rail

    Key Features:

    • Built-in NVIDIA® Jetson AGX Orin™ SOM, up to 200/275 TOPS (INT8)
    • Designed to be IP67-rated, rugged, and compact
    • 8 MIPI/GMSL2 & 2.5GbE (X-coded) for MIPI CAM/IP CAM/LiDAR
    • HEVC/H.265 hardware DECODE, supporting up to 7 x 4K30
    • Wide range operating temperature of -25°C~70°C
    • Ultra-speed PCIe 4.0 x4 NVMe SSD for data integrity
    • Expansible for GNSS, LTE/5G NR & Wi-Fi 5/6
    • 24~110VDC w/ isolation, ignition control & OCP/OVP
    • NEXCOM Acceleration Linux (NAL) integrated w/ JetPack 5.1.1
    • Military standard of MIL-STD-810H for anti-vibration/shock
    • CE/FCC, UKCA, EN50155 (EN55011, EN50121-3-2, EN61373, OT3), EN45545-2 certified
  2. IB4-271 Long Life Cycle Thin Mini-ITX Motherboard
    IB4-271 Long Life Cycle Thin Mini-ITX Motherboard

    Giada IB4-271, a slim Mini-ITX motherboard featuring Elkhart Lake Celeron J6412 with a 10W TDP, is aligned with Intel® IOTG's roadmap, ensuring a 7+ years lifespan and notable performance enhancements.

    Key Features:

    • Elkhart Lake platform delivers up to 1.7x improvement in single-thread and 1.5x improvement in multi-thread performance.
    • Three display outputs (DP, HDMI, LVDS) with 4K support via HDMI (4096 x 2160 @60 Hz) and DP (4096 x 2160 @60 Hz) powered by Intel® UHD Graphics.
    • Wi-Fi 5/6 support for high-speed data transfer and seamless connectivity to various peripherals.
    • Fanless design with a passive thermal cooling system reduces failure rates, ensuring noise-free and dustproof operation for mission-critical applications.
  3. AV600X-CH Military IP66 Mission GPU Computer
    AV600X-CH Military IP66 Mission GPU Computer

    MIL-STD 810 Thermal, shock, vibration, Humidity/EMI/EMC conditions, IP66 Chassis with D38999 connectors

    Key Features:

    • MIL-STD 810 Thermal, shock, vibration, Humidity/EMI/EMC conditions
    • IP66 Chassis with D38999 connectors
    • Intel® 9th Gen. Coffee Lake (H) Xeon® E-2276ML processor
    • Up to 128GB DDR4 SO-DIMM, non-ECC and ECC
    • NVIDIA RTX™ A1000, 2048 CUDA® cores, 4GB GDDR6 memory
    • NVMe 3.0 512GB.(MB/sec, Max.) 3,400/3,200 MB
    • MIL-STD-461 18V~36V DC-Input (Options for MIL-704/1275)
    • Extreme Temperature : -40°C to 55°C
    • Optional with External GPU Turbo Kit
    • Dimensions : 250(L) x 313.5 (W) x 100 (H) mm
  4. ATC3750-IP7-8M NVIDIA Jetson AGX Orin Edge AI Computer
    ATC3750-IP7-8M NVIDIA Jetson AGX Orin Edge AI Computer

    NVIDIA Jetson AGX Orin Solution Performance Edge AI Computer for Rail

    Key Features:

    • Built-in NVIDIA Jetson AGX Orin SOM, up to 200/275 TOPS (INT8) performance

    • Designed to be IP67-rated, rugged, and compact

    • 8 MIPI/GMSL2 & 2.5GbE (X-coded) for MIPI CAM/IP CAM/LiDAR sensors

    • HEVC/H.265 hardware DECODE, supporting up to 7 x 4K30

    • Wide range operating temperature of -25°C~70°C

    • Ultra-speed PCIe 4.0 x4 NVMe SSD for data integrity

    • Expansible for GNSS, LTE/5G NR & Wi-Fi 5/6

    • 9~36VDC & 24V rail combined, ignition control & OCP/OVP

    • NEXCOM Acceleration Linux (NAL) integrated w/ JetPack 5.1.1

    • Military standard of MIL-STD-810H for anti-vibration/shock

    • CE/FCC, UKCA, E-mark, EN50155 (EN55011, EN50121-3-2, EN61373, OT3) certified

  5. AV600-THT Military IP66 Mission GPU Computer
    AV600-THT Military IP66 Mission GPU Computer

    MIL-STD 810 Thermal, shock, vibration, Humidity/EMI/EMC conditions, IP66 Chassis with D38999 connectors

    Key Features:

    • MIL-STD 810 Thermal, shock, vibration, Humidity / EMI / EMC conditions
    • IP66 Chassis with D38999 connectors
    • Intel® 11th Gen. Tiger Lake(H) W-11865MRE Processors, up to 8 cores
    • Up to 96GB DDR4 SO-DIMM, non-ECC and ECC
    • NVIDIA RTX™ A4500 8GB/16GB GDDR6 memory 5888 CUDA cores
    • Soldered 64 GB NVMe
    • IP65 2 x 2.5” SATA SSD Easy Swap Tray
    • MIL-STD 461 18V~36V DC-Input (Options for MIL-704/1275)
    • Extreme Temperature : -40°C to 70°C
    • Dimensions : 246(L) x 313.5 (W) x 100 (H) mm
  6. AV600TH Military IP66 Mission GPU Computer
    AV600TH Military IP66 Mission GPU Computer

    MIL-STD 810 Thermal, shock, vibration, Humidity/EMI/EMC conditions, IP66 Chassis with D38999 connectors

    Key Features:

    • MIL-STD 810 Thermal, shock, vibration, Humidity / EMI / EMC conditions
    • IP66 Chassis with D38999 connectors
    • Intel® 11th Gen. Tiger Lake(H) W-11865MLE Processors, up to 8 cores
    • 64GB DDR4 SO-DIMM ECC or non ECC support
    • NVIDIA RTX™ A2000 MXM 8GB GDDR6 2560 CUDA cores
    • 2.5” SATA SSD
    • 1x 3G-SDI Capture Card (Options)
    • MIL-STD-461 18V~36V DC-Input
    • Extreme Temperature: -20 to 55°C degrees
  7. eBOX570 Fanless Embedded System with 13th Gen
    eBOX570 Fanless Embedded System with 13th Gen

    Fanless Embedded System with 13th Gen Intel Core i7/i5/Celeron Processor, 2 HDMI, 1 DisplayPort++, 2 LANs, 8 USB, 2 COM, and 12 VDC

    Key Features:

    • 13th gen Intel Core processor (Raptor Lake P)
    • Fanless design with operating temperature from -20°C to 60°C
    • 1 DDR4 SO-DIMM for up to 32GB of memory
    • Supports the USB power on/off control function
    • Supports high-speed NVMe storage (M.2 Key M 2280)
    • Supports Intel® vPro and TPM 2.0
  8. nROK7271 Fanless Vehicle PC 12/13th Gen CPU
    nROK7271 Fanless Vehicle PC 12/13th Gen CPU

    Introducing nROK 7271 (Preliminary): A fanless, rugged rolling stock computer with 12/13th Gen Intel® Core™ CPU, DDR5, 5G/Wi-Fi, and PoE support, designed for industrial computing.

    Key Features:

    • Powered by 12/13th Gen Intel® Core™ CPU
    • Fanless, compact and rugged design
    • Designed with DDR5, excellent memory bandwidth, lower latency
    • 2 x 2.5” SSD for data integrity (compatible with 15mm disk)
    • 5G/Wi-Fi, PoE, 10GbE, daughter board expansion support
    • 4 x Independent 10/100/1000/2500 Mbps PoE 802.3af/at, total 60W (nROK 7271-WIC4) / 30W (nROK 7271-WIC4-C8S)
    • Additional 8-port LAN M12 X-coded, 10/100/1000 Mbps Ethernet Switch GbE, PoE 802.3af/at, max. 30W (nROK7271-WIC4-C8S)
    • EN 50155, class OT3 conformity
    • Wide voltage input 24~110VDC (w/ isolation)
    • Optional up to 3-sec protection against temporary voltage dips
  9. nROK7270 Fanless Vehicle PC 12/13th Gen CPU
    nROK7270 Fanless Vehicle PC 12/13th Gen CPU

    Introducing the nROK 7270: a fanless rolling stock computer with a powerful Intel Core CPU, DDR5 memory, 5G/Wi-Fi, PoE support, and military-standard durability.

    Key Features:

    • Powered by 12/13th Gen Intel Core CPU

    • Fanless, compact and rugged design

    • Designed with DDR5, excellent memory bandwidth, lower latency

    • 2 x 2.5” SSD for data integrity (compatible with 15mm disk)

    • 5G/Wi-Fi, PoE, 10GbE, daughter board expansion support

    • Two video outputs, one VGA and one HDMI

    • 4 x Independent 10/100/1000/2500 Mbps PoE 802.3 af/at, total 60W (nROK 7270-AC4/nROK 7270-AC4-C8S)

    • Additional 8-port LAN M12 X-coded, 10/100/1000 Mbps Ethernet Switch GbE, PoE 802.3af/at, max. 60W (nROK 7270-AC4-C8S)

    • Military standard for anti-vibration/shock

    • EN 50155, class OT3 conformity

  10. AV600-RH Military IP66 AI Edge GPU Computer
    AV600-RH Military IP66 AI Edge GPU Computer

    Military IP66 with D38999 connectors VIDIA RTX A1000/A2000, 2048/2560 CUDA 

    Key Features:

    • MIL-STD 810 Thermal, shock, vibration, Humidity / EMI / EMC conditions
    • IP66 Chassis with D38999 connectors
    • Intel 13th Gen. Raptor Lake (H) i7-13800HE/HRE, 14C , 2.5/5.0 GHz Processor
    • Up to 64GB DDR5 SO-DIMM, non-ECC and ECC
    • NVIDIA RTX A1000/A2000, 2048/2560 CUDA,4GB/8GB GDDR6 RAM
    • MIL-STD-461 EMI Filter18V~36V DC-Input 
    • Extreme Temperature : -40°C to 60°C
    • Dimensions : 250(L) x 325 (W) x 100 (H) mm
  11. Neu-X303mini Edge Computing System 12th Gen CPU
    Neu-X303mini Edge Computing System 12th Gen CPU

    12th Gen. Core CPU, 4 x 4K@60Hz display output, DP, HDMI 2.1, 2 x USB 3.2 Type-C, Dual 2.5G LAN ports, 4 x USB 3.2 and 2 x USB 3.2 Type-C ports for easy connection

    Key Features:

    • 12th Generation Intel Core (Alder Lake - PS) processor SoC
    • Four 4K@60Hz display output, DP, HDMI 2.1 and 2 x USB 3.2 Type-C
    • Dual 2.5G LAN ports, 4 x USB 3.2 and 2 x USB 3.2 Type-C ports for easy connection
    • Onboard M.2 2280 Key M with PCIe signal for storage modules
    • Onboard M.2 2230 Key E for optional Wi-Fi modules
    • Compact design (L: 183mm, W: 137.9mm, H: 47.9mm)
    • 12V DC in
  12. D613 Intel 13th Gen with vPro Technology
    D613 Intel 13th Gen with vPro Technology

    Giada D613 Intel 13th Gen vPro 5G Simultaneous 4K

    Key Features:

    • Intel® 13th Gen. Raptor Lake Processors provide high computing performance and efficiency.
    • Giada D613 supports four display outputs, allowing for simultaneous 4K video playback.
    • Intel® vPro Technology offers integrated hardware-based PC protection, including below-the-OS security and advanced threat detection.
    • The D613 is compatible with a 5G cellular network, providing significantly faster speeds, low latency, and increased capacity.
    • The combination of high-performance cores and efficient cores in the processors optimizes power consumption without sacrificing processing power.
  13. Neu-X304 Edge Computer System 13/12th Gen CPU
    Neu-X304 Edge Computer System 13/12th Gen CPU

    Unleash the potential of multiple AI and edge applications with the Neu-X304

    Key Features:

    • 13/12th Gen Intel® Core™ i9/i7/i5/i3 processors, up to 35W
    • Dual channel DDR5 SO-DIMM, max up to 64GB
    • Support 3 x HDMI 2.0 output, 4K@60Hz
    • Dual Intel® LAN ports
    • Rich Interface : 2 x COM ports, 8 x USB port, Mic-in, Line-out
    • TPM 2.0 onboard
    • Support Intel® AMT technology (Q670E only)
    • Multiple expansion slots: M.2 2280 Key M for storage, M. 2 2230 Key E for Wi-Fi module,
    • M.2 3052 Key B for LTE/5G module
    • Power Input:12V DC or 12~24V DC (Q670E only)
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