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MTE460T & MTE460T-I PCIe M.2 SSDs128GB/256GB/512GB/1TB PCIe M.2 SSD PCIe Gen 3x2 112-layer 3D NAND flash
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USD460T & USD460I microSD CardsmicroSD Cards Utilizing top-quality 3D NAND Flash and rated to endure 3K P/E cycles
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eBOX630A Fanless Embedded System with 11th Gen CoreFanless Embedded System with 11th Gen Intel Core i7/i5/i3 or Celeron Processor, 2 HDMI, 1 DisplayPort, 3 LANs, 6 USB, 4 COM, and 9 to 48 VDC
Key Features:
- 11th gen Intel Core i7/i5/i3 or Celeron Quad-core ULT processor (Tiger Lake UP3)
- Dual-channel DDR4-3200 SO-DIMM for up to 64GB of memory
- Supports 3x 2.5 GbE, 6 USB, 4 COM
- -40°C to +60°C wide operating temperatures
- 9 to 48 VDC wide range DC power input
- Supports triple displays with 2 HDMI, and 1 DisplayPort++
- Intel Iris Xe integrated graphics (i7 & i5 SKUs)
- Trusted platform module (TPM 2.0 onboard)
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MSM362M & MSM362I mSATA mini SSD16/32/64/128GB mSATA mini SSD
Key Features:
- Compliant with RoHS 2.0 standards
- Compliant with JEDEC MO-300B
- MLC NAND flash
- Supports Transcend Scope Pro software
- Promised operational reliability in a wide temperature range (from -40° to 85°C)
- Built-in BCH ECC (Error Correction Code) functionality
- Advanced Global Wear-Leveling and Block management for reliability
- Supports S.M.A.R.T. function to conduct health monitoring, analysis, and reporting for storage devices
- TRIM command for better performance
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USD240I microSD Cards112-layer 3D NAND flash with SLC Mode technology -40℃~85℃ microSDXC memory card
Key Features:
- Built-in LDPC ECC (Error Correction Code) functionality
- Early Move
- Supports S.M.A.R.T. function to conduct health monitoring, analysis, and reporting for storage devices
- Wear-Levelling
- Compliant with RoHS 2.0 standards
- Electrostatic protection (ESD IEC 61000-4-2)
- Compliant with SD specification 6.1
- Compliant with UHS-I
- Compliant with Video Speed Class 30 (V30)
- Compliant with Application Performance Class 2 (A2)
- Endurance: 100K P/E cycles (Program/Erase cycles) guaranteed
- Promised operational reliability in a wide temperature range (from -40°C to 85°C)
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IPC960A Fanless Industrial Computer 13th/12th GenLGA1700 Socket 13th/12th Gen Core i7/i5/i3/Celeron Processor, H610E/Q670E, Front-access I/O
Key Features:
- Fanless embedded system
- Optional extension system I/O module
- Optional 5G network (Q670E)
- Intelligent power management: Ignition, USB power on/off control
- Supports Intel RAID (Q670E)
- EN61000-6-2 certified
- Optional DIN-rail, bookshelf, and wall mount kits
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MTE662P & MTE662P-I PCIe M.2 SSDsPCI Express (PCIe) Gen 3 x4 interface, compatible with NVM Express (NVMe) 1.3, 3D NAND technology
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NUC-APL Fanless NUC System J3455/N3350Intel Apollo Lake Celeron Processor J3455/N3350 Up to 8GB DDR3
Key Features:
- Onboard Intel Celeron Processor J3455/N3350
- Single DRAM Socket, Max. Up to 8GB DDR3 1866MHz
- Rich I/O, 2 x COM, 2 x LAN, 4 x USB3.0, 1 x Audio, 2 x Antennal Mounting
- Triple Display, 2 x HDMI, 1 x DP (DVI-I/VGA Factory Option)
- Expansion Slot, M.2 Key-B, M.2 Key-E
- Fanless Operating from 0°C ~ 60°C
- DC Power Input +12V
- Compact Size, 115mm x 111mm x 58mm
- Supports VESA/Din-Rail Kit
- TPM 2.0 (Factory Option)
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AIE110-ONA Edge AI Developer Kit with NVIDIA Jetson OrinAxiomtek AIE110-ONA Edge AI Developer Kit NVIDIA® Jetson Orin™ Nano SoM
Key Features:
- NVIDIA® Jetson Orin™ Nano (up to 40 TOPS)
- 1 USB 2.0, 1 USB 3.2 Gen2, 1 GbE LAN
- Supports one 15W GbE PoE for camera
- 1 M.2 Key M NVMe SSD slot
- 1 PCI Express Mini Card slot for Wi-Fi/Bluetooth/LTE/GPS
- JetPack supported
- Supports 24/7 secure remote monitoring, control, and OTA deployment empowered by Allxon
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AIE110-ONX Edge AI Developer Kit with NVIDIA® Jetson Orin™Axiomtek AIE110-ONX Edge AI Developer Kit NVIDIA® Jetson Orin™ SoM
Key Features:
- NVIDIA® Jetson Orin™ NX (up to 100 TOPS)
- 1 USB 2.0, 1 USB 3.2 Gen2, 1 GbE LAN
- Supports one 15W GbE PoE for camera
- 1 M.2 Key M NVMe SSD slot
- 1 PCI Express Mini Card slot for Wi-Fi/Bluetooth/LTE/GPS
- JetPack supported
- Supports 24/7 secure remote monitoring, control, and OTA deployment empowered by Allxon
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Neu-X303mini Edge Computing System 12th Gen CPU12th Gen. Core CPU, 4 x 4K@60Hz display output, DP, HDMI 2.1, 2 x USB 3.2 Type-C, Dual 2.5G LAN ports, 4 x USB 3.2 and 2 x USB 3.2 Type-C ports for easy connection
Key Features:
- 12th Generation Intel Core (Alder Lake - PS) processor SoC
- Four 4K@60Hz display output, DP, HDMI 2.1 and 2 x USB 3.2 Type-C
- Dual 2.5G LAN ports, 4 x USB 3.2 and 2 x USB 3.2 Type-C ports for easy connection
- Onboard M.2 2280 Key M with PCIe signal for storage modules
- Onboard M.2 2230 Key E for optional Wi-Fi modules
- Compact design (L: 183mm, W: 137.9mm, H: 47.9mm)
- 12V DC in
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eBOX671B Fanless Embedded System with 13th/12th GeneBOX671B Fanless Embedded System 13th/12th Gen Intel® Core™ 2.5GbE M.2 Key M&E&B USB3.2
Key Features:
- 13th/12th Gen Intel Core i9/i7/i5/i3 and Celeron
- processors with Intel R680E chipset (Alder Lake S)
- Dual DDR5 SO-DIMM for up to 64GB of memory
- 4 LAN with optional PoE supported
- Dual 2.5" SATA HDD drive bays with RAID 0 & 1
- Supports MXM 3.1 Type A, up to 5 display outputs
- -40 °C to +65 °C wide operating temperatures
- Wide range power input from 9 to 36 VDC
- Flexible I/O window supported via mPCIe modules
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TANK-880-Q370 High-Performance 8th/9th Gen PCRuggedized Fanless embedded system with Intel® i7-9700TE 1.8GHz, (up to 3.8GHz, 8-core, TDP 35W), 8GB DDR4 pre-installed memory, 1 x PCIe by 16 & 2 x PCIe by 4 & 1 x PCIe by 1 expansion, HDMI/DP, 9~36V DC, RoHS
Key Features:
- 8th/9th Gen Intel Core processor platform with Intel® Q370 chipset and DDR4 memory
- Dual independent displays with high-resolution support
- Rich high-speed I/O interfaces
- On-board internal power connector for providing power to add-on cards
- Four accessible 2.5” HDD/SSD SATA 6 Gb/s bay (with RAID 0/1/5/10 support)
- Great flexibility for hardware expansion
