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WLE7002E55 MU-MIMO Dual Band Dual Concurrent WiFi 7 Module

SKU: WLE7002E55

WiFi 7 (802.11BE) 2×2 MU-MIMO 5+5GHz Dual Band Dual Concurrent Wireless Module

Key Features:

  • Qualcomm QCN6224/6274 ‘Waikiki’ series for Commercial Grade
  • Qualcomm QCN9274-I ‘Waikiki’ series for Industrial Grade
  • 5GHz, 2×2 MU-MIMO, up to 4324 Mbps physical data rate
  • 5GHz, 2×2 MU-MIMO, up to 4324 Mbps physical data rate
  • Dual-Band Concurrent 5GHz+5GHz WiFi 7 (802.11be)
  • MiniPCIe Interface with PCIe 3.0
  • Based on WK01.4 reference design
  • Supports up to 4096-QAM
  • -20°C to 70°C operating temperature

Description

The WLE7002E55 is a dual-band Wi-Fi 7 (802.11be) module supporting 5GHz Low + 5GHz High operation. Built on Qualcomm’s QCN6274 (commercial grade) or QCN9274 (industrial grade) Waikiki series radios, it delivers a 2T2R (2×2) MU-MIMO solution designed for high-performance wireless applications.

The module supports both AP and STA modes, enabling simultaneous backhaul and client connectivity. With its 3.3V design, the WLE7002E55 splits the 5GHz band into two distinct channels, 5GHz Low and 5GHz High, to minimise interference with nearby 6GHz deployments. This architecture effectively doubles available capacity, ensuring seamless and interference-free performance. When paired with the WLE7002E26, it forms part of the Quad-Band Bundle Solution, optimising network reliability and throughput.

Supporting up to 4096-QAM, along with OFDMA and Multi-Link Operation (MLO), the WLE7002E55 is suited to enterprise, industrial, cybersecurity, transportation, and SMB deployments. Preamble puncturing further improves spectral efficiency by allowing Wi-Fi 7 access points to reuse spectrum segments even when legacy devices are present. The industrial-grade QCN9274 also adds FIPS L2 support, providing enhanced cryptographic security for sensitive applications.

As a Compex-manufactured module, the WLE7002E55 is designed with broad compatibility, operating not only within Qualcomm’s ecosystem but also on third-party platforms such as Intel x86 and ARM processors from NXP and Marvell.

 

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More Information

Brand Compex Systems
Specifications

Chipset

Qualcomm QCN6224/6274 ‘Waikiki’ (Commercial grade)

Qualcomm QCN9274-I ‘Waikiki’ (Industrial grade)

System Memory

2Mbit serial I²C bus EEPROM

Reference Design

WK01.4

Host Interface

MiniPCIe Interface with PCIe 3.0

Operating Voltage

3.3V

Power Consumption

8.5W (Max)

Wireless

2x2 5-LGHz 802.11a/n/ax/be, max 18dBm per chain

2x2 5-HGHz 802.11a/n/ax/be, max 17dBm per chain

2 x U.FL connectors

Frequency Range

5 GHz: 5.180 ~ 5.320GHz, 5.500 ~ 5.825GHz

Modulation Techniques

OFDMA: BPSK, QPSK, DBPSK, DQPSK, 16-QAM, 64-QAM, 256-QAM, 1024-QAM, 4096-QAM

Channel Spectrum Widths

20 / 40 / 80 / 160 / 240 MHz at 5G-L or 5G-H

Operating Systems

Linux

Certification

REACH & RoHS Compliance

Environmental – Temperature

Operating: -20°C to 70°C

Storage: -40°C to 90°C

Environmental – Humidity (Non-Condensing)

Operating: 5% to 95%

Storage: Max. 90%

Dimensions (W × H × D)

30 × 50.8 × 20.3 mm

 

Ordering Information

Item Code

Model

Description

Type

WLE7002E55

7A000SXF-TE

WLE7002E55

QCN6274 2x2

802.11a/n/ac/ax/be support

5+5GHz Dual-Band Concurrent

MiniPCIe interface with PCIe 3.0

Module Sample

WLE7002E55

7A000TXF

WLE7002E55

QCN6224 2x2

802.11a/n/ac/ax/be support

5+5GHz Dual-Band Concurrent

MiniPCIe interface with PCIe 3.0

Module Mass Production

WLE7002E55

7B000NXF-I

WLE7002E55-I

QCN9274-I 2x2

802.11a/n/ac/ax/be support

5+5GHz Dual-Band Concurrent

MiniPCIe interface with PCIe 3.0

Module Mass Production

 

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