CPU |
- Intel® Core™ 8th Gen. i7-8700T, up to 4 GHz, 35W, 6 Core
- Compatible Intel® Core™ 9th Gen. (Coffee Lake Refresh)
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Chipset |
- Intel® Q370 platform controller hub
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Memory |
- 2-Channel 260-pin DDR4 SO-DMIM sockets up to 32GB/channel (64GB for two channels, non-ECC up to 2666 MHz), default 4GB + 4GB industrial grade memory
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Video Output |
- Chipset Intel® UHD Graphics 630
- 1 x HDMI 1.4b up to 4096 x 2160 @ 30Hz
- 1 x VGA up to 1920 x 1200 @ 60Hz
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Storage |
- 2 x 2.5” SATA 3.0 external SSD (compatible with 15mm height), RAID 0/1 supported
- 2 x mSTAT 3.0 (BIOS selection)
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Expansion |
- 1 x M.2 3042/3050/3052 (default) Key B socket (USB 2.0, USB 3.1) for LTE/5G NR module with dual SIM
- 1 x Full-size mini-PCIe socket (USB 2.0) for LTE with dual SIM
Optional M.2 3042 Key B (USB 2.0, USB 3.1) for LTE/5G NR module
- 1 x Full-size mini-PCIe socket (USB 2.0) for LTE with dual SIM
Optional M.2 3042 Key B (USB 2.0, USB 3.1) for LTE/5G NR module
- 1 x Full-size mini-PCIe socket (USB 2.0, PCIe 3.0 & SATA 3.0 [BIOS selection])
- 1 x Full-size mini-PCIe socket (USB 2.0, PCIe 3.0 & SATA 3.0 [BIOS selection])
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GNSS and On Board Sensor |
- 1 x Default U-blox NEO-M8N GNSS module for GPS/Gloness/QZSS/Galileo/Beidou
- Optional modules with dead reckoning available
- TPM 2.0 by Infineon SLB9665TT2
- G Sensor (3-axis, 10-bit resolution)
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Power over Ethernet |
- 4 x Independent LAN, 10/100/1000 Mbps I210-IT GbE, PoE 802.3af/at, max. 60W
- 1 x LAN, 10/100/1000 Mbps I219 support iAMT and WOL
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I/O Interface-Front |
- 20 x LED indicators (including 4 x programmable LED)
- 4 x USB 3.1 type A (5V/1A)
- 6 x Externally accessible SIM card sockets (4 x WWAN + 8 x SIM, BOM option)
- 1 x Reset button
- 1 x Power button with LED
- 2 x 2.5” external SSD
- 11 x SMA antenna hole (GPS/WWAN/WLAN)
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I/O Interface-Rear |
- 4 x RJ45 PoE 802.3af/at, max. 60W
- 1 x RJ45 LAN port, 10/100/1000 Mbps
- 1 x 3-pin terminal block for 9V~36VDC
- 1 x Connector (4 x 2) for 12VDC/2A output, power button, 2 x MDI
- 1 x Mic-in, 2 x Line-out
- 2 x DB9 for full RS232
- 1 x DB9 for full RS232/422/485 (RI, 5V/0.5A, 12V/0.5A)
- 1 x DB15
- 1 x Isolated CANBus 2.0B
- 1 x GPS DR (option)
- 4 x DI and 4 x DO
- 2 x USB 3.1 type A (5V/1A)
- 1 x HDMI 1.4b
- 1 x VGA
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Power Management & Software Support |
- Power input 9~36VDC
- Cranking voltage: 6V~9V (< 30 seconds)
- Reverse protection, OCP & UVP
- Selectable boot-up & shut-down voltage for low power protection by software
- Setting 8-level power on/off delay time by software
- 10~255 seconds WDT support, setup by software
- SDK (Windows/Linux) including utility and sample code
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Operating System |
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Dimensions |
- 260 x 256 x 83.5 (W x D x H) (mm)
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Weight |
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Environment |
- Operating temperatures
- -30°C~60°C (w/ industrial SSD) with air flow
- Storage temperatures: -40°C~80°C
- Relative humidity: 90% (non-condensing)
- Vibration (random)
- [email protected]~500 Hz (in operation, SSD)
- Vibration (SSD)
- Operating: MIL-STD-810G, Method 514.6, Category 4, common carrier US highway truck vibration exposure - Storage: MIL-STD-810G, Method 514.6, Category 24, minimum integrity test
- Shock (SSD)
- Operating: MIL-STD-810G, Method 516.6, Procedure I, functional shock=40g - Non-operating: MIL-STD-810G, Method 516.6, Procedure V, crash hazard shock test=75g
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Certifications |
- CE approval
- FCC Class A
- E13 mark
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