Find Your Technical Solution Below

Tekdis products are categorised into the groups below. Once you select the correct category use the filters to locate the best product for your application.

Depending on the category there are numerous filters to help you identify the ideal solution. If you have other questions or requests we are always available via phone or email and will aim to respond within the hour.

Tekdis can "build to order" a complete solution including Operating System and SSD imaging so systems will be preconfigured out of the box. 

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  1. Products 94 items
  1. Mobile Computing 6 items
  2. Digital Signage 37 items
  3. Industrial Computing 6 items
  4. Panel PCs & Industrial Displays 0 items
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  6. Medical Solutions 0 items
  7. Cameras & LiDAR 4 items
  8. Storage & Memory 45 items
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1-24 of 94 Items

  1. SR700-X4D IP65 MXM-GPU Military Computer Xeon E-2276ME w/ GPU
    SR700-X4D IP65 MXM-GPU Military Computer Xeon E-2276ME w/ GPU

    Quadro RTX A2000 GPU with DTL38999 connector, 9th Gen Intel® Xeon E-2276ME (6C,4.5Ghz) 

    Key Features:

    • IP65 MXM-GPU MIlitary Computer 
    • MIL-STD 810 Thermal, shock, vibration, Humidity, EMI 
    • Quadro® RTX A2000 (CUDA 2560, GDDR6-8GB) ; Options for GTX1050 Ti
    • 9th Gen Intel® Xeon E-2276ME (6C,4.5Ghz) 
    • Up to DDR4-64GB, Options for DDR4-128GB
    • 9V to 36V DC, Options for MIL-STD-461 18V~36V
    • Extended operating temp. -40°C to 60°C
    • Dimension : 360 x 230 x 86 mm (WxDxH)
  2. MTS952P & MTS952P-I SATA III M.2 SSDs
    MTS952P & MTS952P-I SATA III M.2 SSDs

    SATA III 6Gb/s interface 3D NAND technology -20°C to 75°C

    Key Features:

    • Dynamic thermal throttling
    • Built-in LDPC ECC (Error Correction Code) functionality
    • Advanced Garbage Collection
    • Supports S.M.A.R.T. function to conduct health monitoring, analysis, and reporting for storage devices
    • TRIM command for better performance
    • NCQ command for better performance
    • Power-saving DevSleep (Device Sleep) mode
    • Compliant with RoHS 2.0 standards
    • Space-saving M.2 form factor (80mm) – ideal for mobile computing devices
    • DDR3 DRAM Cache embedded
    • Endurance: 3K P/E cycles (Program/Erase cycles) guaranteed
    • Key components fortified by default with Corner Bond technology
    • 30µ" PCB gold finger
    • Power Loss Protection (PLP) to prevent data loss in the event of a sudden power outage
    • Extended Temp. (-20°C ~ 75°C) and Wide Temp. (-40°C ~ 85°C) options available
    • Supports Transcend Scope Pro software
  3. USD240I microSD Cards
    USD240I microSD Cards

    112-layer 3D NAND flash with SLC Mode technology -40℃~85℃ microSDXC memory card

    Key Features:

    • Built-in LDPC ECC (Error Correction Code) functionality
    • Early Move
    • Supports S.M.A.R.T. function to conduct health monitoring, analysis, and reporting for storage devices
    • Wear-Levelling
    • Compliant with RoHS 2.0 standards
    • Electrostatic protection (ESD IEC 61000-4-2)
    • Compliant with SD specification 6.1
    • Compliant with UHS-I
    • Compliant with Video Speed Class 30 (V30)
    • Compliant with Application Performance Class 2 (A2)
    • Endurance: 100K P/E cycles (Program/Erase cycles) guaranteed
    • Promised operational reliability in a wide temperature range (from -40°C to 85°C)
  4. IB4-271 Long Life Cycle Thin Mini-ITX Motherboard
    IB4-271 Long Life Cycle Thin Mini-ITX Motherboard

    Giada IB4-271, a slim Mini-ITX motherboard featuring Elkhart Lake Celeron J6412 with a 10W TDP, is aligned with Intel® IOTG's roadmap, ensuring a 7+ years lifespan and notable performance enhancements.

    Key Features:

    • Elkhart Lake platform delivers up to 1.7x improvement in single-thread and 1.5x improvement in multi-thread performance.
    • Three display outputs (DP, HDMI, LVDS) with 4K support via HDMI (4096 x 2160 @60 Hz) and DP (4096 x 2160 @60 Hz) powered by Intel® UHD Graphics.
    • Wi-Fi 5/6 support for high-speed data transfer and seamless connectivity to various peripherals.
    • Fanless design with a passive thermal cooling system reduces failure rates, ensuring noise-free and dustproof operation for mission-critical applications.
  5. AV600X-CH Military IP66 Mission GPU Computer
    AV600X-CH Military IP66 Mission GPU Computer

    MIL-STD 810 Thermal, shock, vibration, Humidity/EMI/EMC conditions, IP66 Chassis with D38999 connectors

    Key Features:

    • MIL-STD 810 Thermal, shock, vibration, Humidity/EMI/EMC conditions
    • IP66 Chassis with D38999 connectors
    • Intel® 9th Gen. Coffee Lake (H) Xeon® E-2276ML processor
    • Up to 128GB DDR4 SO-DIMM, non-ECC and ECC
    • NVIDIA RTX™ A1000, 2048 CUDA® cores, 4GB GDDR6 memory
    • NVMe 3.0 512GB.(MB/sec, Max.) 3,400/3,200 MB
    • MIL-STD-461 18V~36V DC-Input (Options for MIL-704/1275)
    • Extreme Temperature : -40°C to 55°C
    • Optional with External GPU Turbo Kit
    • Dimensions : 250(L) x 313.5 (W) x 100 (H) mm
  6. Transcend 470K 2.5" SATA SSDs
    Transcend 470K 2.5" SATA SSDs

    128GB/256GB/512GB/1TB/2TB/4TB 2.5" SATA SSDs SATA III 6Gb/s 3D NAND DRAM

    Hardware Features:

    • Compliant with RoHS 2.0 standards
    • DDR3 DRAM Cache embedded
    • Endurance: 3K P/E cycles (Program/Erase cycles) guaranteed
    • Promised operational reliability in a wide temperature range (from -40°C to 85°C)
    • Promised operational reliability in an extended temperature range (from -20°C to 75°C)
    • Supports Transcend Scope Pro software
  7. MTS970P SATA III M.2 PLP SSD
    MTS970P SATA III M.2 PLP SSD

    Transcend's MTS970P M.2 SSD combines Power Loss Protection (PLP) with a SATA III 6Gb/s interface, 3D NAND technology at 112 layers, and various durability features for enhanced storage efficiency and reliability in mission-critical applications.

    Key Features:

    • Compliant with RoHS 2.0 standards
    • Space-saving M.2 form factor (80mm) – ideal for mobile computing devices
    • DDR3 DRAM Cache embedded
    • Endurance: 3K P/E cycles (Program/Erase cycles) guaranteed
    • Key components fortified by default with Corner Bond technology
    • 30µ" PCB gold finger
    • Anti-sulfur technology implemented to prevent sulfurization in the environment
    • Power Loss Protection (PLP) to prevent data loss in the event of a sudden power outage
    • Promised operational reliability in a wide temperature range (from -40°C to 85°C)
  8. F108D Booksize Fanless Signage Player 4K Display
    F108D Booksize Fanless Signage Player 4K Display

    Compact, fanless Intel Alder Lake-N powered PC for digital signage and kiosks. Features versatile I/O ports, high-quality graphics, and reliable operation in mission-critical scenarios.

    Key Features:

    • Powered by Intel® Alder Lake-N processors (6-15W) for low-power efficiency.
    • Book-size design tailored for digital signage and kiosk applications.
    • Rich I/O ports, including dual COM ports, 6 USB Type-A, and dual LAN ports.
    • Easily integrates into vending machines, self-service kiosks, and check-in kiosks.
    • Intel® UHD Graphics with DP and two HDMI ports supporting resolutions up to 4096 x 2160@60Hz.
    • Fanless design with passive thermal cooling for noise-free and dustproof operation.
    • Ideal for mission-critical applications with reduced failure rates.
  9. AV600-THT Military IP66 Mission GPU Computer
    AV600-THT Military IP66 Mission GPU Computer

    MIL-STD 810 Thermal, shock, vibration, Humidity/EMI/EMC conditions, IP66 Chassis with D38999 connectors

    Key Features:

    • MIL-STD 810 Thermal, shock, vibration, Humidity / EMI / EMC conditions
    • IP66 Chassis with D38999 connectors
    • Intel® 11th Gen. Tiger Lake(H) W-11865MRE Processors, up to 8 cores
    • Up to 96GB DDR4 SO-DIMM, non-ECC and ECC
    • NVIDIA RTX™ A4500 8GB/16GB GDDR6 memory 5888 CUDA cores
    • Soldered 64 GB NVMe
    • IP65 2 x 2.5” SATA SSD Easy Swap Tray
    • MIL-STD 461 18V~36V DC-Input (Options for MIL-704/1275)
    • Extreme Temperature : -40°C to 70°C
    • Dimensions : 246(L) x 313.5 (W) x 100 (H) mm
  10. AV600TH Military IP66 Mission GPU Computer
    AV600TH Military IP66 Mission GPU Computer

    MIL-STD 810 Thermal, shock, vibration, Humidity/EMI/EMC conditions, IP66 Chassis with D38999 connectors

    Key Features:

    • MIL-STD 810 Thermal, shock, vibration, Humidity / EMI / EMC conditions
    • IP66 Chassis with D38999 connectors
    • Intel® 11th Gen. Tiger Lake(H) W-11865MLE Processors, up to 8 cores
    • 64GB DDR4 SO-DIMM ECC or non ECC support
    • NVIDIA RTX™ A2000 MXM 8GB GDDR6 2560 CUDA cores
    • 2.5” SATA SSD
    • 1x 3G-SDI Capture Card (Options)
    • MIL-STD-461 18V~36V DC-Input
    • Extreme Temperature: -20 to 55°C degrees
  11. PSD330 2.5" PATA SSDs
    PSD330 2.5" PATA SSDs

    Offers high-speed UDMA Mode 6, and offers installation flexibility for desktops, laptops or portable devices built around the 2.5" PATA (IDE) storage device standard

    Key Features:

    • Based on Ultra DMA Mode 4
    • Built-in ECC (Error Correction Code) functionality
    • Advanced Global Wear-Leveling and Block management for reliability
    • Static Data Refresh
    • Supports S.M.A.R.T. function to conduct health monitoring, analysis, and reporting for storage devices
    • Security Command
    • Compliant with RoHS 2.0 standards
    • MLC NAND flash
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