Find Your Technical Solution Below

Tekdis products are categorised into the groups below. Once you select the correct category use the filters to locate the best product for your application.

Depending on the category there are numerous filters to help you identify the ideal solution. If you have other questions or requests we are always available via phone or email and will aim to respond within the hour.

Tekdis can "build to order" a complete solution including Operating System and SSD imaging so systems will be preconfigured out of the box. 

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  1. Products 60 items
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25-48 of 60 Items

  1. EMS-TGL Fanless Rugged Embedded System 11th Gen
    EMS-TGL Fanless Rugged Embedded System 11th Gen

    11th Gen. Core i7/i5/i3 BGA Processor, Rich I/O, support 5G module, fanless operation temperature -40°C ~ 70°C

    Key Features:

    • On board 11th Gen. Intel Core i7/i5/i3 BGA Processor
    • 2x 260-pin SODIMM socket Max. up to 64GB DDR4 3200MT/s
    • Rich I/O, 4-USB3.1, 1-DP, 1-HDMI, 2-COM, 2-LAN, 1-8bit GPIO.
    • Support 5G (Sub-6G) module, M.2 NVMe SSD Gen. III x 4, HDMI 2.0b (4K @ 60Hz), LAN 2.5G BaseTx GbE
    • Fanless operation temperature from -40°C ~ 70°C (WT) / 0°C ~ 70°C (ST)
    • CE, FCC Class B, IP50
    • Wide range DC power input from +9~32V
    • Support HW TPM 2.0
    • Support vPro
  2. ACS10-TGU 11th Gen Intel Fanless Compact System
    ACS10-TGU 11th Gen Intel Fanless Compact System

    Compact and easy to set up, highly expandable I/O interfaces and flexible storage design, and supports high-resolution graphics

    Key Features:

    • 11th Gen Intel Core i5/i3 Tiger Lake-UP3 Processor
    • Intel Iris Xe/ UHD Graphics Engine
    • 1-260-pin DDR4 3200MHz SO-DIMM, Supports Up to 32GB
    • 2-Gigabit Ethernet, 1 x 2.5GbE, 1 x 1GbE
    • 2-COM Port (RS-232/422/485 & RS-232)
    • 2-Audio Jack (Line-Out & Mic-In)
    • 2-Storage (M.2 Key-M NVMe & M.2 Key-B SATA)
    • 2-Expansion Slot (M.2 Key-E, Key-B)
    • 6-USB Port (3-USB 3.2 & 3-USB 2.0)
    • CE, FCC Class A, UKCA
  3. AIE900A-AO Fanless Edge AI System w/ NVIDIA Jetson AGX Orin
    AIE900A-AO Fanless Edge AI System w/ NVIDIA Jetson AGX Orin

    Fanless Edge AI System with NVIDIA Jetson AGX Orin, 2 2.5GbE, 8 PoE, and 2 COM/CAN for 5G and Robotics Applications

    Key Features:

    • NVIDIA Jetson AGX Orin with 1792-core NVIDIA Ampere GPU
    • 1 M.2 Key B slot for 5G/LTE, 1 M.2 Key E slot for Wi-Fi 6(E)
    • 24 VDC with ignition power control
    • Supports eight PoE for IP cameras and LiDAR connectivity
    • -30°C to +50°C operating temperature range
    • Supports device management and optional OTA deployment powered by Allxon
  4. eBOX630A Fanless Embedded System with 11th Gen Core
    eBOX630A Fanless Embedded System with 11th Gen Core

    Fanless Embedded System with 11th Gen Intel Core i7/i5/i3 or Celeron Processor, 2 HDMI, 1 DisplayPort, 3 LANs, 6 USB, 4 COM, and 9 to 48 VDC

    Key Features:

    • 11th gen Intel Core i7/i5/i3 or Celeron Quad-core ULT processor (Tiger Lake UP3)
    • Dual-channel DDR4-3200 SO-DIMM for up to 64GB of memory
    • Supports 3x 2.5 GbE, 6 USB, 4 COM
    • -40°C to +60°C wide operating temperatures
    • 9 to 48 VDC wide range DC power input
    • Supports triple displays with 2 HDMI, and 1 DisplayPort++
    • Intel Iris Xe integrated graphics (i7 & i5 SKUs)
    • Trusted platform module (TPM 2.0 onboard)
  5. NDiS-B560 8/9th Gen Fanless Embedded PC
    NDiS-B560 8/9th Gen Fanless Embedded PC

    Wide Temp Fanless Embedded PC - 8th/9th Gen Intel Core - 3 x HDMI

    Key Features:

    • Support 9th and 8th Gen Intel Core i9/i7/i5/i3 LGA socket type embedded processor, up to 35W
    • Intel integrated UHD 630 graphic engine
    • Support 3 x independent 4K2K 60Hz display output
    • 3 x HDMI 2.0, 6 x USB 3.0, 2 x GbE LAN, 4 x COM, 1 x Line-out, 1 x Mic-in
    • Support M.2 Key B/E/M
    • Fanless design
    • Support extended temperature -20~60°C
  6. NDiS-B338 Fanless Embedded PC Celeron J6412
    NDiS-B338 Fanless Embedded PC Celeron J6412

    Slim/fanless player with extended temperature durability, HDMI display, USB 3.0 ports, and a RS232/RS422/RS485 interface

    Key Features:

    • Intel Celeron J6412 processor
    • Support 3 x HDMI 2.0 output
    • Support 12V~24V DC input
    • Compact and slim design (H: 38.8mm)
    • 2 x DDR4 up to 32G
    • 1 x M.2 2280 Key M for optional storage device
    • 1 x M.2 3042/3052 Key B for optional LTE or 5G modules
    • 1 x mini-PCIe for optional Wi-Fi and LTE
    • Fanless design
  7. NISE-109 Compact Fanless Embedded System
    NISE-109 Compact Fanless Embedded System

    Celeron Processor J6412 Quad Core, 2.0GHz/Atom Processor x6211E Dual Core, 1.3GHZ

    Key Features:

    • Onboard Intel Celeron processor J6412 2.0Ghz or Atom processor x6211E 1.3Ghz
    • Dual display port: 1 x HDMI & 1 x DP
    • 2 x Intel I210-IT GbE LAN ports; support WoL, teaming, PXE, and Ethercat
    • 3 x USB 3.0 & 3 x USB 2.0
    • 2 x RS232 & 2 x RS232/422/485
    • Support 1 x 2.5” SSD & 1 x M.2 Key B storage
    • Support 9~30V DC input; support ATX power mode
    • Operation temperature
      - Intel Celeron J6412: -10°C to 60°C
      - Intel Atom x6211E: -20°C to 70°C
    • Support 1 x M.2 & 1 x mini-PCIe expansion slot
    • Support TPM 2.0
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