Find Your Technical Solution Below
Tekdis products are categorised into the groups below. Once you select the correct category use the filters to locate the best product for your application.
Depending on the category there are numerous filters to help you identify the ideal solution. If you have other questions or requests we are always available via phone or email and will aim to respond within the hour.
Tekdis can "build to order" a complete solution including Operating System and SSD imaging so systems will be preconfigured out of the box.
-
NDiS-B561 12th Gen Fanless Edge PC PoE Option
Visual Edge PC 12th Gen Core Processor -20~60°C 1 x HDMI 2.1 2 x HDMI 2.0 8 x USB 3.2 4 x COM
Key Features:
- Support 12th Gen Intel Core i9/i7/i5/i3 LGA socket type embedded processor, up to 35W
- Intel Q670E
- Intel integrated UHD graphic engine driven by Xe architecture
- Support 3 independent 4K2K@60Hz display outputs. HDMI 2.1 resolution can be up to 8K@60Hz
- 1 x HDMI 2.1, 2 x HDMI 2.0
- 8 x USB 3.2, 4 x COM,
- 1 x GbE LAN, 2 x 2.5G GbE LAN (PoE for B561-PoE)
- Support M.2 Key B/E/M
- Support extended temperature -20~60°C (B561 only)
- Fanless design
-
aROK5510 - EN50155 2U 8/9th Gen CPU Rail Server
Intel Core 8/9th Gen/Xeon CPU with Rich Storage Powerful Platform for AI Application and Storage Server
Key Features:
- Intel Coffee Lake S/Refresh 8th/9th-Gen Core/Xeon LGA1151 socket-type CPU
- 100W power consumption graphics card support
- Eight SIM cards + four WWAN modules support
- LTE/5G WWAN module support
- 6 x External SSD for RAID 0, 1, 5, 10
- PCle 3.0 x4 NVMe 1.3 high-performance SSD support
- EN 50155, class OT4 conformity
- 3 x mini-PCIe + 3 x M.2 socket expansion
- Smart fan design with temperature-based RPMs
- Optional expansion module for 4 x PoE M12 or 2 x 10GbE SFP+
- Rackmount platform
-
VTC7270 Fanless AI Powered Vehicle Computer
12/13th Gen Intel Core CPU 2 x 2.5GbE, 1 x GbE, 6 x USB 3.2, 2 x CAN FD & 4 x Serials, extra 4 x 2.5GbE PoE
Key Features:
- Powered by 12/13th Gen Intel® Core™ i with DDR5, excellent memory bandwidth, lower latency
- Rich I/Os, 2 x 2.5GbE, 1 x GbE, 6 x USB 3.2, 2 x CAN FD & 4 x Serials, extra 4 x 2.5GbE PoE (option)
- 2 x 2.5” SSD, 1 x NVMe ultra-speed SSD for data integrity
- Up to 4 WWAN/WLAN combinations for mobile router applications
- Up to two Hailo AI accelerator (26TOPS workload each) computing power in option
- 9~36V DC-IN with ignition control & OCP/OVP
- Wide range operating temperature of -40°C~70°C (fanless@35W CPU)
- Military standard for anti-vibration/shock
- CE/FCC, UKCA, Emark Certified
-
VTC7260-x Fanless AI-Aided Vehicle Computer
Fanless AI-aided Vehicle Computer with Intel Core 11th Gen CPU
Key Features:
- Intel 11th Gen Tiger Lake UP3, cost-efficient performance
- Compact, rugged and fanless design
- Rich I/Os, 2 x 2.5GbE, GbE, 4 x USB 3.2/2.0 & 3 x RS232/422/485
- 1 x 2.5” SSD, 1 x mSATA and 1 x NVMe SSD for data integrity
- Up to 3 combinations of LTE/5G, and Wi-Fi 5/6 for mobile router function
- Triple display, VGA, HDMI and DP for multi video-out
- 9~36V DC-IN with ignition control & OCP/OVP
- Wide range operating temperature of -30°C~65°C (15W TDP)
- Military standard of anti-vibration/shock for OHV applications
- CE/FCC, UKCA, Emark Certified
-
VTC7252-7C4IP - IP65 Fanless 4-CH PoE IP65 Vehicle Computer Intel Core 9th CPU
Fanless 4-CH PoE IP65 Vehicle Computer with Intel® Core™ 9th CPU
-
eBOX640-500-FL Fanless Embedded System with 7th/6th Gen
Fanless Embedded System with LGA1151 Socket 7th/6th Gen Intel® Core™ & Celeron® Processor, Intel® H110, HDMI, DisplayPort, VGA, 6 USB, 4 COM, PCI Express Mini Card Slot and 10 to 30 VDC
-
NDiS-V1100 Fanless Embedded Computer 11th Gen
Fanless Embedded Computer Powered by 11th Gen Intel Core Processor
-
MANO522 Mini-ITX SBC 9th/8th Gen i7/i5/i3
Mini-ITX SBC with LGA1151 8th Gen Intel Core i7/i5/i3 Processor, HDMI, VGA, LVDS, USB 3.2 Gen 1, mSATA, M.2 and Dual GbE LAN
Key Features:
- LGA1151 9th/8th gen Intel Core i7/i5/i3 processor
- Intel H310 chipset
- 2 DDR4 SO-DIMM for up to 64GB of memory
- 4 USB 3.2 Gen 1 and 2 USB 2.0
- 6 COM ports
- 2 SATA-600 and 1 mSATA
- PCIe x16 and M.2 Key E
-
VTC7260-5HBIoT/7HBIoT Fanless AI-Aided Vehicle Computer
Fanless AI-aided Vehicle Computer with Intel Core 11th Gen CPU 9~36V DC-IN with ignition control
Key Features:
- Intel 11th Gen Tiger Lake UP3, cost-efficient performance
- Compact, rugged and fanless design
- Rich I/Os, 2 x 2.5GbE, GbE, 4 x USB 3.2/2.0 & 3 x RS232/422/485
- 1 x 2.5” SSD, 1 x mSATA and 1 x NVMe SSD for data integrity
- Up to 3 combinations of LTE/5G, Wi-Fi 5/6 for mobile router function
- Triple display, VGA, HDMI and DP for multi video-out
- 9~36V DC-IN with ignition control & OCP/OVP
- Wide range operating temperature of -30°C~65°C (15W TDP)
- Military standard of anti-vibration/shock for OHV applications
- CE/FCC, UKCA, Emark Certified
-
eBOX800-841-FL Rugged IP67 Fanless Embedded System Atom
Rugged IP67-rated Fanless Embedded System with Intel® Atom® Processor E3845, VGA, 2 GbE LANs, 2 USB, 2 COM and 9 to 36
-
AIE900A-AO Fanless Edge AI System w/ NVIDIA Jetson AGX Orin
Fanless Edge AI System with NVIDIA Jetson AGX Orin, 2 2.5GbE, 8 PoE, and 2 COM/CAN for 5G and Robotics Applications
Key Features:
- NVIDIA Jetson AGX Orin with 1792-core NVIDIA Ampere GPU
- 1 M.2 Key B slot for 5G/LTE, 1 M.2 Key E slot for Wi-Fi 6(E)
- 24 VDC with ignition power control
- Supports eight PoE for IP cameras and LiDAR connectivity
- -30°C to +50°C operating temperature range
- Supports device management and optional OTA deployment powered by Allxon
-
VTC7260-xC4 Fanless AI-Aided Vehicle Computer
Fanless AI-aided Vehicle Computer with Intel Core 11th Gen CPU
Key Features:
- Intel 11th Gen Tiger Lake UP3, cost-efficient performance
- Compact, rugged and fanless design
- Rich I/Os, 4 x PoE+, GbE, 4 x USB 3.2/2.0&2 x RS232/422/485
- 1 x 2.5” SSD, 1 x mSATA and 1 x NVMe SSD for data integrity
- Up to 3 combinations of LTE/5G, and Wi-Fi 5/6 for mobile router function
- Triple display, VGA, HDMI and DP for multi video-out
- 9~36V DC-IN with ignition control & OCP/OVP
- Wide range operating temperature of -30°C~60°C (15W TDP&PoE)
- Military standard of anti-vibration/shock for OHV applications
- CE/FCC, UKCA, Emark Certified
-
IPC960A Fanless Industrial Computer 13th/12th Gen
LGA1700 Socket 13th/12th Gen Core i7/i5/i3/Celeron Processor, H610E/Q670E, Front-access I/O
Key Features:
- Fanless embedded system
- Optional extension system I/O module
- Optional 5G network (Q670E)
- Intelligent power management: Ignition, USB power on/off control
- Supports Intel RAID (Q670E)
- EN61000-6-2 certified
- Optional DIN-rail, bookshelf, and wall mount kits
-
IPC962A Two-slot Industrial System 12th Gen
LGA1700 Socket 12th Gen Intel Core i7/i5/i3 or Celeron Processor, Intel H610E/Q670E, Front-access I/O, and PCIe & PCI Slots
Key Features:
- 2 PCIe/PCI slots
- Optional extension system I/O window
- Optional 5G network (Q670E)
- USB power on/off control via BIOS setting
- Intelligent power management - ACC ignition
- EN 61000-6-2 certified
- Supports Intel RST
-
ATC3530 Jetson Xavier NX Accelerated AI Edge Computer
ATC3530 NVIDIA Jetson Xavier NX Solution Accelerated AI Edge Computer
Key Features:
- AI Edge In-vehicle computer
- 4-Ch MIPI SerDes, 1080p60/4Kp30 over 15m cable (ATC 3530-IP7-4M)
- Built-in NVIDIA Jetson Xavier NX SOM, up to 21 TOPS compute
- 4-port GbE PoE+ for IP CAM/LiDAR sensors (ATC 3530-IP7-4C)
- HEVC/H.265 hardware CODEC, 32 x 1080p30 compute power
- Wide range operating temperature of -30~70°C
- The rugged, fanless design with an IP67 rating
- Ultra-speed PCIe 3.0 x4 NVMe SSD for data integrity
- NEXCOM Aided Linux (NAL) OS w/ JetPack4.5 integrated
- Expansible for LTE/5G NR & Wi-Fi 5/6
- 9~36V DC-in with ignition control & OCP/OVP
- CE/FCC, UKCA, Emark certified
-
IPC964A Four-slot Industrial System 12th Gen
LGA1700 Socket 12th Gen Intel Core i7/i5/i3 or Celeron Processor, Intel Q670E, Front-access I/O, and PCIe & PCI Slots
Key Features:
- 4 PCIe/PCI slots
- Optional extension system I/O window
- Optional Support 5G network (Q670E)
- USB power on/off control via BIOS setting
- Intelligent power management - ACC ignition
- EN 61000-6-2 certified
- Supports Intel RST
-
NDiS-B360 11th Gen Core Slim Wide Temp Embedded Computer
11th Gen Core Wide Temp -20~60°C embedded PC
Key Features:
- 11th Generation Intel Tiger Lake-UP3 Core processor SoC
- Dual 4K@60Hz display output, DP++, HDMI 2.0
- Support 4K@60Hz eDP display output
- Compact and slim design (H: 36mm)
- Dual LAN ports and USB3.0 ports for easy connection
- On-board M.2 Key M 2280 with PCIex4/SATA signal for storage module
- On-board M.2 Key E 2230 for optional WiFi modules
-
ICO330 DIN-Rail Fanless Embedded System
Intel Atom 3 x 2.5GbE LAN Isolated COM & DIO Fanless System
Key Features:
- Cost-effective with fanless design
- Intel Atom® x6212RE or x6414RE processor
- 6 isolated COM, isolated DIO (8-in/8-out), 3 2.5 GbE LAN
- Wide operating temperature range from -40°C to +70°C
- 9 to 36 VDC, typical 12-24V power input with OVP, UVP, OCP, RPP
- Supports TPM 2.0
- Supports cold boot at -40°C
-
eBOX630A Fanless Embedded System with 11th Gen Core
Fanless Embedded System with 11th Gen Intel Core i7/i5/i3 or Celeron Processor, 2 HDMI, 1 DisplayPort, 3 LANs, 6 USB, 4 COM, and 9 to 48 VDC
Key Features:
- 11th gen Intel Core i7/i5/i3 or Celeron Quad-core ULT processor (Tiger Lake UP3)
- Dual-channel DDR4-3200 SO-DIMM for up to 64GB of memory
- Supports 3x 2.5 GbE, 6 USB, 4 COM
- -40°C to +60°C wide operating temperatures
- 9 to 48 VDC wide range DC power input
- Supports triple displays with 2 HDMI, and 1 DisplayPort++
- Intel Iris Xe integrated graphics (i7 & i5 SKUs)
- Trusted platform module (TPM 2.0 onboard)
-
NDiS-B560 8/9th Gen Fanless Embedded PC
Wide Temp Fanless Embedded PC - 8th/9th Gen Intel Core - 3 x HDMI
Key Features:
- Support 9th and 8th Gen Intel Core i9/i7/i5/i3 LGA socket type embedded processor, up to 35W
- Intel integrated UHD 630 graphic engine
- Support 3 x independent 4K2K 60Hz display output
- 3 x HDMI 2.0, 6 x USB 3.0, 2 x GbE LAN, 4 x COM, 1 x Line-out, 1 x Mic-in
- Support M.2 Key B/E/M
- Fanless design
- Support extended temperature -20~60°C
-
ATC8110/8110-F i7 Mobile Expandable AI PC
Intel Coffee Lake S/Refresh + Inference Accelerator AI Powered for Autonomous and Machine Vision
Key Features:
- In-vehicle AI recognition and machine vision applications
- Fanless/fan flexibility design
- Up to 8-core Intel® Coffee Lake S/Refresh processing power
- 3 x PCIe 3.0 slots for Discrete Graphics/Inference/Frame Grabber cards
- Ultra-fast U.2/M.2 NVMe media for high-speed multi-cameras image capture
- RAID 0/1/5/10 configurable for data secure and integrity
- Wide-range 9~36VDC input with Ignition management
- Rich communication ports, 5 x USB 3.1, 2 x GbE and 4 x RS232/422/485
- Telemetric functionality of WWAN/5G NR, WLAN and GNSS with up to 4 x 4 MIMO and 4 SIM slots
- Compliant with E-mark, CE/FCC ClassA and MIL-STD-810G for anti-vibration/shock w/ graphics card installed
- Realize M-2-M through CAT-M (NB-IoT & eMTC)
-
ICO120-E3350 DIN-rail Fanless Embedded System Celeron N3350
DIN-rail Fanless Embedded System with Intel Celeron Processor N3350, COM/CAN/DIO, 2 LAN, 2 USB, and HDMI
Key Features:
- Extreme cost-effective with fanless and cableless design
- Intel Celeron processor N3350, reliable F1 stepping version CPU
- COM/CAN/DIO, 2 USB, and 2 GbE LAN
- Wide operating temperature range from -40°C to +70°C
- 9 to 36 VDC wide range power input (typical: 12-24 VDC)
- OVP, UVP, OCP, RPP power protection design
- eAPI for intelligent remote monitoring software integration
-
NDiS-B338 Fanless Embedded PC Celeron J6412
Slim/fanless player with extended temperature durability, HDMI display, USB 3.0 ports, and a RS232/RS422/RS485 interface
Key Features:
- Intel Celeron J6412 processor
- Support 3 x HDMI 2.0 output
- Support 12V~24V DC input
- Compact and slim design (H: 38.8mm)
- 2 x DDR4 up to 32G
- 1 x M.2 2280 Key M for optional storage device
- 1 x M.2 3042/3052 Key B for optional LTE or 5G modules
- 1 x mini-PCIe for optional Wi-Fi and LTE
- Fanless design
-
IPC972 Industrial System Xeon/10th Gen i7/i5/i3 , Intel W480E, Front-access I/O, and PCIe Slots
Edge Computer with Dual GPU Expansion for AI Accelerated Processing