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VTC7260-5HCIoT/7HCIoT Fanless AI-Aided Vehicle ComputerFanless AI-aided Vehicle Computer with Intel Core 11th Gen CPU, 4 x PoE + 1 x GbE, 1 x USB 2.0, 3 x USB 3.2, 2 x RS232/422/485, 1 x 2.5”SSD, 1 x mSATA, 9~36VDC/IGN
Key Features:
- Intel 11th Gen Tiger Lake UP3, cost-efficient performance
- Compact, rugged and fanless design
- Rich I/Os, 4 x PoE+, GbE, 4 x USB 3.2/2.0 & 2 x RS232/422/485
- 1 x 2.5” SSD, 1 x mSATA and 1 x NVMe SSD for data integrity
- Up to 3 combinations of LTE/5G, Wi-Fi 5/6 for mobile router function
- Triple display, VGA, HDMI and DP for multi video-out
- 9~36V DC-IN with ignition control & OCP/OVP
- Wide range operating temperature of -30°C~60°C (15W TDP&PoE)
- Military standard of anti-vibration/shock for OHV applications
- CE/FCC, UKCA, Emark Certified
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VTC7260-5GCIoT/7GCIoT Fanless AI-Aided Vehicle ComputerFanless AI-aided Vehicle Computer with Intel Core 11th Gen CPU, 4 x 2.5GbE + 1 x GbE, 1 x USB 2.0,
3 x USB 3.2, 2 x RS232/422/485, 1 x 2.5”SSD, 1 x mSATA, 9~36VDC/IGNKey Features:
- Intel 11th Gen Tiger Lake UP3, cost-efficient performance
- Compact, rugged and fanless design
- Rich I/Os, 4 x PoE+, GbE, 4 x USB 3.2/2.0 & 2 x RS232/422/485
- 1 x 2.5” SSD, 1 x mSATA and 1 x NVMe SSD for data integrity
- Up to 3 combinations of LTE/5G, Wi-Fi 5/6 for mobile router function
- Triple display, VGA, HDMI and DP for multi video-out
- 9~36V DC-IN with ignition control & OCP/OVP
- Wide range operating temperature of -30°C~60°C (15W TDP&PoE)
- Military standard of anti-vibration/shock for OHV applications
- CE/FCC, UKCA, Emark Certified
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eBOX630A Fanless Embedded System with 11th Gen CoreFanless Embedded System with 11th Gen Intel Core i7/i5/i3 or Celeron Processor, 2 HDMI, 1 DisplayPort, 3 LANs, 6 USB, 4 COM, and 9 to 48 VDC
Key Features:
- 11th gen Intel Core i7/i5/i3 or Celeron Quad-core ULT processor (Tiger Lake UP3)
- Dual-channel DDR4-3200 SO-DIMM for up to 64GB of memory
- Supports 3x 2.5 GbE, 6 USB, 4 COM
- -40°C to +60°C wide operating temperatures
- 9 to 48 VDC wide range DC power input
- Supports triple displays with 2 HDMI, and 1 DisplayPort++
- Intel Iris Xe integrated graphics (i7 & i5 SKUs)
- Trusted platform module (TPM 2.0 onboard)
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ATC3750-6C NVIDIA Jetson AGX Orin Edge AI ComputerNVIDIA Jetson AGX Orin Solution Performance Edge AI Computing for Rail
Key Features:
- Built-in NVIDIA Jetson AGX Orin SOM, up to 200/275 TOPS (INT8) performance
- Designed with rugged, compact and the hybrid thermal solutions
- 6-port GbE PoE+ (x-coded) for IP CAM/LiDAR sensors, optional 1-port 10GbE (x-coded)
- HEVC/H.265 hardware DECODE@ 6 x 4K30 performance
- Wide range operating temperature of -30°C~70°C
- Ultra-speed PCIe 4.0 x4 NVMe SSD for data integrity
- Expansible for GNSS, LTE/5G NR & Wi-Fi 5/6
- 24V DC-IN for rail, ignition control & OCP/OVP
- NEXCOM Acceleration Linux (NAL) integrated w/ JetPack 5.1.1
- Military standard of MIL-STD-810H for anti-vibration/shock
- CE/FCC, UKCA, EN50155 (EN55011, EN50121-3-2, EN61373, OT4) Certified
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VTC7260-x Fanless AI-Aided Vehicle ComputerFanless AI-aided Vehicle Computer with Intel Core 11th Gen CPU
Key Features:
- Intel 11th Gen Tiger Lake UP3, cost-efficient performance
- Compact, rugged and fanless design
- Rich I/Os, 2 x 2.5GbE, GbE, 4 x USB 3.2/2.0 & 3 x RS232/422/485
- 1 x 2.5” SSD, 1 x mSATA and 1 x NVMe SSD for data integrity
- Up to 3 combinations of LTE/5G, and Wi-Fi 5/6 for mobile router function
- Triple display, VGA, HDMI and DP for multi video-out
- 9~36V DC-IN with ignition control & OCP/OVP
- Wide range operating temperature of -30°C~65°C (15W TDP)
- Military standard of anti-vibration/shock for OHV applications
- CE/FCC, UKCA, Emark Certified
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IPC964A Four-slot Industrial System 12th GenLGA1700 Socket 12th Gen Intel Core i7/i5/i3 or Celeron Processor, Intel Q670E, Front-access I/O, and PCIe & PCI Slots
Key Features:
- 4 PCIe/PCI slots
- Optional extension system I/O window
- Optional Support 5G network (Q670E)
- USB power on/off control via BIOS setting
- Intelligent power management - ACC ignition
- EN 61000-6-2 certified
- Supports Intel RST
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IPC962A Two-slot Industrial System 12th GenLGA1700 Socket 12th Gen Intel Core i7/i5/i3 or Celeron Processor, Intel H610E/Q670E, Front-access I/O, and PCIe & PCI Slots
Key Features:
- 2 PCIe/PCI slots
- Optional extension system I/O window
- Optional 5G network (Q670E)
- USB power on/off control via BIOS setting
- Intelligent power management - ACC ignition
- EN 61000-6-2 certified
- Supports Intel RST
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IPC960A Fanless Industrial Computer 13th/12th GenLGA1700 Socket 13th/12th Gen Core i7/i5/i3/Celeron Processor, H610E/Q670E, Front-access I/O
Key Features:
- Fanless embedded system
- Optional extension system I/O module
- Optional 5G network (Q670E)
- Intelligent power management: Ignition, USB power on/off control
- Supports Intel RAID (Q670E)
- EN61000-6-2 certified
- Optional DIN-rail, bookshelf, and wall mount kits
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ATC3750-A6CR NVIDIA Jetson AGX Orin Edge AI ComputerNVIDIA Jetson AGX Orin Solution Performance Edge AI Computing for Rail
Key Features:
- Built-in NVIDIA® Jetson AGX Orin™ SOM, up to 200/275 TOPS (INT8) performance
- Designed with rugged, compact and hybrid cooling solutions
- 6-port GbE PoE+ (X-coded) for IP CAM/LiDAR sensors, optional 1-port 10GbE (X-coded)
- HEVC/H.265 hardware DECODE up to 7 x 4K30 performance
- Wide range operating temperature of -20°C~70°C
- Ultra-speed PCIe 4.0 x4 NVMe SSD for data integrity
- Expansible for GNSS, LTE/5G NR & Wi-Fi 5/6
- 24V DC-IN for rail, ignition control & OCP/OVP
- NEXCOM Acceleration Linux (NAL) integrated w/ JetPack 5.1.1
- Military standard of MIL-STD-810H for anti-vibration/shock
- CE/FCC, UKCA, EN50155 (EN55011, EN50121-3-2, EN61373, OT4) Certified
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ACS10-TGU 11th Gen Intel Fanless Compact SystemCompact and easy to set up, highly expandable I/O interfaces and flexible storage design, and supports high-resolution graphics
Key Features:
- 11th Gen Intel Core i5/i3 Tiger Lake-UP3 Processor
- Intel Iris Xe/ UHD Graphics Engine
- 1-260-pin DDR4 3200MHz SO-DIMM, Supports Up to 32GB
- 2-Gigabit Ethernet, 1 x 2.5GbE, 1 x 1GbE
- 2-COM Port (RS-232/422/485 & RS-232)
- 2-Audio Jack (Line-Out & Mic-In)
- 2-Storage (M.2 Key-M NVMe & M.2 Key-B SATA)
- 2-Expansion Slot (M.2 Key-E, Key-B)
- 6-USB Port (3-USB 3.2 & 3-USB 2.0)
- CE, FCC Class A, UKCA
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ICO520 DIN-Rail Fanless Embedded Computer with 12th GenAxiomtek ICO520 DIN-Rail Fanless Embedded-System 12th-Gen Intel®-Core™ 4x2.5GbE, 4xIsolated-COM, Isolated DIO (8-in/8-out)
Key Features:
- High performance with fanless and DIN-rail design
- 12th Gen Intel® Core™ i7/i5/i3 or Celeron® processor (Alder Lake-P)
- 4 isolated COM, isolated DIO (8-in/8-out), 4 2.5 GbE LAN
- Wide operating temperature range from -40°C to +70°C
- 9 to 36 VDC, typical 12-24V power input with OVP, UVP, OCP, RPP
- Supports TPM 2.0
- Supports cold boot at -40°C
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EMS-TGL Fanless Rugged Embedded System 11th Gen11th Gen. Core i7/i5/i3 BGA Processor, Rich I/O, support 5G module, fanless operation temperature -40°C ~ 70°C
Key Features:
- On board 11th Gen. Intel Core i7/i5/i3 BGA Processor
- 2x 260-pin SODIMM socket Max. up to 64GB DDR4 3200MT/s
- Rich I/O, 4-USB3.1, 1-DP, 1-HDMI, 2-COM, 2-LAN, 1-8bit GPIO.
- Support 5G (Sub-6G) module, M.2 NVMe SSD Gen. III x 4, HDMI 2.0b (4K @ 60Hz), LAN 2.5G BaseTx GbE
- Fanless operation temperature from -40°C ~ 70°C (WT) / 0°C ~ 70°C (ST)
- CE, FCC Class B, IP50
- Wide range DC power input from +9~32V
- Support HW TPM 2.0
- Support vPro
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AIE110-ONX Edge AI Developer Kit with NVIDIA® Jetson Orin™Axiomtek AIE110-ONX Edge AI Developer Kit NVIDIA® Jetson Orin™ SoM
Key Features:
- NVIDIA® Jetson Orin™ NX (up to 100 TOPS)
- 1 USB 2.0, 1 USB 3.2 Gen2, 1 GbE LAN
- Supports one 15W GbE PoE for camera
- 1 M.2 Key M NVMe SSD slot
- 1 PCI Express Mini Card slot for Wi-Fi/Bluetooth/LTE/GPS
- JetPack supported
- Supports 24/7 secure remote monitoring, control, and OTA deployment empowered by Allxon
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Neu-X303mini Edge Computing System 12th Gen CPU12th Gen. Core CPU, 4 x 4K@60Hz display output, DP, HDMI 2.1, 2 x USB 3.2 Type-C, Dual 2.5G LAN ports, 4 x USB 3.2 and 2 x USB 3.2 Type-C ports for easy connection
Key Features:
- 12th Generation Intel Core (Alder Lake - PS) processor SoC
- Four 4K@60Hz display output, DP, HDMI 2.1 and 2 x USB 3.2 Type-C
- Dual 2.5G LAN ports, 4 x USB 3.2 and 2 x USB 3.2 Type-C ports for easy connection
- Onboard M.2 2280 Key M with PCIe signal for storage modules
- Onboard M.2 2230 Key E for optional Wi-Fi modules
- Compact design (L: 183mm, W: 137.9mm, H: 47.9mm)
- 12V DC in
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DRPC-124-EHL Fanless DIN-Rail Embedded SystemDiscover industrial computing excellence with the fanless DRPC-124-EHL Embedded System, featuring Intel Celeron power, four GbE LAN ports, and a compact design.
Key Features:
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Compact Industrial Mini PC
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Fanless system
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Intel Celeron J6412 2.0 GHz (up to 2.6 GHz, quad-core, TDP 10W)
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Four GbE LAN
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CE/FCC compliant
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ICO330 DIN-Rail Fanless Embedded SystemIntel Atom 3 x 2.5GbE LAN Isolated COM & DIO Fanless System
Key Features:
- Cost-effective with fanless design
- Intel Atom® x6212RE or x6414RE processor
- 6 isolated COM, isolated DIO (8-in/8-out), 3 2.5 GbE LAN
- Wide operating temperature range from -40°C to +70°C
- 9 to 36 VDC, typical 12-24V power input with OVP, UVP, OCP, RPP
- Supports TPM 2.0
- Supports cold boot at -40°C
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RN28 Fanless 12th Gen Network ApplianceDesigned for efficiency and connectivity, the RN28 features Intel Alder Lake-N processors, robust Gigabit and PoE support, and a fanless design for noise-sensitive environments.
Key Features:
- Powered by Intel Alder Lake-N processors on the Intel 7 process, RN28 offers superior processing power with energy efficiency.
- Processor N100 with 4 Cores and 4 threads, TDP under 15W.
- Robust connectivity with two Gigabit RJ-45 (BYPASS pair on Lan 1-2) and four Gigabit RJ-45 supporting PoE for fast, direct connections.
- Wireless flexibility with support for Wi-Fi 5/6/6E.
- Four RJ45 ports supporting Power over Ethernet (PoE), each capable of delivering up to 30W.
- Simplified network setup by combining data connectivity and power delivery.
- Fanless design is ideal for noise-sensitive environments.
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eBOX671B Fanless Embedded System with 13th/12th GeneBOX671B Fanless Embedded System 13th/12th Gen Intel® Core™ 2.5GbE M.2 Key M&E&B USB3.2
Key Features:
- 13th/12th Gen Intel Core i9/i7/i5/i3 and Celeron
- processors with Intel R680E chipset (Alder Lake S)
- Dual DDR5 SO-DIMM for up to 64GB of memory
- 4 LAN with optional PoE supported
- Dual 2.5" SATA HDD drive bays with RAID 0 & 1
- Supports MXM 3.1 Type A, up to 5 display outputs
- -40 °C to +65 °C wide operating temperatures
- Wide range power input from 9 to 36 VDC
- Flexible I/O window supported via mPCIe modules
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TANK-880-Q370 High-Performance 8th/9th Gen PCRuggedized Fanless embedded system with Intel® i7-9700TE 1.8GHz, (up to 3.8GHz, 8-core, TDP 35W), 8GB DDR4 pre-installed memory, 1 x PCIe by 16 & 2 x PCIe by 4 & 1 x PCIe by 1 expansion, HDMI/DP, 9~36V DC, RoHS
Key Features:
- 8th/9th Gen Intel Core processor platform with Intel® Q370 chipset and DDR4 memory
- Dual independent displays with high-resolution support
- Rich high-speed I/O interfaces
- On-board internal power connector for providing power to add-on cards
- Four accessible 2.5” HDD/SSD SATA 6 Gb/s bay (with RAID 0/1/5/10 support)
- Great flexibility for hardware expansion
