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TANK-870-Q170 High-Performance 6th/7th Gen PC
Ruggedized fanless embedded system with High-Performance 6th/7th Generation Intel® Core™ Processor
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TANK-870e-H110 High-Performance 6th/7th Gen PC
Ruggedized Fanless embedded system with 6th/7th Gen Intel® Core™ processor platform
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UST100-504-FL Fanless Compact Embedded System 7th/6th Gen
Fanless Embedded System with 7th/6th Gen Intel® Core™, Pentium® and Celeron® Processor for Video Analytics in Vehicle PC Market
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eBOX100-51R-FL - i5-7300U, Azure certified
Fanless Ultra Compact Embedded System with Intel® Core™ i5-7300U & Intel® Celeron® 3965U Processors, DisplayPort++, 2 COM, 4 USB and 2 GbE LANs
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eBOX640-521-FL Fanless Embedded System with 9th/8th Gen
Fanless Embedded System with LGA1151 Socket 8th Gen Intel® Core™ & Celeron® Processor, Intel® H310, HDMI, DisplayPort, 6 USB, 2 COM and 8-CH DI/DO
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NDiS-B560 8/9th Gen Fanless Embedded PC
Wide Temp Fanless Embedded PC - 8th/9th Gen Intel Core - 3 x HDMI
Key Features:
- Support 9th and 8th Gen Intel Core i9/i7/i5/i3 LGA socket type embedded processor, up to 35W
- Intel integrated UHD 630 graphic engine
- Support 3 x independent 4K2K 60Hz display output
- 3 x HDMI 2.0, 6 x USB 3.0, 2 x GbE LAN, 4 x COM, 1 x Line-out, 1 x Mic-in
- Support M.2 Key B/E/M
- Fanless design
- Support extended temperature -20~60°C
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eBOX630-528-FL Fanless Embedded System
Fanless Embedded System with 8th Gen Intel® Core™ i7/i5/i3 & Celeron® ULT Processor, 2 HDMI, 1 VGA, 3 GbE LAN, 6 USB, Dual PCI Express Mini Card Slots and 9 to 36 VDC
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AIE900-902-FL Fanless Edge AI System Jetson AGX Xavier
Fanless Edge AI System Jetson AGX Xavier™ 4 x POE
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IPC960-525-FL Fanless Industrial System 8th/9th Gen CPU
LGA1151 8th/9th Gen Intel Core i7/i5/i3 & Celeron, Intel H310/Intel Q370, Front-access I/O, -10°C to +60°C
Key Features:
- LGA1151 Socket 9th/8th gen Intel Core processor, up to 65W
- M.2 Key B slot for 5G wireless connection (optional)
- Supports RAID 0,1 (Intel Q370)
- Supports Power-on delay function
- Supports TPM 2.0
- Supports AMT 12 (Intel Q370)
- Supports 2-slot/4-slot expansion kit for further expansion
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eBOX560-52R-FL Fanless i5/Celeron Palm-Size PC
Fanless Embedded System with Intel® Core™ i5-8365UE/Celeron® 4305UE Processor, HDMI/DisplayPort, 2 GbE LAN, 2 COM, 4 USB
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CMC 300-F0x Cabinet Mount Fanless PC
Cabinet Mount Fanless PC with Intel® Xeon® E-2278GEL and 8th & 9th Gen Intel® Core™ i7/i5/i3 Processors
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CMC 300-F2x Cabinet Mount Fanless PC
Cabinet Mount Fanless PC with Intel Xeon E-2278GEL and 8th & 9th Gen Intel Core i7/i5/i3 Processors Two PCIe x4
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Neu-X302 Edge Computing System
Edge Computing System Powered by 8th/9th Generation Intel Core Processor
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NISE-109 Compact Fanless Embedded System
Celeron Processor J6412 Quad Core, 2.0GHz/Atom Processor x6211E Dual Core, 1.3GHZ
Key Features:
- Onboard Intel Celeron processor J6412 2.0Ghz or Atom processor x6211E 1.3Ghz
- Dual display port: 1 x HDMI & 1 x DP
- 2 x Intel I210-IT GbE LAN ports; support WoL, teaming, PXE, and Ethercat
- 3 x USB 3.0 & 3 x USB 2.0
- 2 x RS232 & 2 x RS232/422/485
- Support 1 x 2.5” SSD & 1 x M.2 Key B storage
- Support 9~30V DC input; support ATX power mode
- Operation temperature
- Intel Celeron J6412: -10°C to 60°C
- Intel Atom x6211E: -20°C to 70°C - Support 1 x M.2 & 1 x mini-PCIe expansion slot
- Support TPM 2.0
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NDiS-V1100 Fanless Embedded Computer 11th Gen
Fanless Embedded Computer Powered by 11th Gen Intel Core Processor
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NDiS-B561 12th Gen Fanless Edge PC PoE Option
Visual Edge PC 12th Gen Core Processor -20~60°C 1 x HDMI 2.1 2 x HDMI 2.0 8 x USB 3.2 4 x COM
Key Features:
- Support 12th Gen Intel Core i9/i7/i5/i3 LGA socket type embedded processor, up to 35W
- Intel Q670E
- Intel integrated UHD graphic engine driven by Xe architecture
- Support 3 independent 4K2K@60Hz display outputs. HDMI 2.1 resolution can be up to 8K@60Hz
- 1 x HDMI 2.1, 2 x HDMI 2.0
- 8 x USB 3.2, 4 x COM,
- 1 x GbE LAN, 2 x 2.5G GbE LAN (PoE for B561-PoE)
- Support M.2 Key B/E/M
- Support extended temperature -20~60°C (B561 only)
- Fanless design
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AIE900A-AO Fanless Edge AI System w/ NVIDIA Jetson AGX Orin
Fanless Edge AI System with NVIDIA Jetson AGX Orin, 2 2.5GbE, 8 PoE, and 2 COM/CAN for 5G and Robotics Applications
Key Features:
- NVIDIA Jetson AGX Orin with 1792-core NVIDIA Ampere GPU
- 1 M.2 Key B slot for 5G/LTE, 1 M.2 Key E slot for Wi-Fi 6(E)
- 24 VDC with ignition power control
- Supports eight PoE for IP cameras and LiDAR connectivity
- -30°C to +50°C operating temperature range
- Supports device management and optional OTA deployment powered by Allxon
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NISE-70 Celeron/Core Fanless System
Intel Celeron 6305E Processor Dual Core Fanless System
Key Features:
- Onboard Intel Celeron 6305E Processor
- 4 x HDMI
- 3 x USB 3.0, 1 x USB 2.0
- 1 x RS232/422/485, 1 x RS232
- 3 x GbE LAN ports; support WoL, teaming and PXE
- Onboard TPM 2.0 chip
- 1 x M.2 socket for storage/4G LTE/5G modules
- 1 x mini-PCIe socket support optional mSATA/Wi-Fi/BT/4G LTE module
- Support operating temperature from-5 to 55 Celsius degree
- Support+12V to 24VDC input; support ATX power mode
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NDiS-B338 Fanless Embedded PC Celeron J6412
Slim/fanless player with extended temperature durability, HDMI display, USB 3.0 ports, and a RS232/RS422/RS485 interface
Key Features:
- Intel Celeron J6412 processor
- Support 3 x HDMI 2.0 output
- Support 12V~24V DC input
- Compact and slim design (H: 38.8mm)
- 2 x DDR4 up to 32G
- 1 x M.2 2280 Key M for optional storage device
- 1 x M.2 3042/3052 Key B for optional LTE or 5G modules
- 1 x mini-PCIe for optional Wi-Fi and LTE
- Fanless design
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eBOX630A Fanless Embedded System with 11th Gen Core
Fanless Embedded System with 11th Gen Intel Core i7/i5/i3 or Celeron Processor, 2 HDMI, 1 DisplayPort, 3 LANs, 6 USB, 4 COM, and 9 to 48 VDC
Key Features:
- 11th gen Intel Core i7/i5/i3 or Celeron Quad-core ULT processor (Tiger Lake UP3)
- Dual-channel DDR4-3200 SO-DIMM for up to 64GB of memory
- Supports 3x 2.5 GbE, 6 USB, 4 COM
- -40°C to +60°C wide operating temperatures
- 9 to 48 VDC wide range DC power input
- Supports triple displays with 2 HDMI, and 1 DisplayPort++
- Intel Iris Xe integrated graphics (i7 & i5 SKUs)
- Trusted platform module (TPM 2.0 onboard)
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IPC960A Fanless Industrial System 12th Gen
LGA1700 Socket 12th Gen Intel Core i7/i5/i3 or Celeron Processor, Intel H610E/Q670E, and Front-access I/O
Key Features:
- Fanless embedded system
- Optional extension system I/O window
- Optional 5G network (Q670E)
- USB power on/off control via BIOS setting
- Intelligent power management - ACC ignition
- EN 61000-6-2 certified
- Supports Intel RST
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ACS10-TGU 11th Gen Intel Fanless Compact System
Compact and easy to set up, highly expandable I/O interfaces and flexible storage design, and supports high-resolution graphics
Key Features:
- 11th Gen Intel Core i5/i3 Tiger Lake-UP3 Processor
- Intel Iris Xe/ UHD Graphics Engine
- 1-260-pin DDR4 3200MHz SO-DIMM, Supports Up to 32GB
- 2-Gigabit Ethernet, 1 x 2.5GbE, 1 x 1GbE
- 2-COM Port (RS-232/422/485 & RS-232)
- 2-Audio Jack (Line-Out & Mic-In)
- 2-Storage (M.2 Key-M NVMe & M.2 Key-B SATA)
- 2-Expansion Slot (M.2 Key-E, Key-B)
- 6-USB Port (3-USB 3.2 & 3-USB 2.0)
- CE, FCC Class A, UKCA
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EMS-TGL Fanless Rugged Embedded System 11th Gen
11th Gen. Core i7/i5/i3 BGA Processor, Rich I/O, support 5G module, fanless operation temperature -40°C ~ 70°C
Key Features:
- On board 11th Gen. Intel Core i7/i5/i3 BGA Processor
- 2x 260-pin SODIMM socket Max. up to 64GB DDR4 3200MT/s
- Rich I/O, 4-USB3.1, 1-DP, 1-HDMI, 2-COM, 2-LAN, 1-8bit GPIO.
- Support 5G (Sub-6G) module, M.2 NVMe SSD Gen. III x 4, HDMI 2.0b (4K @ 60Hz), LAN 2.5G BaseTx GbE
- Fanless operation temperature from -40°C ~ 70°C (WT) / 0°C ~ 70°C (ST)
- CE, FCC Class B, IP50
- Wide range DC power input from +9~32V
- Support HW TPM 2.0
- Support vPro
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ICO330 DIN-Rail Fanless Embedded System
Intel Atom 3 x 2.5GbE LAN Isolated COM & DIO Fanless System
Key Features:
- Cost-effective with fanless design
- Intel Atom® x6212RE or x6414RE processor
- 6 isolated COM, isolated DIO (8-in/8-out), 3 2.5 GbE LAN
- Wide operating temperature range from -40°C to +70°C
- 9 to 36 VDC, typical 12-24V power input with OVP, UVP, OCP, RPP
- Supports TPM 2.0
- Supports cold boot at -40°C