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ICO500-518 DIN-Rail Fanless Embedded System
Fanless Embedded System with 7th Gen Intel Core i7/i5/i3 & Celeron Processors, Dual Modular I/O Expansion Design
Key Features:
- 7th gen Intel Core i7/i5/i3 & Celeron processors
- 2 PIM (Plug-in I/O Module) slots
- Fanless and compact design
- Wide operating temperature range from -40°C to +70°C
- 12 to 48 VDC wide range power input
- OVP, UVP, OCP, RPP power protection design
- 1 swappable 2.5" SATA drive tray
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TANK-870-Q170 High-Performance 6th/7th Gen PC
Ruggedized fanless embedded system with High-Performance 6th/7th Generation Intel® Core™ Processor
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TANK-870e-H110 High-Performance 6th/7th Gen PC
Ruggedized Fanless embedded system with 6th/7th Gen Intel® Core™ processor platform
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UST100-504-FL Fanless Compact Embedded System 7th/6th Gen
Fanless Embedded System with 7th/6th Gen Intel® Core™, Pentium® and Celeron® Processor for Video Analytics in Vehicle PC Market
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eBOX710-521-FL Fanless Embedded System 9th/8th Gen
Fanless Embedded System with LGA1151 Intel® Xeon®, 9th/8th Gen Intel® Core™ i7/i5/i3 & Intel® Celeron® Processor, Intel® C246, ECC Memory and 1 PCIe x4 Expansion Slot
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NDiS-B560 8/9th Gen Fanless Embedded PC
Wide Temp Fanless Embedded PC - 8th/9th Gen Intel Core - 3 x HDMI
Key Features:
- Support 9th and 8th Gen Intel Core i9/i7/i5/i3 LGA socket type embedded processor, up to 35W
- Intel integrated UHD 630 graphic engine
- Support 3 x independent 4K2K 60Hz display output
- 3 x HDMI 2.0, 6 x USB 3.0, 2 x GbE LAN, 4 x COM, 1 x Line-out, 1 x Mic-in
- Support M.2 Key B/E/M
- Fanless design
- Support extended temperature -20~60°C
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eBOX630-528-FL Fanless Embedded System
Fanless Embedded System with 8th Gen Intel® Core™ i7/i5/i3 & Celeron® ULT Processor, 2 HDMI, 1 VGA, 3 GbE LAN, 6 USB, Dual PCI Express Mini Card Slots and 9 to 36 VDC
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IPC960-525-FL Fanless Industrial System 8th/9th Gen CPU
LGA1151 8th/9th Gen Intel Core i7/i5/i3 & Celeron, Intel H310/Intel Q370, Front-access I/O, -10°C to +60°C
Key Features:
- LGA1151 Socket 9th/8th gen Intel Core processor, up to 65W
- M.2 Key B slot for 5G wireless connection (optional)
- Supports RAID 0,1 (Intel Q370)
- Supports Power-on delay function
- Supports TPM 2.0
- Supports AMT 12 (Intel Q370)
- Supports 2-slot/4-slot expansion kit for further expansion
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CMC 300-F0x Cabinet Mount Fanless PC
Cabinet Mount Fanless PC with Intel® Xeon® E-2278GEL and 8th & 9th Gen Intel® Core™ i7/i5/i3 Processors
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CMC 300-F2x Cabinet Mount Fanless PC
Cabinet Mount Fanless PC with Intel Xeon E-2278GEL and 8th & 9th Gen Intel Core i7/i5/i3 Processors Two PCIe x4
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NISE-109 Compact Fanless Embedded System
Celeron Processor J6412 Quad Core, 2.0GHz/Atom Processor x6211E Dual Core, 1.3GHZ
Key Features:
- Onboard Intel Celeron processor J6412 2.0Ghz or Atom processor x6211E 1.3Ghz
- Dual display port: 1 x HDMI & 1 x DP
- 2 x Intel I210-IT GbE LAN ports; support WoL, teaming, PXE, and Ethercat
- 3 x USB 3.0 & 3 x USB 2.0
- 2 x RS232 & 2 x RS232/422/485
- Support 1 x 2.5” SSD & 1 x M.2 Key B storage
- Support 9~30V DC input; support ATX power mode
- Operation temperature
- Intel Celeron J6412: -10°C to 60°C
- Intel Atom x6211E: -20°C to 70°C - Support 1 x M.2 & 1 x mini-PCIe expansion slot
- Support TPM 2.0
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NDiS-B561 12th Gen Fanless Edge PC PoE Option
Visual Edge PC 12th Gen Core Processor -20~60°C 1 x HDMI 2.1 2 x HDMI 2.0 8 x USB 3.2 4 x COM
Key Features:
- Support 12th Gen Intel Core i9/i7/i5/i3 LGA socket type embedded processor, up to 35W
- Intel Q670E
- Intel integrated UHD graphic engine driven by Xe architecture
- Support 3 independent 4K2K@60Hz display outputs. HDMI 2.1 resolution can be up to 8K@60Hz
- 1 x HDMI 2.1, 2 x HDMI 2.0
- 8 x USB 3.2, 4 x COM,
- 1 x GbE LAN, 2 x 2.5G GbE LAN (PoE for B561-PoE)
- Support M.2 Key B/E/M
- Support extended temperature -20~60°C (B561 only)
- Fanless design
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NISE-70 Celeron/Core Fanless System
Intel Celeron 6305E Processor Dual Core Fanless System
Key Features:
- Onboard Intel Celeron 6305E Processor
- 4 x HDMI
- 3 x USB 3.0, 1 x USB 2.0
- 1 x RS232/422/485, 1 x RS232
- 3 x GbE LAN ports; support WoL, teaming and PXE
- Onboard TPM 2.0 chip
- 1 x M.2 socket for storage/4G LTE/5G modules
- 1 x mini-PCIe socket support optional mSATA/Wi-Fi/BT/4G LTE module
- Support operating temperature from-5 to 55 Celsius degree
- Support+12V to 24VDC input; support ATX power mode
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NDiS-B338 Fanless Embedded PC Celeron J6412
Slim/fanless player with extended temperature durability, HDMI display, USB 3.0 ports, and a RS232/RS422/RS485 interface
Key Features:
- Intel Celeron J6412 processor
- Support 3 x HDMI 2.0 output
- Support 12V~24V DC input
- Compact and slim design (H: 38.8mm)
- 2 x DDR4 up to 32G
- 1 x M.2 2280 Key M for optional storage device
- 1 x M.2 3042/3052 Key B for optional LTE or 5G modules
- 1 x mini-PCIe for optional Wi-Fi and LTE
- Fanless design
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eBOX710A Fanless Embedded System 11th/10th Gen
Fanless Embedded System with LGA1200 Socket 11th/10th Gen Intel Core i9/i7/i5/i3 or Celeron Processor, Intel H420E, HDMI, DisplayPort, 6 USB, 4 LAN, PCIe x4 slot, and 9 to 48 VDC
Key Features:
- 10th/11th gen Intel Core i9/i7/i5/i3 or Celeron processor up to 65W
- 4 GbE LAN and 4 COM ports
- Dual 2.5" SATA HDD drive bays
- 2 HDMI and 1 DisplayPort with dual view supported
- -40 °C to +70 °C wide operating temperatures
- Wide range power input from 9 to 48 VDC
- 1 PCIe x4 slot for I/O card
- Flexible I/O window slot for mPCIe modules
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eBOX630A Fanless Embedded System with 11th Gen Core
Fanless Embedded System with 11th Gen Intel Core i7/i5/i3 or Celeron Processor, 2 HDMI, 1 DisplayPort, 3 LANs, 6 USB, 4 COM, and 9 to 48 VDC
Key Features:
- 11th gen Intel Core i7/i5/i3 or Celeron Quad-core ULT processor (Tiger Lake UP3)
- Dual-channel DDR4-3200 SO-DIMM for up to 64GB of memory
- Supports 3x 2.5 GbE, 6 USB, 4 COM
- -40°C to +60°C wide operating temperatures
- 9 to 48 VDC wide range DC power input
- Supports triple displays with 2 HDMI, and 1 DisplayPort++
- Intel Iris Xe integrated graphics (i7 & i5 SKUs)
- Trusted platform module (TPM 2.0 onboard)
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IPC960A Fanless Industrial Computer 13th/12th Gen
LGA1700 Socket 13th/12th Gen Core i7/i5/i3/Celeron Processor, H610E/Q670E, Front-access I/O
Key Features:
- Fanless embedded system
- Optional extension system I/O module
- Optional 5G network (Q670E)
- Intelligent power management: Ignition, USB power on/off control
- Supports Intel RAID (Q670E)
- EN61000-6-2 certified
- Optional DIN-rail, bookshelf, and wall mount kits
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ICO520 DIN-Rail Fanless Embedded Computer with 12th Gen
Axiomtek ICO520 DIN-Rail Fanless Embedded-System 12th-Gen Intel®-Core™ 4x2.5GbE, 4xIsolated-COM, Isolated DIO (8-in/8-out)
Key Features:
- High performance with fanless and DIN-rail design
- 12th Gen Intel® Core™ i7/i5/i3 or Celeron® processor (Alder Lake-P)
- 4 isolated COM, isolated DIO (8-in/8-out), 4 2.5 GbE LAN
- Wide operating temperature range from -40°C to +70°C
- 9 to 36 VDC, typical 12-24V power input with OVP, UVP, OCP, RPP
- Supports TPM 2.0
- Supports cold boot at -40°C
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EMS-TGL Fanless Rugged Embedded System 11th Gen
11th Gen. Core i7/i5/i3 BGA Processor, Rich I/O, support 5G module, fanless operation temperature -40°C ~ 70°C
Key Features:
- On board 11th Gen. Intel Core i7/i5/i3 BGA Processor
- 2x 260-pin SODIMM socket Max. up to 64GB DDR4 3200MT/s
- Rich I/O, 4-USB3.1, 1-DP, 1-HDMI, 2-COM, 2-LAN, 1-8bit GPIO.
- Support 5G (Sub-6G) module, M.2 NVMe SSD Gen. III x 4, HDMI 2.0b (4K @ 60Hz), LAN 2.5G BaseTx GbE
- Fanless operation temperature from -40°C ~ 70°C (WT) / 0°C ~ 70°C (ST)
- CE, FCC Class B, IP50
- Wide range DC power input from +9~32V
- Support HW TPM 2.0
- Support vPro
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ICO330 DIN-Rail Fanless Embedded System
Intel Atom 3 x 2.5GbE LAN Isolated COM & DIO Fanless System
Key Features:
- Cost-effective with fanless design
- Intel Atom® x6212RE or x6414RE processor
- 6 isolated COM, isolated DIO (8-in/8-out), 3 2.5 GbE LAN
- Wide operating temperature range from -40°C to +70°C
- 9 to 36 VDC, typical 12-24V power input with OVP, UVP, OCP, RPP
- Supports TPM 2.0
- Supports cold boot at -40°C
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eBOX671B Fanless Embedded System with 13th/12th Gen
eBOX671B Fanless Embedded System 13th/12th Gen Intel® Core™ 2.5GbE M.2 Key M&E&B USB3.2
Key Features:
- 13th/12th Gen Intel Core i9/i7/i5/i3 and Celeron
- processors with Intel R680E chipset (Alder Lake S)
- Dual DDR5 SO-DIMM for up to 64GB of memory
- 4 LAN with optional PoE supported
- Dual 2.5" SATA HDD drive bays with RAID 0 & 1
- Supports MXM 3.1 Type A, up to 5 display outputs
- -40 °C to +65 °C wide operating temperatures
- Wide range power input from 9 to 36 VDC
- Flexible I/O window supported via mPCIe modules
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TANK-880-Q370 High-Performance 8th/9th Gen PC
Ruggedized Fanless embedded system with Intel® i7-9700TE 1.8GHz, (up to 3.8GHz, 8-core, TDP 35W), 8GB DDR4 pre-installed memory, 1 x PCIe by 16 & 2 x PCIe by 4 & 1 x PCIe by 1 expansion, HDMI/DP, 9~36V DC, RoHS
Key Features:
- 8th/9th Gen Intel Core processor platform with Intel® Q370 chipset and DDR4 memory
- Dual independent displays with high-resolution support
- Rich high-speed I/O interfaces
- On-board internal power connector for providing power to add-on cards
- Four accessible 2.5” HDD/SSD SATA 6 Gb/s bay (with RAID 0/1/5/10 support)
- Great flexibility for hardware expansion