Find Your Technical Solution Below
Tekdis products are categorised into the groups below. Once you select the correct category use the filters to locate the best product for your application.
Depending on the category there are numerous filters to help you identify the ideal solution. If you have other questions or requests we are always available via phone or email and will aim to respond within the hour.
Tekdis can "build to order" a complete solution including Operating System and SSD imaging so systems will be preconfigured out of the box.
-
SR700-X4D IP65 MXM-GPU Military Computer Xeon E-2276ME w/ GPU
Quadro RTX A2000 GPU with DTL38999 connector, 9th Gen Intel® Xeon E-2276ME (6C,4.5Ghz)
Key Features:
- IP65 MXM-GPU MIlitary Computer
- MIL-STD 810 Thermal, shock, vibration, Humidity, EMI
- Quadro® RTX A2000 (CUDA 2560, GDDR6-8GB) ; Options for GTX1050 Ti
- 9th Gen Intel® Xeon E-2276ME (6C,4.5Ghz)
- Up to DDR4-64GB, Options for DDR4-128GB
- 9V to 36V DC, Options for MIL-STD-461 18V~36V
- Extended operating temp. -40°C to 60°C
- Dimension : 360 x 230 x 86 mm (WxDxH)
-
AV600X-CH Military IP66 Mission GPU Computer
MIL-STD 810 Thermal, shock, vibration, Humidity/EMI/EMC conditions, IP66 Chassis with D38999 connectors
Key Features:
- MIL-STD 810 Thermal, shock, vibration, Humidity/EMI/EMC conditions
- IP66 Chassis with D38999 connectors
- Intel® 9th Gen. Coffee Lake (H) Xeon® E-2276ML processor
- Up to 128GB DDR4 SO-DIMM, non-ECC and ECC
- NVIDIA RTX™ A1000, 2048 CUDA® cores, 4GB GDDR6 memory
- NVMe 3.0 512GB.(MB/sec, Max.) 3,400/3,200 MB
- MIL-STD-461 18V~36V DC-Input (Options for MIL-704/1275)
- Extreme Temperature : -40°C to 55°C
- Optional with External GPU Turbo Kit
- Dimensions : 250(L) x 313.5 (W) x 100 (H) mm
-
AV600-THT Military IP66 Mission GPU Computer
MIL-STD 810 Thermal, shock, vibration, Humidity/EMI/EMC conditions, IP66 Chassis with D38999 connectors
Key Features:
- MIL-STD 810 Thermal, shock, vibration, Humidity / EMI / EMC conditions
- IP66 Chassis with D38999 connectors
- Intel® 11th Gen. Tiger Lake(H) W-11865MRE Processors, up to 8 cores
- Up to 96GB DDR4 SO-DIMM, non-ECC and ECC
- NVIDIA RTX™ A4500 8GB/16GB GDDR6 memory 5888 CUDA cores
- Soldered 64 GB NVMe
- IP65 2 x 2.5” SATA SSD Easy Swap Tray
- MIL-STD 461 18V~36V DC-Input (Options for MIL-704/1275)
- Extreme Temperature : -40°C to 70°C
- Dimensions : 246(L) x 313.5 (W) x 100 (H) mm
-
AV600TH Military IP66 Mission GPU Computer
MIL-STD 810 Thermal, shock, vibration, Humidity/EMI/EMC conditions, IP66 Chassis with D38999 connectors
Key Features:
- MIL-STD 810 Thermal, shock, vibration, Humidity / EMI / EMC conditions
- IP66 Chassis with D38999 connectors
- Intel® 11th Gen. Tiger Lake(H) W-11865MLE Processors, up to 8 cores
- 64GB DDR4 SO-DIMM ECC or non ECC support
- NVIDIA RTX™ A2000 MXM 8GB GDDR6 2560 CUDA cores
- 2.5” SATA SSD
- 1x 3G-SDI Capture Card (Options)
- MIL-STD-461 18V~36V DC-Input
- Extreme Temperature: -20 to 55°C degrees
-
AV800-D27-A45S4 IP65 Military Server Xeon D-2796NT w/ GPU
Designed to meet MIL-810, MIL-461 EMC/EMI, IP65 Sealed with External Cooling Blade
Key Features:
- Ultra High-Performance Intel Xeon Ice Lake-D, D-2796NT (20xCores)
- NVIDIA MXM-GPU Quadro RTX4500 5888 CUDA
- MIL-STD 810 Thermal, Vibration, Shock, Humidity
- 1x 25GbE SFP28, 1x10GbE, 2x 1GbE LAN
- Up to 512GB LRDIMM/256GB RDIMM
- 2x NVMe PCIe Gen 4.0 U.2
- Dual Removable Anti-Drop Solid-State Disk
- IP65 Sealed with External Cooling Blade
- MIL-STD-810 Thermal, Shock, Vibration, Humidity
- MIL-STD 461 EMI/EMC 18V~36V DC-IN(28VDC)
- Extreme Temperature Support -20~+60°C
-
uIBX-260-EHL Fanless Ultra Compact PC
Ultra-Compact Industrial Mini PC Fanless system
Key Features:
- Intel® Celeron® J6412 2.0 GHz (up to 2.6 GHz, quad-core, TDP 10W)
- Onboard LPDDR4x 8G (up to 16GB)
- M.2 for expansion
- Four USB 3.2 Gen2 (10Gb/s) ports
- Two 2.5GbE LAN ports
-
AFL3-W22C-ADLP 21.5” Fanless Touch Panel PC
Wide 21.5" 350cd/m² 1920x1080 Panel PC with 12th Gen. Intel Core ion-board processor, PCAP touch, 2M camera, microphone
Key Features:
-
12th Gen Intel Core Mobile i7/i5/i3 Processors
-
Full HD capacitive touchscreen
-
Anti-AG and Anti-UV PCAP
-
One E-Window that supports an additional connector interface
-
Support WiFi 6E and Bluetooth 5.2
-
-
DRPC-124-EHL Fanless DIN-Rail Embedded System
Discover industrial computing excellence with the fanless DRPC-124-EHL Embedded System, featuring Intel Celeron power, four GbE LAN ports, and a compact design.
Key Features:
-
Compact Industrial Mini PC
-
Fanless system
-
Intel Celeron J6412 2.0 GHz (up to 2.6 GHz, quad-core, TDP 10W)
-
Four GbE LAN
-
CE/FCC compliant
-
-
WAFER-ULT3 3.5” SBC 6th Gen i7/i5/i3/Celeron
3.5” SBC supports Intel® 6th Generation ULT Processor with DDR4 SO-DIMM/On-board Memory Support
-
TANK-880-Q370 High-Performance 8th/9th Gen PC
Ruggedized Fanless embedded system with Intel® i7-9700TE 1.8GHz, (up to 3.8GHz, 8-core, TDP 35W), 8GB DDR4 pre-installed memory, 1 x PCIe by 16 & 2 x PCIe by 4 & 1 x PCIe by 1 expansion, HDMI/DP, 9~36V DC, RoHS
Key Features:
- 8th/9th Gen Intel Core processor platform with Intel® Q370 chipset and DDR4 memory
- Dual independent displays with high-resolution support
- Rich high-speed I/O interfaces
- On-board internal power connector for providing power to add-on cards
- Four accessible 2.5” HDD/SSD SATA 6 Gb/s bay (with RAID 0/1/5/10 support)
- Great flexibility for hardware expansion
-
PCIE-Q870-i2 Full-size PICMG i7/i5/i3/Pentium/Celeron
Full-size PICMG 1.3 CPU card supports LGA 1150 Intel® Core™ i7/i5/i3, Pentium® and Celeron® CPU per Intel® Q87
-
PCIE-H810 Full-size PICMG i7/i5/i3/Pentium/Celeron
Full-size PICMG 1.3 CPU card supports LGA 1150 Intel® Core™ i7/i5/i3, Pentium® and Celeron® with Intel® H81
-
NANO-ULT3 EPIC SBC 6th Gen i7/i5/i3/Celeron
EPIC SBC supports Intel® 14nm 6th Generation Mobile Core™ i7/i5/i3 and Celeron® on-board Processor (ULT)
-
TANK-870e-H110 High-Performance 6th/7th Gen PC
Ruggedized Fanless embedded system with 6th/7th Gen Intel® Core™ processor platform
-
TANK-870-Q170 High-Performance 6th/7th Gen PC
Ruggedized fanless embedded system with High-Performance 6th/7th Generation Intel® Core™ Processor
-
PPC2-CW215-ADLP 21.5” IP65-Front Fanless Panel PC with 12th Gen
21.5” Fanless Panel PC with Intel® Alder Lake P Processor
Key Features:
-
12th Gen Intel® Core™ Mobile i7/i5/i3 Processors
-
PCAP with USB interface (anti-UV/AG coating)
-
Dual M.2 (M.2 M Key) support
-
Newly Designed Panel Mount Kit
-
Support Gloved and Wet Hand Operation
-