Find Your Technical Solution Below
Tekdis products are categorised into the groups below. Once you select the correct category use the filters to locate the best product for your application.
Depending on the category there are numerous filters to help you identify the ideal solution. If you have other questions or requests we are always available via phone or email and will aim to respond within the hour.
Tekdis can "build to order" a complete solution including Operating System and SSD imaging so systems will be preconfigured out of the box.
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VTC6231 Atom x7433RE Fanless In-Vehicle Computer
Intel Atom x7433RE Fanless In-Vehicle Computer with E-Mark Conformity
Key Features:
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Intel Atom processor quad-core x7433RE, 1.5GHz
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Eight SIM cards + four WWAN modules support
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Built-in u-blox-M9N GPS, Built-in CAN FD
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1 x External storage (compatible with 9mm disk)
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3 x M.2 + 2 x mPCIe socket expansion
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Wide voltage input 9~36 VDC
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Three video outputs, one VGA, one HDMI, and one DP
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Neu-X60 Palm-sized Fanless Edge Computer
Intel N50 processor, Palm-sized Fanless Edge Computing System
Key Features:
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Intel® Processor N50
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Small footprint in Palm size
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Pre-installed 4G memory
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Pre-installed 64G M.2 storage
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Support 1x Intel I226-V 2.5GbE LAN
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1x HDMI, 1x RS232/422/485, 2x USB3.2
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1x mini PCIe full size for optional wireless module
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Great value for indoor applications
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ATC3750-IP7-WI8MR NVIDIA Jetson AGX Orin Edge AI Computer
NVIDIA Jetson AGX Orin Edge AI Computer for Rail
Key Features:
- Built-in NVIDIA® Jetson AGX Orin™ SOM, up to 200/275 TOPS (INT8)
- Designed to be IP67-rated, rugged, and compact
- 8 MIPI/GMSL2 & 2.5GbE (X-coded) for MIPI CAM/IP CAM/LiDAR
- HEVC/H.265 hardware DECODE, supporting up to 7 x 4K30
- Wide range operating temperature of -25°C~70°C
- Ultra-speed PCIe 4.0 x4 NVMe SSD for data integrity
- Expansible for GNSS, LTE/5G NR & Wi-Fi 5/6
- 24~110VDC w/ isolation, ignition control & OCP/OVP
- NEXCOM Acceleration Linux (NAL) integrated w/ JetPack 5.1.1
- Military standard of MIL-STD-810H for anti-vibration/shock
- CE/FCC, UKCA, EN50155 (EN55011, EN50121-3-2, EN61373, OT3), EN45545-2 certified
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Neu-X102-N97 Edge Computing System Powered by Intel N97
Edge Computing System Powered by Intel® Processor N97 (Alder Lake-N)
Key Features:
- Intel® processors N97 (Alder Lake-N), Intel 7 process
- Slim compact chassis and fanless design
- 1 x DDR4 SO-DIMM socket, max up to 16GB
- Support 2 x HDMI 1.4b output, 4K@30Hz
- TPM 2.0 onboard design for security
- Richful I/O connectivity: 2 x 2.5GbE LAN, 4 x USB 3.2 Gen2
- 1 x M.2 2242 Key M for supporting PCIe & SATA storage device
- 1 x mini-PCIe slot supports Wi-Fi and LTE module
- Support power input 12 VDC
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MTS952P & MTS952P-I SATA III M.2 SSDs
SATA III 6Gb/s interface 3D NAND technology -20°C to 75°C
Key Features:
- Dynamic thermal throttling
- Built-in LDPC ECC (Error Correction Code) functionality
- Advanced Garbage Collection
- Supports S.M.A.R.T. function to conduct health monitoring, analysis, and reporting for storage devices
- TRIM command for better performance
- NCQ command for better performance
- Power-saving DevSleep (Device Sleep) mode
- Compliant with RoHS 2.0 standards
- Space-saving M.2 form factor (80mm) – ideal for mobile computing devices
- DDR3 DRAM Cache embedded
- Endurance: 3K P/E cycles (Program/Erase cycles) guaranteed
- Key components fortified by default with Corner Bond technology
- 30µ" PCB gold finger
- Power Loss Protection (PLP) to prevent data loss in the event of a sudden power outage
- Extended Temp. (-20°C ~ 75°C) and Wide Temp. (-40°C ~ 85°C) options available
- Supports Transcend Scope Pro software
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USD240I microSD Cards
112-layer 3D NAND flash with SLC Mode technology -40℃~85℃ microSDXC memory card
Key Features:
- Built-in LDPC ECC (Error Correction Code) functionality
- Early Move
- Supports S.M.A.R.T. function to conduct health monitoring, analysis, and reporting for storage devices
- Wear-Levelling
- Compliant with RoHS 2.0 standards
- Electrostatic protection (ESD IEC 61000-4-2)
- Compliant with SD specification 6.1
- Compliant with UHS-I
- Compliant with Video Speed Class 30 (V30)
- Compliant with Application Performance Class 2 (A2)
- Endurance: 100K P/E cycles (Program/Erase cycles) guaranteed
- Promised operational reliability in a wide temperature range (from -40°C to 85°C)
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DrivePro Body 70 Body Camera
2K QHD 1440P 64GB Internal Storage 9-hour battery life
Key Features:
- Connect to mobile devices easily and quickly
- Built-in GPS receiver for geotagging videos and images
- Buffering mode captures crucial footage and saves storage space
- Built-in Wi-Fi function for mobile live streaming
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MTE712A & MTE712A-I M.2 SSD
Features the 112-layer 3D NAND flash and the PCI Express (PCIe) Gen 4 x4 interface
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Body Camera Docking Station (TS-DPD6P)
6 bay BodyCam chargeing/docking station with USB and network interfaces
Suits: DrivePro™ Body 20 and DrivePro™ Body 52
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ATC3750-IP7-8M NVIDIA Jetson AGX Orin Edge AI Computer
NVIDIA Jetson AGX Orin Solution Performance Edge AI Computer for Rail
Key Features:
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Built-in NVIDIA Jetson AGX Orin SOM, up to 200/275 TOPS (INT8) performance
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Designed to be IP67-rated, rugged, and compact
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8 MIPI/GMSL2 & 2.5GbE (X-coded) for MIPI CAM/IP CAM/LiDAR sensors
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HEVC/H.265 hardware DECODE, supporting up to 7 x 4K30
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Wide range operating temperature of -25°C~70°C
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Ultra-speed PCIe 4.0 x4 NVMe SSD for data integrity
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Expansible for GNSS, LTE/5G NR & Wi-Fi 5/6
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9~36VDC & 24V rail combined, ignition control & OCP/OVP
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NEXCOM Acceleration Linux (NAL) integrated w/ JetPack 5.1.1
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Military standard of MIL-STD-810H for anti-vibration/shock
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CE/FCC, UKCA, E-mark, EN50155 (EN55011, EN50121-3-2, EN61373, OT3) certified
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DDR5-5600 Unbuffered SO-DIMM
Compliant with JEDEC standards, Unbuffered long DIMMs and small outline DIMMs are suitable for embedded desktops
Key Features:
- 1.1V low power supply
- Power management IC (PMIC), high energy efficiency
- On-die ECC
- Burst Length: 16, 32
- 16-bit pre-fetch
- Multi-Purpose Command (MPC)
- Decision Feedback Equalization (DFE)
- SPD Hub with Thermal Sensor
- 100% tested for stability, compatibility and performance
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Transcend 470K 2.5" SATA SSDs
128GB/256GB/512GB/1TB/2TB/4TB 2.5" SATA SSDs SATA III 6Gb/s 3D NAND DRAM
Hardware Features:
- Compliant with RoHS 2.0 standards
- DDR3 DRAM Cache embedded
- Endurance: 3K P/E cycles (Program/Erase cycles) guaranteed
- Promised operational reliability in a wide temperature range (from -40°C to 85°C)
- Promised operational reliability in an extended temperature range (from -20°C to 75°C)
- Supports Transcend Scope Pro software
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USD460T & USD460I microSD Cards
microSD Cards Utilizing top-quality 3D NAND Flash and rated to endure 3K P/E cycles
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CFX602 & CFX602I CFast Cards
Transcend CFast 2.0 CFX602 Memory Cards boast high data transfer rates and extra large storage capacity, perfect for serving as bootable disks.
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Body Camera Docking Station (TS-DPD6N)
6 bay BodyCam chargeing/docking station with USB and network interfaces
Suits: DrivePro™ Body 30,DrivePro™ Body 60
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ATC3520-IP7-3M NVIDIA Jetson Orin Nano Edge AI Computer
NVIDIA Jetson Orin Nano Accelerated Edge AI Computer for In-Vehicle/Rail
Key Features:
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Built-in NVIDIA® Jetson Orin™ Nano SOM, up to 40(sparse) INT8 TOPS computer
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3-CH MIPI SerDes, 1080p60/4Kp30 over 15m cable for MIPI CAM
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HEVC/H.265 hardware CODEC, 11x 1080p30 compute power (decoded)
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Wide range operating temperature of -30~70°C
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Rugged, fanless design with an IP67 rating
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Ultra-speed PCIe 4.0 x4 NVMe SSD for data integrity
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NEXCOM Acceleration Linux (NAL) OS w/ JetPack 5.1.1 integrated
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Expansible for LTE/5G NR & Wi-Fi 5/6
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9~36V DC-in with ignition control & OCP/OVP
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MTS970P SATA III M.2 PLP SSD
Transcend's MTS970P M.2 SSD combines Power Loss Protection (PLP) with a SATA III 6Gb/s interface, 3D NAND technology at 112 layers, and various durability features for enhanced storage efficiency and reliability in mission-critical applications.
Key Features:
- Compliant with RoHS 2.0 standards
- Space-saving M.2 form factor (80mm) – ideal for mobile computing devices
- DDR3 DRAM Cache embedded
- Endurance: 3K P/E cycles (Program/Erase cycles) guaranteed
- Key components fortified by default with Corner Bond technology
- 30µ" PCB gold finger
- Anti-sulfur technology implemented to prevent sulfurization in the environment
- Power Loss Protection (PLP) to prevent data loss in the event of a sudden power outage
- Promised operational reliability in a wide temperature range (from -40°C to 85°C)
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ATC3520-IP7-4C/AI4CR NVIDIA Jetson Orin Nano
Discover the ATC3520-IP7-4C/AI4CR: Your Edge AI computing solution with NVIDIA Jetson Orin Nano, IP67 design, and certifications for industrial needs.
Key Features:
- Edge AI in-vehicle/rail computer
- Built-in NVIDIA Jetson Orin Nano SOM, up to 40(sparse) INT8 TOPS
- 4-Port GbE PoE+ for IP CAM/LiDAR sensors
- HEVC/H.265 hardware CODEC, 11x 1080p30 compute power (decoded)
- Wide range operating temperature of -30~70°C
- Rugged, fanless design with an IP67 rating
- Ultra-speed PCIe 4.0 x4 NVMe SSD for data integrity
- NEXCOM Acceleration Linux (NAL) OS w/ JetPack 5.1.1 integrated
- Expansible for LTE/5G NR & Wi-Fi 5/6
- 9~36V DC-in with ignition control & OCP/OVP
- CE/FCC, UKCA, Emark/EN50155 certified
- Edge AI in-vehicle/rail computer
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CF180 & CF180I CompactFlash Cards
Transcend's SLC Mode CF180 CompactFlash cards are perfect for embedded systems, medical instruments, road surveillance systems, and other industrial applications having high performance and capacity demands.
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Neu-X304 Edge Computer System 13/12th Gen CPU
Unleash the potential of multiple AI and edge applications with the Neu-X304
Key Features:
- 13/12th Gen Intel® Core™ i9/i7/i5/i3 processors, up to 35W
- Dual channel DDR5 SO-DIMM, max up to 64GB
- Support 3 x HDMI 2.0 output, 4K@60Hz
- Dual Intel® LAN ports
- Rich Interface : 2 x COM ports, 8 x USB port, Mic-in, Line-out
- TPM 2.0 onboard
- Support Intel® AMT technology (Q670E only)
- Multiple expansion slots: M.2 2280 Key M for storage, M. 2 2230 Key E for Wi-Fi module,
- M.2 3052 Key B for LTE/5G module
- Power Input:12V DC or 12~24V DC (Q670E only)
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nROK7271 Fanless Vehicle PC 12/13th Gen CPU
Introducing nROK 7271 (Preliminary): A fanless, rugged rolling stock computer with 12/13th Gen Intel® Core™ CPU, DDR5, 5G/Wi-Fi, and PoE support, designed for industrial computing.
Key Features:
- Powered by 12/13th Gen Intel® Core™ CPU
- Fanless, compact and rugged design
- Designed with DDR5, excellent memory bandwidth, lower latency
- 2 x 2.5” SSD for data integrity (compatible with 15mm disk)
- 5G/Wi-Fi, PoE, 10GbE, daughter board expansion support
- 4 x Independent 10/100/1000/2500 Mbps PoE 802.3af/at, total 60W (nROK 7271-WIC4) / 30W (nROK 7271-WIC4-C8S)
- Additional 8-port LAN M12 X-coded, 10/100/1000 Mbps Ethernet Switch GbE, PoE 802.3af/at, max. 30W (nROK7271-WIC4-C8S)
- EN 50155, class OT3 conformity
- Wide voltage input 24~110VDC (w/ isolation)
- Optional up to 3-sec protection against temporary voltage dips
- Powered by 12/13th Gen Intel® Core™ CPU
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PSD330 2.5" PATA SSDs
Offers high-speed UDMA Mode 6, and offers installation flexibility for desktops, laptops or portable devices built around the 2.5" PATA (IDE) storage device standard
Key Features:
- Based on Ultra DMA Mode 4
- Built-in ECC (Error Correction Code) functionality
- Advanced Global Wear-Leveling and Block management for reliability
- Static Data Refresh
- Supports S.M.A.R.T. function to conduct health monitoring, analysis, and reporting for storage devices
- Security Command
- Compliant with RoHS 2.0 standards
- MLC NAND flash