Find Your Technical Solution Below
Tekdis products are categorised into the groups below. Once you select the correct category use the filters to locate the best product for your application.
Depending on the category there are numerous filters to help you identify the ideal solution. If you have other questions or requests we are always available via phone or email and will aim to respond within the hour.
Tekdis can "build to order" a complete solution including Operating System and SSD imaging so systems will be preconfigured out of the box.
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AV600X-CH Military IP66 Mission GPU Computer
MIL-STD 810 Thermal, shock, vibration, Humidity/EMI/EMC conditions, IP66 Chassis with D38999 connectors
Key Features:
- MIL-STD 810 Thermal, shock, vibration, Humidity/EMI/EMC conditions
- IP66 Chassis with D38999 connectors
- Intel® 9th Gen. Coffee Lake (H) Xeon® E-2276ML processor
- Up to 128GB DDR4 SO-DIMM, non-ECC and ECC
- NVIDIA RTX™ A1000, 2048 CUDA® cores, 4GB GDDR6 memory
- NVMe 3.0 512GB.(MB/sec, Max.) 3,400/3,200 MB
- MIL-STD-461 18V~36V DC-Input (Options for MIL-704/1275)
- Extreme Temperature : -40°C to 55°C
- Optional with External GPU Turbo Kit
- Dimensions : 250(L) x 313.5 (W) x 100 (H) mm
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AV600TH Military IP66 Mission GPU Computer
MIL-STD 810 Thermal, shock, vibration, Humidity/EMI/EMC conditions, IP66 Chassis with D38999 connectors
Key Features:
- MIL-STD 810 Thermal, shock, vibration, Humidity / EMI / EMC conditions
- IP66 Chassis with D38999 connectors
- Intel® 11th Gen. Tiger Lake(H) W-11865MLE Processors, up to 8 cores
- 64GB DDR4 SO-DIMM ECC or non ECC support
- NVIDIA RTX™ A2000 MXM 8GB GDDR6 2560 CUDA cores
- 2.5” SATA SSD
- 1x 3G-SDI Capture Card (Options)
- MIL-STD-461 18V~36V DC-Input
- Extreme Temperature: -20 to 55°C degrees
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HSD470T Half-Slim SSDs
SATA III 6Gb/s interface, a powerful controller, and state-of-the-art 112-layer 3D NAND flash
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MTE672A PCIe M.2 SSD
PCIe M.2 SSD 112-layer 3D NAND flash and a PCI Express (PCIe) Gen 3 x4 interface
Key Features:
- Compliant with RoHS 2.0 standards
- Compliant with NVM Express specification 1.3
- Compliant with PCI Express specification 3.1
- Space-saving M.2 form factor (80mm) – ideal for mobile computing devices
- PCIe Gen 3 x4 interface
- Endurance: 3K P/E cycles (Program/Erase cycles) guaranteed
- Key components fortified by default with Corner Bond technology
- 30µ" PCB gold finger
- Anti-sulfur technology implemented to prevent sulfurization in the environment
- Power Shield (PS) to ensure data transfer integrity and minimize data corruption in the drive during an abnormal power outage
- Promised operational reliability in an extended temperature range (from -20°C to 75°C)