Find Your Technical Solution Below
Tekdis products are categorised into the groups below. Once you select the correct category use the filters to locate the best product for your application.
Depending on the category there are numerous filters to help you identify the ideal solution. If you have other questions or requests we are always available via phone or email and will aim to respond within the hour.
Tekdis can "build to order" a complete solution including Operating System and SSD imaging so systems will be preconfigured out of the box.
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NDiS-S538 SDM Embedded Computer Powered by 6th Gen, 4K
Embedded Computer Powered by 6th Gen. Intel® Core™ Processor. Intel® SDM-L Based Digital Signage Platform, Support 4K Resolution
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eBOX671A Fanless Embedded System with LGA1200 Socket 11th/10th Gen
With LGA1200 Socket 11th/10th Gen Intel Xeon, Core i9/i7/i5/i3 or Celeron Processor, Intel W480E, 2 HDMI, DisplayPort, 6 USB, 4 LAN, and 9 to 48 VDC
Key Features:
- LGA1200 11th/10th gen Intel® Xeon®, Core™ i9/i7/i5/i3 or Celeron® with Intel® W480E chipset (Comet Lake-S)
- 4 GbE LAN with optional PoE supported
- Dual 2.5" SATA HDD drive bays with RAID 0 & 1
- 2 HDMI and 1 DisplayPort for triple-view
- -40°C to +70°C wide range operation temperature
- Wide range power input from 9 to 48 VDC
- Flexible I/O window supported via mPCIe modules
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OPS500-501 7th gen LGA1151 i series CPU, Intel Q170
Open Pluggable Specification (OPS) Digital Signage Player with LGA1151 Socket 7th/6th Gen Intel® Core™ i7/i5/i3 & Celeron® Processor, Intel® Q170 and Intel® AMT 11.0
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NISE-70 Celeron/Core Fanless System
Intel Celeron 6305E Processor Dual Core Fanless System
Key Features:
- Onboard Intel Celeron 6305E Processor
- 4 x HDMI
- 3 x USB 3.0, 1 x USB 2.0
- 1 x RS232/422/485, 1 x RS232
- 3 x GbE LAN ports; support WoL, teaming and PXE
- Onboard TPM 2.0 chip
- 1 x M.2 socket for storage/4G LTE/5G modules
- 1 x mini-PCIe socket support optional mSATA/Wi-Fi/BT/4G LTE module
- Support operating temperature from-5 to 55 Celsius degree
- Support+12V to 24VDC input; support ATX power mode
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eBOX565-500-FL Fanless Embedded System
Fanless Embedded System with Intel® Core™ i5-6300U/i3-6100U & Celeron® 3955U, 2 HDMI, 2 GbE LANs, 4 USB 3.0, 2 COM and 9 to 36 VDC
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eBOX640-500-FL Fanless Embedded System with 7th/6th Gen
Fanless Embedded System with LGA1151 Socket 7th/6th Gen Intel® Core™ & Celeron® Processor, Intel® H110, HDMI, DisplayPort, VGA, 6 USB, 4 COM, PCI Express Mini Card Slot and 10 to 30 VDC
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NDiS-M537 Embedded Computer 7th/6th Gen
Embedded Computer Powered by 7th/6th Gen. Intel® Core™ Processor OPS PLUS-Based Digital Signage Platform, Support 4K Resolution
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eBOX670-891-FL Fanless Embedded System with 7th/6th Gen
Fanless Embedded System with LGA1151 Socket 7th/6th Gen Intel® Core™ & Celeron® Processor, Intel® Q170, 2 HDMI, DisplayPort, 4 GbE LANs, 6 USB, 2 PCI Express Mini Card Slots
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NDiS-V1100 Fanless Embedded Computer 11th Gen
Fanless Embedded Computer Powered by 11th Gen Intel Core Processor
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eBOX671-517-FL Fanless Embedded System
Fanless Embedded System with LGA1151 Socket 7th/6th Gen Intel Core i7/i5/i3 & Celeron Processor, Intel Q170, HDMI, DVI-D, VGA, 8-CH PoE, 6 USB and 24 VDC
Key Features:
- 7th/6th gen Intel Core i7/i5/i3 & Celeron processors (35W/65W) and Intel Q170
- 8-CH PoE onboard
- 2 front-access SIM slots
- Supports 6-in/2-out isolated DIO
- -40°C to +70°C extended operating temperature
- Optional ignition feature supported
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EMS-TGL Fanless Rugged Embedded System 11th Gen
11th Gen. Core i7/i5/i3 BGA Processor, Rich I/O, support 5G module, fanless operation temperature -40°C ~ 70°C
Key Features:
- On board 11th Gen. Intel Core i7/i5/i3 BGA Processor
- 2x 260-pin SODIMM socket Max. up to 64GB DDR4 3200MT/s
- Rich I/O, 4-USB3.1, 1-DP, 1-HDMI, 2-COM, 2-LAN, 1-8bit GPIO.
- Support 5G (Sub-6G) module, M.2 NVMe SSD Gen. III x 4, HDMI 2.0b (4K @ 60Hz), LAN 2.5G BaseTx GbE
- Fanless operation temperature from -40°C ~ 70°C (WT) / 0°C ~ 70°C (ST)
- CE, FCC Class B, IP50
- Wide range DC power input from +9~32V
- Support HW TPM 2.0
- Support vPro
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ACS10-TGU 11th Gen Intel Fanless Compact System
Compact and easy to set up, highly expandable I/O interfaces and flexible storage design, and supports high-resolution graphics
Key Features:
- 11th Gen Intel Core i5/i3 Tiger Lake-UP3 Processor
- Intel Iris Xe/ UHD Graphics Engine
- 1-260-pin DDR4 3200MHz SO-DIMM, Supports Up to 32GB
- 2-Gigabit Ethernet, 1 x 2.5GbE, 1 x 1GbE
- 2-COM Port (RS-232/422/485 & RS-232)
- 2-Audio Jack (Line-Out & Mic-In)
- 2-Storage (M.2 Key-M NVMe & M.2 Key-B SATA)
- 2-Expansion Slot (M.2 Key-E, Key-B)
- 6-USB Port (3-USB 3.2 & 3-USB 2.0)
- CE, FCC Class A, UKCA
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NDiS-B360 11th Gen Core Slim Wide Temp Embedded Computer
11th Gen Core Wide Temp -20~60°C embedded PC
Key Features:
- 11th Generation Intel Tiger Lake-UP3 Core processor SoC
- Dual 4K@60Hz display output, DP++, HDMI 2.0
- Support 4K@60Hz eDP display output
- Compact and slim design (H: 36mm)
- Dual LAN ports and USB3.0 ports for easy connection
- On-board M.2 Key M 2280 with PCIex4/SATA signal for storage module
- On-board M.2 Key E 2230 for optional WiFi modules
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eBOX630A Fanless Embedded System with 11th Gen Core
Fanless Embedded System with 11th Gen Intel Core i7/i5/i3 or Celeron Processor, 2 HDMI, 1 DisplayPort, 3 LANs, 6 USB, 4 COM, and 9 to 48 VDC
Key Features:
- 11th gen Intel Core i7/i5/i3 or Celeron Quad-core ULT processor (Tiger Lake UP3)
- Dual-channel DDR4-3200 SO-DIMM for up to 64GB of memory
- Supports 3x 2.5 GbE, 6 USB, 4 COM
- -40°C to +60°C wide operating temperatures
- 9 to 48 VDC wide range DC power input
- Supports triple displays with 2 HDMI, and 1 DisplayPort++
- Intel Iris Xe integrated graphics (i7 & i5 SKUs)
- Trusted platform module (TPM 2.0 onboard)
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eBOX710A Fanless Embedded System 11th/10th Gen
Fanless Embedded System with LGA1200 Socket 11th/10th Gen Intel Core i9/i7/i5/i3 or Celeron Processor, Intel H420E, HDMI, DisplayPort, 6 USB, 4 LAN, PCIe x4 slot, and 9 to 48 VDC
Key Features:
- 10th/11th gen Intel Core i9/i7/i5/i3 or Celeron processor up to 65W
- 4 GbE LAN and 4 COM ports
- Dual 2.5" SATA HDD drive bays
- 2 HDMI and 1 DisplayPort with dual view supported
- -40 °C to +70 °C wide operating temperatures
- Wide range power input from 9 to 48 VDC
- 1 PCIe x4 slot for I/O card
- Flexible I/O window slot for mPCIe modules
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WAFER-ULT3 3.5” SBC 6th Gen i7/i5/i3/Celeron
3.5” SBC supports Intel® 6th Generation ULT Processor with DDR4 SO-DIMM/On-board Memory Support
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NANO-ULT3 EPIC SBC 6th Gen i7/i5/i3/Celeron
EPIC SBC supports Intel® 14nm 6th Generation Mobile Core™ i7/i5/i3 and Celeron® on-board Processor (ULT)
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UST100-504-FL Fanless Compact Embedded System 7th/6th Gen
Fanless Embedded System with 7th/6th Gen Intel® Core™, Pentium® and Celeron® Processor for Video Analytics in Vehicle PC Market
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TANK-870e-H110 High-Performance 6th/7th Gen PC
Ruggedized Fanless embedded system with 6th/7th Gen Intel® Core™ processor platform
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TANK-870-Q170 High-Performance 6th/7th Gen PC
Ruggedized fanless embedded system with High-Performance 6th/7th Generation Intel® Core™ Processor
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eBOX700-891-FL Fanless Embedded System 7th/6th GenEnd of Life
Fanless Embedded System with LGA1151 Socket 7th/6th Gen Intel Core i7/i5/i3 & Celeron Processor, Intel H110, 2 HDMI, DisplayPort, 4 GbE LANs, 6 USB, PCIe x4/PCI Slot and 9 to 36 VDC
Key Features:
- Wide operating temperature range from -40°C to +50°C
- 7th/6th gen Intel® Core™ i7/i5/i3 & Celeron® processors
- PCIe x 4 or PCI slot supported
- Supports 6 USB ports and 4 GbE LAN
- 2 PCI Express Mini Card slots for WLAN/WWAN/mSATA modules
- 1 internal USB Type A connector for the Dongle kit
- AMS.AXView intelligent remote monitoring software for IIoT
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eBOX560-500-FL Fanless Embedded System
Fanless Embedded System with Intel® Core™ i7-6600U/i5-6300U/i3-6100U & Celeron® 3955U, 2 HDMI, 2 GbE LANs, 4 USB 3.0, 2 COM and PCI Express Mini Card Slot
Key Features:
- Intel Core i7-6600U 3.4 GHz/i5-6300U 3 GHz/i3-6100U 2.3 GHz & Celeron® 3955U 2.0 GHz (Skylake ULT SoC)
- 260-pin DDR4 SO-DIMM for up to 16GB of memory
- 12 VDC power input
- Supports 2 HDMI, 2 GbE LAN, 2 COM, and 4 USB 3.0
- Supports Jumbo Frame (9.5K), WoL, PXE and Teaming
- Ultra-compact enclosure design