In-Vehicle & Railway AI Computers

Tekdis provides a wide range of mobile solutions for AI and deep learning applications, including both low and high-end options, such as Intel x86 systems with accelerator cards and NVIDIA Jetson-based platforms. We offer a selection of communication modules and accessories, including LTE, WLAN, GPS, Untethered Dead Reckoning GPS, CAN Bus, and Tyre Pressure Monitoring. Some models also feature integrated Power-Over-Ethernet (POE) for connecting to IP cameras or RFID readers. Our solutions enable you to implement mobile NVRs, ANPR systems, telematics, and vehicle health monitoring. For railway applications, we offer EN50155-certified models suitable for rolling stock and trackside installations. If you need assistance finding the right vehicle PC for your needs, contact our expert team today.

AI In-Vehicle Computers
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  1. AV600X-CH Military IP66 Mission GPU Computer
    AV600X-CH Military IP66 Mission GPU Computer

    MIL-STD 810 Thermal, shock, vibration, Humidity/EMI/EMC conditions, IP66 Chassis with D38999 connectors

    Key Features:

    • MIL-STD 810 Thermal, shock, vibration, Humidity/EMI/EMC conditions
    • IP66 Chassis with D38999 connectors
    • Intel® 9th Gen. Coffee Lake (H) Xeon® E-2276ML processor
    • Up to 128GB DDR4 SO-DIMM, non-ECC and ECC
    • NVIDIA RTX™ A1000, 2048 CUDA® cores, 4GB GDDR6 memory
    • NVMe 3.0 512GB.(MB/sec, Max.) 3,400/3,200 MB
    • MIL-STD-461 18V~36V DC-Input (Options for MIL-704/1275)
    • Extreme Temperature : -40°C to 55°C
    • Optional with External GPU Turbo Kit
    • Dimensions : 250(L) x 313.5 (W) x 100 (H) mm
  2. AV600TH Military IP66 Mission GPU Computer
    AV600TH Military IP66 Mission GPU Computer

    MIL-STD 810 Thermal, shock, vibration, Humidity/EMI/EMC conditions, IP66 Chassis with D38999 connectors

    Key Features:

    • MIL-STD 810 Thermal, shock, vibration, Humidity / EMI / EMC conditions
    • IP66 Chassis with D38999 connectors
    • Intel® 11th Gen. Tiger Lake(H) W-11865MLE Processors, up to 8 cores
    • 64GB DDR4 SO-DIMM ECC or non ECC support
    • NVIDIA RTX™ A2000 MXM 8GB GDDR6 2560 CUDA cores
    • 2.5” SATA SSD
    • 1x 3G-SDI Capture Card (Options)
    • MIL-STD-461 18V~36V DC-Input
    • Extreme Temperature: -20 to 55°C degrees
  3. AIE900A-AO Fanless Edge AI System w/ NVIDIA Jetson AGX Orin
    AIE900A-AO Fanless Edge AI System w/ NVIDIA Jetson AGX Orin

    Fanless Edge AI System with NVIDIA Jetson AGX Orin, 2 2.5GbE, 8 PoE, and 2 COM/CAN for 5G and Robotics Applications

    Key Features:

    • NVIDIA Jetson AGX Orin with 1792-core NVIDIA Ampere GPU
    • 1 M.2 Key B slot for 5G/LTE, 1 M.2 Key E slot for Wi-Fi 6(E)
    • 24 VDC with ignition power control
    • Supports eight PoE for IP cameras and LiDAR connectivity
    • -30°C to +50°C operating temperature range
    • Supports device management and optional OTA deployment powered by Allxon
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