Find Your Technical Solution Below

Tekdis products are categorised into the groups below. Once you select the correct category use the filters to locate the best product for your application.

Depending on the category there are numerous filters to help you identify the ideal solution. If you have other questions or requests we are always available via phone or email and will aim to respond within the hour.

Tekdis can "build to order" a complete solution including Operating System and SSD imaging so systems will be preconfigured out of the box. 

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  1. Products 18 items
  1. Mobile Computing 0 items
  2. Digital Signage 0 items
  3. Industrial Computing 0 items
  4. Panel PCs & Industrial Displays 0 items
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  6. Medical Solutions 0 items
  7. Cameras & LiDAR 0 items
  8. Storage & Memory 18 items
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18 Items

  1. USD240I microSD Cards
    USD240I microSD Cards

    112-layer 3D NAND flash with SLC Mode technology -40℃~85℃ microSDXC memory card

    Key Features:

    • Built-in LDPC ECC (Error Correction Code) functionality
    • Early Move
    • Supports S.M.A.R.T. function to conduct health monitoring, analysis, and reporting for storage devices
    • Wear-Levelling
    • Compliant with RoHS 2.0 standards
    • Electrostatic protection (ESD IEC 61000-4-2)
    • Compliant with SD specification 6.1
    • Compliant with UHS-I
    • Compliant with Video Speed Class 30 (V30)
    • Compliant with Application Performance Class 2 (A2)
    • Endurance: 100K P/E cycles (Program/Erase cycles) guaranteed
    • Promised operational reliability in a wide temperature range (from -40°C to 85°C)
  2. MTE672A PCIe M.2 SSD
    MTE672A PCIe M.2 SSD

    PCIe M.2 SSD 112-layer 3D NAND flash and a PCI Express (PCIe) Gen 3 x4 interface

    Key Features:

    • Compliant with RoHS 2.0 standards
    • Compliant with NVM Express specification 1.3
    • Compliant with PCI Express specification 3.1
    • Space-saving M.2 form factor (80mm) – ideal for mobile computing devices
    • PCIe Gen 3 x4 interface
    • Endurance: 3K P/E cycles (Program/Erase cycles) guaranteed
    • Key components fortified by default with Corner Bond technology
    • 30µ" PCB gold finger
    • Anti-sulfur technology implemented to prevent sulfurization in the environment
    • Power Shield (PS) to ensure data transfer integrity and minimize data corruption in the drive during an abnormal power outage
    • Promised operational reliability in an extended temperature range (from -20°C to 75°C)
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