Find Your Technical Solution Below
Tekdis products are categorised into the groups below. Once you select the correct category use the filters to locate the best product for your application.
Depending on the category there are numerous filters to help you identify the ideal solution. If you have other questions or requests we are always available via phone or email and will aim to respond within the hour.
Tekdis can "build to order" a complete solution including Operating System and SSD imaging so systems will be preconfigured out of the box.
-
SCM140 RISC Embedded SMARC v2.1 SoM with Qualcomm QCS6490
RISC Embedded SMARC v2.1 SoM with Qualcomm® QCS6490 Octa-core Processor, up to 2.7GHz
Key Features:
-
SMARC 2.1 (82 x 50 mm)
-
Qualcomm QCS6490 Octa-core processor
-
Qualcomm AI Engine, up to 13 TOPS
-
LPDDR4x, up to 8GB
-
UFS, up to 128GB
-
HDMI1.4
-
10/100/1000 Mbps Ethernet
-
USB 3.2
-
MIPI-CSI
-
-
MTS952P & MTS952P-I SATA III M.2 SSDs
SATA III 6Gb/s interface 3D NAND technology -20°C to 75°C
Key Features:
- Dynamic thermal throttling
- Built-in LDPC ECC (Error Correction Code) functionality
- Advanced Garbage Collection
- Supports S.M.A.R.T. function to conduct health monitoring, analysis, and reporting for storage devices
- TRIM command for better performance
- NCQ command for better performance
- Power-saving DevSleep (Device Sleep) mode
- Compliant with RoHS 2.0 standards
- Space-saving M.2 form factor (80mm) – ideal for mobile computing devices
- DDR3 DRAM Cache embedded
- Endurance: 3K P/E cycles (Program/Erase cycles) guaranteed
- Key components fortified by default with Corner Bond technology
- 30µ" PCB gold finger
- Power Loss Protection (PLP) to prevent data loss in the event of a sudden power outage
- Extended Temp. (-20°C ~ 75°C) and Wide Temp. (-40°C ~ 85°C) options available
- Supports Transcend Scope Pro software
-
USD240I microSD Cards
112-layer 3D NAND flash with SLC Mode technology -40℃~85℃ microSDXC memory card
Key Features:
- Built-in LDPC ECC (Error Correction Code) functionality
- Early Move
- Supports S.M.A.R.T. function to conduct health monitoring, analysis, and reporting for storage devices
- Wear-Levelling
- Compliant with RoHS 2.0 standards
- Electrostatic protection (ESD IEC 61000-4-2)
- Compliant with SD specification 6.1
- Compliant with UHS-I
- Compliant with Video Speed Class 30 (V30)
- Compliant with Application Performance Class 2 (A2)
- Endurance: 100K P/E cycles (Program/Erase cycles) guaranteed
- Promised operational reliability in a wide temperature range (from -40°C to 85°C)
-
MTE712A & MTE712A-I M.2 SSD
Features the 112-layer 3D NAND flash and the PCI Express (PCIe) Gen 4 x4 interface
-
P710 10.4" XGA TFT LCD Railway Touchscreen Monitor
10.4" XGA TFT LCD Railway Touchscreen Monitor (-25°C to +55°C)
-
DDR5-5600 Unbuffered SO-DIMM
Compliant with JEDEC standards, Unbuffered long DIMMs and small outline DIMMs are suitable for embedded desktops
Key Features:
- 1.1V low power supply
- Power management IC (PMIC), high energy efficiency
- On-die ECC
- Burst Length: 16, 32
- 16-bit pre-fetch
- Multi-Purpose Command (MPC)
- Decision Feedback Equalization (DFE)
- SPD Hub with Thermal Sensor
- 100% tested for stability, compatibility and performance
-
USD460T & USD460I microSD Cards
microSD Cards Utilizing top-quality 3D NAND Flash and rated to endure 3K P/E cycles
-
IFB122 Robust RISC-based DIN-rail Fanless Embedded System
Robust RISC-based DIN-rail Fanless Embedded System with i.MX 6UL Processor, 2 COM, 2 LANs and DIO (2-In/1-Out)
Key Features:
-
RISC-based (i.MX 6UltraLite) processor 528 MHz
-
256MB DDR3 SDRAM onboard
-
8GB eMMC flash onboard
-
1 PCI Express Mini Card slot (Wi-Fi or 3G/4G)
-
2 digital inputs and 1 digital output
-
Power input range of 9V to 48V DC with terminal block
-
Embedded Linux operating system (Yocto)
-
Fanless and compact design
-
Wide operating temperature range from -40°C to +70°C
-
-
iNA110 DIN-Rail Fanless Cybersecurity Gateway
DIN-Rail Cybersecurity Gateway with Intel Atom® x5-E3930/E3940 Processor and 4 LAN with LAN Bypass
Key Features:
- Cost-effective with fanless design
- Intel Atom® x5-E3930/E3940 processor (Apollo Lake)
- 4 GbE RJ-45 (Intel® I210-IT) with LAN Bypass
- Wide operating temperature range from -40°C to +70°C
- 9 to 36 VDC, typical 12-24V power input with OVP, UVP, OCP, RPP
- Supports TPM 2.0
- Ideal for ICS cybersecurity and critical infrastructure protection
-
PSD330 2.5" PATA SSDs
Offers high-speed UDMA Mode 6, and offers installation flexibility for desktops, laptops or portable devices built around the 2.5" PATA (IDE) storage device standard
Key Features:
- Based on Ultra DMA Mode 4
- Built-in ECC (Error Correction Code) functionality
- Advanced Global Wear-Leveling and Block management for reliability
- Static Data Refresh
- Supports S.M.A.R.T. function to conduct health monitoring, analysis, and reporting for storage devices
- Security Command
- Compliant with RoHS 2.0 standards
- MLC NAND flash
-
SSD460K & SSD460K-I 2.5" DRAM-less SSD
2.5" DRAM-less SSD SSD460K features the SATA III 6Gb/s interface and state-of-the-art 3D NAND technology
-
GOT715S EN50155 15" Railway Fanless Touchscreen Panel PC
EN50155 Compliant 15" XGA TFT LCD Railway Fanless Touchscreen Panel PC with Intel Atom Processor E3845 1.91 GHz (-25°C to +70°C)
Key Features:
- Sunlight readable 15" XGA TFT LCD with 800 nits of high brightness
- Fanless with Intel Atom® processor E3845 1.91 GHz
- All lockable connector design
- Auto-dimming for different environments
- -25°C to +70°C wide temperature range
- Typical 24 to 110 VDC wide power input range and EN 50155 Class S3 20ms power interruption protection compliant
- EN 50155 design compliance
-
HSD470T Half-Slim SSDs
SATA III 6Gb/s interface, a powerful controller, and state-of-the-art 112-layer 3D NAND flash
-
IMB760 EATX Motherboard Xeon scalable 4 PCIe x16, 2 PCIe x8, VGA, NVMe, and IPMI
EATX Motherboard with Dual LGA4189 Socket 3rd Gen Intel Xeon Scalable Processors, Intel C621A/C627A, 4 PCIe x16, 2 PCIe x8, VGA, NVMe, and IPMI
Key Features:
- Dual 3rd gen Intel® Xeon® Scalable processors (Ice Lake-SP)
- 16 288-pin DDR4-3200 RDIMM for up to 1TB of memory
- 4 PCIe x16 and 2 PCIe x8
- Supports 2 M.2 Key M slots for NVMe with RAID 0 & 1
- Supports TPM 2.0 module (optional)
- Two 10GbE ports
- IPMI (optional)
-
SSD470P & SSD470P-I 2.5" SATA SSDs
Power Loss Protection (PLP) SSD, SATA III 6Gb/s interface and 112-layer 3D NAND flash
-
eBOX671A Fanless Embedded System with LGA1200 Socket 11th/10th Gen
With LGA1200 Socket 11th/10th Gen Intel Xeon, Core i9/i7/i5/i3 or Celeron Processor, Intel W480E, 2 HDMI, DisplayPort, 6 USB, 4 LAN, and 9 to 48 VDC
Key Features:
- LGA1200 11th/10th gen Intel® Xeon®, Core™ i9/i7/i5/i3 or Celeron® with Intel® W480E chipset (Comet Lake-S)
- 4 GbE LAN with optional PoE supported
- Dual 2.5" SATA HDD drive bays with RAID 0 & 1
- 2 HDMI and 1 DisplayPort for triple-view
- -40°C to +70°C wide range operation temperature
- Wide range power input from 9 to 48 VDC
- Flexible I/O window supported via mPCIe modules
-
MTE662P & MTE662P-I PCIe M.2 SSDs
PCI Express (PCIe) Gen 3 x4 interface, compatible with NVM Express (NVMe) 1.3, 3D NAND technology
-
MTE662A PCIe M.2 SSD
PCI Express (PCIe) Gen 3 x4 interface and compatible with NVM Express (NVMe), 3D NAND technology
-
UST500-517-FL Fanless Embedded System 7th/6th Gen
Fanless Embedded System with 7th/6th Gen Intel Core, Pentium and Celeron Processor
Key Features:
- CE, FCC, E-Mark, EN 50155 and EN 45545-2 certified
- LGA1151 7th/6th gen Intel® Core™ & Pentium® processors (up to 65W) with Intel® Q170 (Kaby Lake/Skylake)
- Fanless and Wide operating temperatures from -40°C to +70°C
- Flexible LAN selection, up to 16 RJ-45 GbE PoE LAN ports
- 24 VDC power input
- Intelligent solution of vehicle power management (ACC ignition)
- Convenient and Accessible Storage, two/four 2.5” SATA drive, 1 mSATA
-
OPS500-501-H, 7th gen LGA1151 CPU, Intel H110
Open Pluggable Specification (OPS) Digital Signage Player with LGA1151 Socket 7th/6th Gen Intel® Core™ i7/i5/i3 & Celeron® Processor and Intel® H110
-
SATA III M.2 SSDs MTS560T & MTS560T-I
M.2 DRAM-less SSD MTS560T SATA III 6Gb/s interface 3D NAND technology
-
OPS500-501 7th gen LGA1151 i series CPU, Intel Q170
Open Pluggable Specification (OPS) Digital Signage Player with LGA1151 Socket 7th/6th Gen Intel® Core™ i7/i5/i3 & Celeron® Processor, Intel® Q170 and Intel® AMT 11.0