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Tekdis products are categorised into the groups below. Once you select the correct category use the filters to locate the best product for your application.

Depending on the category there are numerous filters to help you identify the ideal solution. If you have other questions or requests we are always available via phone or email and will aim to respond within the hour.

Tekdis can "build to order" a complete solution including Operating System and SSD imaging so systems will be preconfigured out of the box. 

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  1. Products 16 items
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16 Items

  1. AV600X-CH Military IP66 Mission GPU Computer
    AV600X-CH Military IP66 Mission GPU Computer

    MIL-STD 810 Thermal, shock, vibration, Humidity/EMI/EMC conditions, IP66 Chassis with D38999 connectors

    Key Features:

    • MIL-STD 810 Thermal, shock, vibration, Humidity/EMI/EMC conditions
    • IP66 Chassis with D38999 connectors
    • Intel® 9th Gen. Coffee Lake (H) Xeon® E-2276ML processor
    • Up to 128GB DDR4 SO-DIMM, non-ECC and ECC
    • NVIDIA RTX™ A1000, 2048 CUDA® cores, 4GB GDDR6 memory
    • NVMe 3.0 512GB.(MB/sec, Max.) 3,400/3,200 MB
    • MIL-STD-461 18V~36V DC-Input (Options for MIL-704/1275)
    • Extreme Temperature : -40°C to 55°C
    • Optional with External GPU Turbo Kit
    • Dimensions : 250(L) x 313.5 (W) x 100 (H) mm
  2. AV600-THT Military IP66 Mission GPU Computer
    AV600-THT Military IP66 Mission GPU Computer

    MIL-STD 810 Thermal, shock, vibration, Humidity/EMI/EMC conditions, IP66 Chassis with D38999 connectors

    Key Features:

    • MIL-STD 810 Thermal, shock, vibration, Humidity / EMI / EMC conditions
    • IP66 Chassis with D38999 connectors
    • Intel® 11th Gen. Tiger Lake(H) W-11865MRE Processors, up to 8 cores
    • Up to 96GB DDR4 SO-DIMM, non-ECC and ECC
    • NVIDIA RTX™ A4500 8GB/16GB GDDR6 memory 5888 CUDA cores
    • Soldered 64 GB NVMe
    • IP65 2 x 2.5” SATA SSD Easy Swap Tray
    • MIL-STD 461 18V~36V DC-Input (Options for MIL-704/1275)
    • Extreme Temperature : -40°C to 70°C
    • Dimensions : 246(L) x 313.5 (W) x 100 (H) mm
  3. AIE510-ONX Fanless Edge AI System with NVIDIA Jetson Orin NX
    AIE510-ONX Fanless Edge AI System with NVIDIA Jetson Orin NX

    NVIDIA Jetson Orin NX 16GB, 1 HDMI, 1 GbE PoE, 1 2.5 GbE PoE, 2 USB, 1 COM/CAN, and 8-CH DIO for AMR & Robotics

    Key Features:

    • NVIDIA Jetson Orin NX (100 TOPS)
    • Seamless speed: 5G, Wi-Fi 6E, and 2.5 GbE combined
    • Easily manage: USB and PoE device power control
    • Supports dual PoE for camera & sensor connectivity
    • -25°C to +60°C operating temperature range
    • Supports 24/7 secure remote monitoring, control, and OTA deployment empowered by Allxon
  4. AV600TH Military IP66 Mission GPU Computer
    AV600TH Military IP66 Mission GPU Computer

    MIL-STD 810 Thermal, shock, vibration, Humidity/EMI/EMC conditions, IP66 Chassis with D38999 connectors

    Key Features:

    • MIL-STD 810 Thermal, shock, vibration, Humidity / EMI / EMC conditions
    • IP66 Chassis with D38999 connectors
    • Intel® 11th Gen. Tiger Lake(H) W-11865MLE Processors, up to 8 cores
    • 64GB DDR4 SO-DIMM ECC or non ECC support
    • NVIDIA RTX™ A2000 MXM 8GB GDDR6 2560 CUDA cores
    • 2.5” SATA SSD
    • 1x 3G-SDI Capture Card (Options)
    • MIL-STD-461 18V~36V DC-Input
    • Extreme Temperature: -20 to 55°C degrees
  5. aROK5510 - EN50155 2U 8/9th Gen CPU Rail Server
    aROK5510 - EN50155 2U 8/9th Gen CPU Rail Server

    Intel Core 8/9th Gen/Xeon CPU with Rich Storage Powerful Platform for AI Application and Storage Server

    Key Features:

    • Intel Coffee Lake S/Refresh 8th/9th-Gen Core/Xeon LGA1151 socket-type CPU
    • 100W power consumption graphics card support
    • Eight SIM cards + four WWAN modules support
    • LTE/5G WWAN module support
    • 6 x External SSD for RAID 0, 1, 5, 10
    • PCle 3.0 x4 NVMe 1.3 high-performance SSD support
    • EN 50155, class OT4 conformity
    • 3 x mini-PCIe + 3 x M.2 socket expansion
    • Smart fan design with temperature-based RPMs
    • Optional expansion module for 4 x PoE M12 or 2 x 10GbE SFP+
    • Rackmount platform
  6. AIE900A-AO Fanless Edge AI System w/ NVIDIA Jetson AGX Orin
    AIE900A-AO Fanless Edge AI System w/ NVIDIA Jetson AGX Orin

    Fanless Edge AI System with NVIDIA Jetson AGX Orin, 2 2.5GbE, 8 PoE, and 2 COM/CAN for 5G and Robotics Applications

    Key Features:

    • NVIDIA Jetson AGX Orin with 1792-core NVIDIA Ampere GPU
    • 1 M.2 Key B slot for 5G/LTE, 1 M.2 Key E slot for Wi-Fi 6(E)
    • 24 VDC with ignition power control
    • Supports eight PoE for IP cameras and LiDAR connectivity
    • -30°C to +50°C operating temperature range
    • Supports device management and optional OTA deployment powered by Allxon
  7. ATC8110/8110-F i7 Mobile Expandable AI PC
    ATC8110/8110-F i7 Mobile Expandable AI PC

    Intel Coffee Lake S/Refresh + Inference Accelerator AI Powered for Autonomous and Machine Vision

    Key Features:

    • In-vehicle AI recognition and machine vision applications
    • Fanless/fan flexibility design
    • Up to 8-core Intel® Coffee Lake S/Refresh processing power
    • 3 x PCIe 3.0 slots for Discrete Graphics/Inference/Frame Grabber cards
    • Ultra-fast U.2/M.2 NVMe media for high-speed multi-cameras image capture
    • RAID 0/1/5/10 configurable for data secure and integrity
    • Wide-range 9~36VDC input with Ignition management
    • Rich communication ports, 5 x USB 3.1, 2 x GbE and 4 x RS232/422/485
    • Telemetric functionality of WWAN/5G NR, WLAN and GNSS with up to 4 x 4 MIMO and 4 SIM slots
    • Compliant with E-mark, CE/FCC ClassA and MIL-STD-810G for anti-vibration/shock w/ graphics card installed
    • Realize M-2-M through CAT-M (NB-IoT & eMTC)
  8. IFB122 Robust RISC-based DIN-rail Fanless Embedded System
    IFB122 Robust RISC-based DIN-rail Fanless Embedded System

    Robust RISC-based DIN-rail Fanless Embedded System with i.MX 6UL Processor, 2 COM, 2 LANs and DIO (2-In/1-Out)

    Key Features:

    • RISC-based (i.MX 6UltraLite) processor 528 MHz

    • 256MB DDR3 SDRAM onboard

    • 8GB eMMC flash onboard

    • 1 PCI Express Mini Card slot (Wi-Fi or 3G/4G)

    • 2 digital inputs and 1 digital output

    • Power input range of 9V to 48V DC with terminal block

    • Embedded Linux operating system (Yocto)

    • Fanless and compact design

    • Wide operating temperature range from -40°C to +70°C

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