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Find Your Technical Solution Below

Tekdis products are categorised into the groups below. Once you select the correct category use the filters to locate the best product for your application.

Depending on the category there are numerous filters to help you identify the ideal solution. If you have other questions or requests we are always available via phone or email and will aim to respond within the hour.

Tekdis can "build to order" a complete solution including Operating System and SSD imaging so systems will be preconfigured out of the box. 

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  1. 23.6-24" 1 item
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  1. Intel Core 10 items
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  1. 0 to 499 cd/m2 1 item
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  4. +160°F (+70°C) 1 item
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  1. Panel Mount 1 item
  2. VESA Mount 1 item
  3. Open Frame Kit 1 item
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  1. Projected Capacitive 1 item
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X
  1. 2-3 10 items
  2. 1 1 item
  3. 4-5 2 items
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  1. 4-5 1 item
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  1. 16:9 1 item
Memory  
  1. Up to 2GB 6 items
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  1. Windows 3 items
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brand  
  1. Avalue Technology Inc 2 items
  2. Axiomtek 1 item
  3. Nexcom 7 items

10 Items

Set Descending Direction
  1. XPPC 24-200A 23.8” Fanless Panel PC IP65 Front 11th Gen CPU
    XPPC 24-200A 23.8” Fanless Panel PC IP65 Front 11th Gen CPU

    23.8” TFT FHD 16:9 Slim Bezel, Multi-touch screen Powered by 11th Generation Intel Core Processor

    Key Features:

    • 23.8” TFT FHD 16:9 panel
    • PCAP 10-point multi-touch with slim bezel design
    • IP65-rated front panel
    • Support: VESA/panel/open frame mount
    • 11th Gen Intel® CoreTM processor (Tiger Lake UP3)
    • 1 x 260-pin DDR4 SO-DIMM up to 32G
    • On-board M.2 2280 Key M PCIe x4 for storage module
    • Support power input 12 VDC
    View Product
  2. NISE-70 Celeron/Core Fanless System
    NISE-70 Celeron/Core Fanless System

    Intel Celeron 6305E Processor Dual Core Fanless System

    Key Features:

    • Onboard Intel Celeron 6305E Processor
    • 4 x HDMI
    • 3 x USB 3.0, 1 x USB 2.0
    • 1 x RS232/422/485, 1 x RS232
    • 3 x GbE LAN ports; support WoL, teaming and PXE
    • Onboard TPM 2.0 chip
    • 1 x M.2 socket for storage/4G LTE/5G modules
    • 1 x mini-PCIe socket support optional mSATA/Wi-Fi/BT/4G LTE module
    • Support operating temperature from-5 to 55 Celsius degree
    • Support+12V to 24VDC input; support ATX power mode
    View Product
  3. VTC7260-x Fanless AI-Aided Vehicle Computer
    VTC7260-x Fanless AI-Aided Vehicle Computer

    Fanless AI-aided Vehicle Computer with Intel Core 11th Gen CPU

    Key Features:

    • Intel 11th Gen Tiger Lake UP3, cost-efficient performance
    • Compact, rugged and fanless design
    • Rich I/Os, 2 x 2.5GbE, GbE, 4 x USB 3.2/2.0 & 3 x RS232/422/485
    • 1 x 2.5” SSD, 1 x mSATA and 1 x NVMe SSD for data integrity
    • Up to 3 combinations of LTE/5G, and Wi-Fi 5/6 for mobile router function
    • Triple display, VGA, HDMI and DP for multi video-out
    • 9~36V DC-IN with ignition control & OCP/OVP
    • Wide range operating temperature of -30°C~65°C (15W TDP)
    • Military standard of anti-vibration/shock for OHV applications
    • CE/FCC, UKCA, Emark Certified
    View Product
  4. EMS-TGL Fanless Rugged Embedded System 11th Gen
    EMS-TGL Fanless Rugged Embedded System 11th Gen

    11th Gen. Core i7/i5/i3 BGA Processor, Rich I/O, support 5G module, fanless operation temperature -40°C ~ 70°C

    Key Features:

    • On board 11th Gen. Intel Core i7/i5/i3 BGA Processor
    • 2x 260-pin SODIMM socket Max. up to 64GB DDR4 3200MT/s
    • Rich I/O, 4-USB3.1, 1-DP, 1-HDMI, 2-COM, 2-LAN, 1-8bit GPIO.
    • Support 5G (Sub-6G) module, M.2 NVMe SSD Gen. III x 4, HDMI 2.0b (4K @ 60Hz), LAN 2.5G BaseTx GbE
    • Fanless operation temperature from -40°C ~ 70°C (WT) / 0°C ~ 70°C (ST)
    • CE, FCC Class B, IP50
    • Wide range DC power input from +9~32V
    • Support HW TPM 2.0
    • Support vPro
    View Product
  5. NDiS-V1100 Fanless Embedded Computer 11th Gen
    NDiS-V1100 Fanless Embedded Computer 11th Gen

    Fanless Embedded Computer Powered by 11th Gen Intel Core Processor

    View Product
  6. VTC7260-5HBIoT/7HBIoT Fanless AI-Aided Vehicle Computer
    VTC7260-5HBIoT/7HBIoT Fanless AI-Aided Vehicle Computer

    Fanless AI-aided Vehicle Computer with Intel Core 11th Gen CPU 9~36V DC-IN with ignition control

    Key Features:

    • Intel 11th Gen Tiger Lake UP3, cost-efficient performance
    • Compact, rugged and fanless design
    • Rich I/Os, 2 x 2.5GbE, GbE, 4 x USB 3.2/2.0 & 3 x RS232/422/485
    • 1 x 2.5” SSD, 1 x mSATA and 1 x NVMe SSD for data integrity
    • Up to 3 combinations of LTE/5G, Wi-Fi 5/6 for mobile router function
    • Triple display, VGA, HDMI and DP for multi video-out
    • 9~36V DC-IN with ignition control & OCP/OVP
    • Wide range operating temperature of -30°C~65°C (15W TDP)
    • Military standard of anti-vibration/shock for OHV applications
    • CE/FCC, UKCA, Emark Certified
    View Product
  7. ACS10-TGU 11th Gen Intel Fanless Compact System
    ACS10-TGU 11th Gen Intel Fanless Compact System

    Compact and easy to set up, highly expandable I/O interfaces and flexible storage design, and supports high-resolution graphics

    Key Features:

    • 11th Gen Intel Core i5/i3 Tiger Lake-UP3 Processor
    • Intel Iris Xe/ UHD Graphics Engine
    • 1-260-pin DDR4 3200MHz SO-DIMM, Supports Up to 32GB
    • 2-Gigabit Ethernet, 1 x 2.5GbE, 1 x 1GbE
    • 2-COM Port (RS-232/422/485 & RS-232)
    • 2-Audio Jack (Line-Out & Mic-In)
    • 2-Storage (M.2 Key-M NVMe & M.2 Key-B SATA)
    • 2-Expansion Slot (M.2 Key-E, Key-B)
    • 6-USB Port (3-USB 3.2 & 3-USB 2.0)
    • CE, FCC Class A, UKCA
    View Product
  8. VTC7260-xC4 Fanless AI-Aided Vehicle Computer
    VTC7260-xC4 Fanless AI-Aided Vehicle Computer

    Fanless AI-aided Vehicle Computer with Intel Core 11th Gen CPU

    Key Features:

    • Intel 11th Gen Tiger Lake UP3, cost-efficient performance
    • Compact, rugged and fanless design
    • Rich I/Os, 4 x PoE+, GbE, 4 x USB 3.2/2.0&2 x RS232/422/485
    • 1 x 2.5” SSD, 1 x mSATA and 1 x NVMe SSD for data integrity
    • Up to 3 combinations of LTE/5G, and Wi-Fi 5/6 for mobile router function
    • Triple display, VGA, HDMI and DP for multi video-out
    • 9~36V DC-IN with ignition control & OCP/OVP
    • Wide range operating temperature of -30°C~60°C (15W TDP&PoE)
    • Military standard of anti-vibration/shock for OHV applications
    • CE/FCC, UKCA, Emark Certified
    View Product
  9. NDiS-B360 11th Gen Core Slim Wide Temp Embedded Computer
    NDiS-B360 11th Gen Core Slim Wide Temp Embedded Computer

    11th Gen Core Wide Temp -20~60°C embedded PC

    Key Features:

    • 11th Generation Intel Tiger Lake-UP3 Core processor SoC
    • Dual 4K@60Hz display output, DP++, HDMI 2.0
    • Support 4K@60Hz eDP display output
    • Compact and slim design (H: 36mm)
    • Dual LAN ports and USB3.0 ports for easy connection
    • On-board M.2 Key M 2280 with PCIex4/SATA signal for storage module
    • On-board M.2 Key E 2230 for optional WiFi modules
    View Product
  10. eBOX630A Fanless Embedded System with 11th Gen Core
    eBOX630A Fanless Embedded System with 11th Gen Core

    Fanless Embedded System with 11th Gen Intel Core i7/i5/i3 or Celeron Processor, 2 HDMI, 1 DisplayPort, 3 LANs, 6 USB, 4 COM, and 9 to 48 VDC

    Key Features:

    • 11th gen Intel Core i7/i5/i3 or Celeron Quad-core ULT processor (Tiger Lake UP3)
    • Dual-channel DDR4-3200 SO-DIMM for up to 64GB of memory
    • Supports 3x 2.5 GbE, 6 USB, 4 COM
    • -40°C to +60°C wide operating temperatures
    • 9 to 48 VDC wide range DC power input
    • Supports triple displays with 2 HDMI, and 1 DisplayPort++
    • Intel Iris Xe integrated graphics (i7 & i5 SKUs)
    • Trusted platform module (TPM 2.0 onboard)
    View Product
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  1. Yes 7 items
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  1. Hailo 1 item
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  1. <120°F (<50°C) 1 item
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Mounting
  1. Panel Mount 1 item
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  3. Open Frame Kit 1 item
Touchscreen Technology
  1. Projected Capacitive 1 item
LAN Ports
  1. 2-3 10 items
  2. 1 1 item
  3. 4-5 2 items
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  1. 4-5 1 item
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  1. 16:9 1 item
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brand
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PCIe Expansion
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IP Rating
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  1. Hailo 1 item
Operating Temp
  1. <120°F (<50°C) 1 item
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  4. +160°F (+70°C) 1 item
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brand
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  2. Axiomtek 1 item
  3. Nexcom 7 items