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NF21 12.2" Rugged Tablet
12.2" IP65 Rugged Tablet with Intel® Core™ i5/i7 and hot swap battery
Key Features:
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7th Generation Intel® Core™ i5/i7 ™ Processor
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MIL-STD 810G tested, 4 F't/1.2m drop proof.
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IP65, one-meter 1000 times tumble test.
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Hot swap battery, 6000mAh battery pack.
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Hardware TPM 2.0.
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Gb ethernet port with PXE support for reliable communication & maintenance.
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Windows® Hello & optional finger print authentication support for biometric security system
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NB31 8" Rugged Tablet
8-inch Fully Rugged Tablet with High-Speed Connectivity
Key Features:
- MlL-STD 81OG tested, 5 ft. / 1.5m drop proof.
- IP65, one-meter tumble test.
- Hot swap battery, 11850mAh/3.7V battery pack.
- Windows® 10 loT Enterprise.
- Firmware TPM 2.0.
- Optional finger print authentication support for biometric security system.
- Optional vehicle dock, office dock, and battery charger.
- Optional briefcase handle, stylus, hand strap.
- Optional 4G LTE multi-carrier mobile broadband.
- Optional RFID/NFC/2D Honeywell barcode readers for data acquisition.
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ND51 10.1" Rugged Tablet with Intel Atom CPU
Adjustable, Rugged, High Efficiency Tablet.
Key Features:
- MlL-STD 81OG tested, 5 ft. / 1.5m drop proof
- IP65, one-meter tumble test
- Hot swap battery, integrated 10800mAh/ 3.7V battery pack
- Windows® 10 loT Enterprise
- Firmware TPM 2.0
- 10/100 Ethernet port
- Optional fingerprint authentication support for biometric security system
- Optional vehicle dock, office dock, and battery charger
- Optional briefcase handle, stylus, hand strap
- Optional 4G LTE multi-carrier mobile broadband
- Optional RFID/NFC/2D Honeywell barcode readers for data acquisition
- Optional Intel® RealSense 3D camera to create smart service of Industrial 4.0
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ND62 10.1" Rugged Tablet
Rugged, Compact and Slim Tablet 10.1”
Key Features:
- MIL-STD 810G tested, 5ft. / 1.5m drop proof
- IP65, one-meter tumble test
- Hot swap battery, 4800mAh / 7.6V battery pack
- Firmware TPM 2.0
- Gb Ethernet port with PXE support for reliable communication & maintenance
- Optional Windows Hello camera
- Optional vehicle dock, office dock
- Optional digitizer, stylus, briefcase handle, hand strap
- Optional 4G LTE multi-carrier mobile broadband
- Optional 1D/2D Honeywell barcode readers for data acquisition
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ACS10-TGU 11th Gen Intel Fanless Compact System
Compact and easy to set up, highly expandable I/O interfaces and flexible storage design, and supports high-resolution graphics
Key Features:
- 11th Gen Intel Core i5/i3 Tiger Lake-UP3 Processor
- Intel Iris Xe/ UHD Graphics Engine
- 1-260-pin DDR4 3200MHz SO-DIMM, Supports Up to 32GB
- 2-Gigabit Ethernet, 1 x 2.5GbE, 1 x 1GbE
- 2-COM Port (RS-232/422/485 & RS-232)
- 2-Audio Jack (Line-Out & Mic-In)
- 2-Storage (M.2 Key-M NVMe & M.2 Key-B SATA)
- 2-Expansion Slot (M.2 Key-E, Key-B)
- 6-USB Port (3-USB 3.2 & 3-USB 2.0)
- CE, FCC Class A, UKCA
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EPD-2501 Public Information e-Ink Display
Onboard Intel Celeron SoC BGA Processor N3350
Key Features:
- 25.3” E Ink Black/White/Red/Yellow
- 25.3” E Ink Gallery Plus Full colour 55K (Typ.)
- 25.3" E Ink Kaleido with colour 4096
- Onboard Intel® Celeron® SoC BGA Processor N3350
- DDR3L 1866MTs SO-DIMM up to 8GB,
- 2.5” SATA3 SSD 64GB
- 2 x HDMI, 1 x COM, 2 x LAN, 4 x USB 3.1(Gen1)
- Front Cover Glass, Optional PMMA, support IP54
- Super Slim Bezel Design
- E Ink SDK / API support
- Optional WiFi Module
- Operating Temp 0~40C
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NUC-APL Fanless NUC System J3455/N3350
Intel Apollo Lake Celeron Processor J3455/N3350 Up to 8GB DDR3
Key Features:
- Onboard Intel Celeron Processor J3455/N3350
- Single DRAM Socket, Max. Up to 8GB DDR3 1866MHz
- Rich I/O, 2 x COM, 2 x LAN, 4 x USB3.0, 1 x Audio, 2 x Antennal Mounting
- Triple Display, 2 x HDMI, 1 x DP (DVI-I/VGA Factory Option)
- Expansion Slot, M.2 Key-B, M.2 Key-E
- Fanless Operating from 0°C ~ 60°C
- DC Power Input +12V
- Compact Size, 115mm x 111mm x 58mm
- Supports VESA/Din-Rail Kit
- TPM 2.0 (Factory Option)
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NUC-APL-SLIM Fanless NUC Slim System J3455/N3350
Intel Apollo Lake J3455/N3350 Up to 8GB DDR3
Key Features:
- Onboard Intel Celeron Processor J3455/N3350
- Single DRAM Socket, Max. Up to 8GB DDR3 1866MHz
- Rich I/O, 1 x COM, 2 x HDMI, 2 x LAN, 4 x USB3.0, 1 x Audio, 2 x Antennal Mounting
- Expansion Slot, M.2 Key-B, M.2 Key-E
- Fanless Operating from 0°C ~ 50°C
- DC Power Input +12V
- Compact Size, 115mm x 111mm x 45mm
- Supports VESA/Din-Rail Kit
- TPM 2.0 (Factory Option)
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EMS-TGL Fanless Rugged Embedded System 11th Gen
11th Gen. Core i7/i5/i3 BGA Processor, Rich I/O, support 5G module, fanless operation temperature -40°C ~ 70°C
Key Features:
- On board 11th Gen. Intel Core i7/i5/i3 BGA Processor
- 2x 260-pin SODIMM socket Max. up to 64GB DDR4 3200MT/s
- Rich I/O, 4-USB3.1, 1-DP, 1-HDMI, 2-COM, 2-LAN, 1-8bit GPIO.
- Support 5G (Sub-6G) module, M.2 NVMe SSD Gen. III x 4, HDMI 2.0b (4K @ 60Hz), LAN 2.5G BaseTx GbE
- Fanless operation temperature from -40°C ~ 70°C (WT) / 0°C ~ 70°C (ST)
- CE, FCC Class B, IP50
- Wide range DC power input from +9~32V
- Support HW TPM 2.0
- Support vPro