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ATC3750-6C NVIDIA Jetson AGX Orin Edge AI Computer
NVIDIA Jetson AGX Orin Solution Performance Edge AI Computing for Rail
Key Features:
- Built-in NVIDIA Jetson AGX Orin SOM, up to 200/275 TOPS (INT8) performance
- Designed with rugged, compact and the hybrid thermal solutions
- 6-port GbE PoE+ (x-coded) for IP CAM/LiDAR sensors, optional 1-port 10GbE (x-coded)
- HEVC/H.265 hardware DECODE@ 6 x 4K30 performance
- Wide range operating temperature of -30°C~70°C
- Ultra-speed PCIe 4.0 x4 NVMe SSD for data integrity
- Expansible for GNSS, LTE/5G NR & Wi-Fi 5/6
- 24V DC-IN for rail, ignition control & OCP/OVP
- NEXCOM Acceleration Linux (NAL) integrated w/ JetPack 5.1.1
- Military standard of MIL-STD-810H for anti-vibration/shock
- CE/FCC, UKCA, EN50155 (EN55011, EN50121-3-2, EN61373, OT4) Certified
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VTC7260-x Fanless AI-Aided Vehicle Computer
Fanless AI-aided Vehicle Computer with Intel Core 11th Gen CPU
Key Features:
- Intel 11th Gen Tiger Lake UP3, cost-efficient performance
- Compact, rugged and fanless design
- Rich I/Os, 2 x 2.5GbE, GbE, 4 x USB 3.2/2.0 & 3 x RS232/422/485
- 1 x 2.5” SSD, 1 x mSATA and 1 x NVMe SSD for data integrity
- Up to 3 combinations of LTE/5G, and Wi-Fi 5/6 for mobile router function
- Triple display, VGA, HDMI and DP for multi video-out
- 9~36V DC-IN with ignition control & OCP/OVP
- Wide range operating temperature of -30°C~65°C (15W TDP)
- Military standard of anti-vibration/shock for OHV applications
- CE/FCC, UKCA, Emark Certified
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IPC964A Four-slot Industrial System 12th Gen
LGA1700 Socket 12th Gen Intel Core i7/i5/i3 or Celeron Processor, Intel Q670E, Front-access I/O, and PCIe & PCI Slots
Key Features:
- 4 PCIe/PCI slots
- Optional extension system I/O window
- Optional Support 5G network (Q670E)
- USB power on/off control via BIOS setting
- Intelligent power management - ACC ignition
- EN 61000-6-2 certified
- Supports Intel RST
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IPC962A Two-slot Industrial System 12th Gen
LGA1700 Socket 12th Gen Intel Core i7/i5/i3 or Celeron Processor, Intel H610E/Q670E, Front-access I/O, and PCIe & PCI Slots
Key Features:
- 2 PCIe/PCI slots
- Optional extension system I/O window
- Optional 5G network (Q670E)
- USB power on/off control via BIOS setting
- Intelligent power management - ACC ignition
- EN 61000-6-2 certified
- Supports Intel RST
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IPC960A Fanless Industrial System 12th Gen
LGA1700 Socket 12th Gen Intel Core i7/i5/i3 or Celeron Processor, Intel H610E/Q670E, and Front-access I/O
Key Features:
- Fanless embedded system
- Optional extension system I/O window
- Optional 5G network (Q670E)
- USB power on/off control via BIOS setting
- Intelligent power management - ACC ignition
- EN 61000-6-2 certified
- Supports Intel RST
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ATC3750-A6CR NVIDIA Jetson AGX Orin Edge AI Computer
NVIDIA Jetson AGX Orin Solution Performance Edge AI Computing for Rail
Key Features:
- Built-in NVIDIA® Jetson AGX Orin™ SOM, up to 200/275 TOPS (INT8) performance
- Designed with rugged, compact and hybrid cooling solutions
- 6-port GbE PoE+ (X-coded) for IP CAM/LiDAR sensors, optional 1-port 10GbE (X-coded)
- HEVC/H.265 hardware DECODE up to 7 x 4K30 performance
- Wide range operating temperature of -20°C~70°C
- Ultra-speed PCIe 4.0 x4 NVMe SSD for data integrity
- Expansible for GNSS, LTE/5G NR & Wi-Fi 5/6
- 24V DC-IN for rail, ignition control & OCP/OVP
- NEXCOM Acceleration Linux (NAL) integrated w/ JetPack 5.1.1
- Military standard of MIL-STD-810H for anti-vibration/shock
- CE/FCC, UKCA, EN50155 (EN55011, EN50121-3-2, EN61373, OT4) Certified
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EMS-TGL Fanless Rugged Embedded System 11th Gen
11th Gen. Core i7/i5/i3 BGA Processor, Rich I/O, support 5G module, fanless operation temperature -40°C ~ 70°C
Key Features:
- On board 11th Gen. Intel Core i7/i5/i3 BGA Processor
- 2x 260-pin SODIMM socket Max. up to 64GB DDR4 3200MT/s
- Rich I/O, 4-USB3.1, 1-DP, 1-HDMI, 2-COM, 2-LAN, 1-8bit GPIO.
- Support 5G (Sub-6G) module, M.2 NVMe SSD Gen. III x 4, HDMI 2.0b (4K @ 60Hz), LAN 2.5G BaseTx GbE
- Fanless operation temperature from -40°C ~ 70°C (WT) / 0°C ~ 70°C (ST)
- CE, FCC Class B, IP50
- Wide range DC power input from +9~32V
- Support HW TPM 2.0
- Support vPro
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Neu-X303mini Edge Computing System 12th Gen CPU
12th Gen. Core CPU, 4 x 4K@60Hz display output, DP, HDMI 2.1, 2 x USB 3.2 Type-C, Dual 2.5G LAN ports, 4 x USB 3.2 and 2 x USB 3.2 Type-C ports for easy connection
Key Features:
- 12th Generation Intel Core (Alder Lake - PS) processor SoC
- Four 4K@60Hz display output, DP, HDMI 2.1 and 2 x USB 3.2 Type-C
- Dual 2.5G LAN ports, 4 x USB 3.2 and 2 x USB 3.2 Type-C ports for easy connection
- Onboard M.2 2280 Key M with PCIe signal for storage modules
- Onboard M.2 2230 Key E for optional Wi-Fi modules
- Compact design (L: 183mm, W: 137.9mm, H: 47.9mm)
- 12V DC in
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eBOX671B Fanless Embedded System with 13th/12th Gen
eBOX671B Fanless Embedded System 13th/12th Gen Intel® Core™ 2.5GbE M.2 Key M&E&B USB3.2
Key Features:
- 13th/12th Gen Intel Core i9/i7/i5/i3 and Celeron
- processors with Intel R680E chipset (Alder Lake S)
- Dual DDR5 SO-DIMM for up to 64GB of memory
- 4 LAN with optional PoE supported
- Dual 2.5" SATA HDD drive bays with RAID 0 & 1
- Supports MXM 3.1 Type A, up to 5 display outputs
- -40 °C to +65 °C wide operating temperatures
- Wide range power input from 9 to 36 VDC
- Flexible I/O window supported via mPCIe modules
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TANK-880-Q370 High-Performance 8th/9th Gen PC
Ruggedized Fanless embedded system with Intel® i7-9700TE 1.8GHz, (up to 3.8GHz, 8-core, TDP 35W), 8GB DDR4 pre-installed memory, 1 x PCIe by 16 & 2 x PCIe by 4 & 1 x PCIe by 1 expansion, HDMI/DP, 9~36V DC, RoHS
Key Features:
- 8th/9th Gen Intel Core processor platform with Intel® Q370 chipset and DDR4 memory
- Dual independent displays with high-resolution support
- Rich high-speed I/O interfaces
- On-board internal power connector for providing power to add-on cards
- Four accessible 2.5” HDD/SSD SATA 6 Gb/s bay (with RAID 0/1/5/10 support)
- Great flexibility for hardware expansion