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IPC960A Fanless Industrial System 12th GenLGA1700 Socket 12th Gen Intel Core i7/i5/i3 or Celeron Processor, Intel H610E/Q670E, and Front-access I/O
Key Features:
- Fanless embedded system
- Optional extension system I/O window
- Optional 5G network (Q670E)
- USB power on/off control via BIOS setting
- Intelligent power management - ACC ignition
- EN 61000-6-2 certified
- Supports Intel RST
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ICO520 Fanless Embedded System 12th Gen i7/i5/i3Axiomtek ICO520 DIN-Rail Fanless Embedded-System 12th-Gen Intel®-Core™ 4x2.5GbE, 4xIsolated-COM, Isolated DIO (8-in/8-out)
Key Features:
- High performance with fanless and DIN-rail design
- 12th Gen Intel® Core™ i7/i5/i3 or Celeron® processor (Alder Lake-P)
- 4 isolated COM, isolated DIO (8-in/8-out), 4 2.5 GbE LAN
- Wide operating temperature range from -40°C to +70°C
- 9 to 36 VDC, typical 12-24V power input with OVP, UVP, OCP, RPP
- Supports TPM 2.0
- Supports cold boot at -40°C
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NUC-APL Fanless NUC System J3455/N3350Intel Apollo Lake Celeron Processor J3455/N3350 Up to 8GB DDR3
Key Features:
- Onboard Intel Celeron Processor J3455/N3350
- Single DRAM Socket, Max. Up to 8GB DDR3 1866MHz
- Rich I/O, 2 x COM, 2 x LAN, 4 x USB3.0, 1 x Audio, 2 x Antennal Mounting
- Triple Display, 2 x HDMI, 1 x DP (DVI-I/VGA Factory Option)
- Expansion Slot, M.2 Key-B, M.2 Key-E
- Fanless Operating from 0°C ~ 60°C
- DC Power Input +12V
- Compact Size, 115mm x 111mm x 58mm
- Supports VESA/Din-Rail Kit
- TPM 2.0 (Factory Option)
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NUC-APL-SLIM Fanless NUC Slim System J3455/N3350Intel Apollo Lake J3455/N3350 Up to 8GB DDR3
Key Features:
- Onboard Intel Celeron Processor J3455/N3350
- Single DRAM Socket, Max. Up to 8GB DDR3 1866MHz
- Rich I/O, 1 x COM, 2 x HDMI, 2 x LAN, 4 x USB3.0, 1 x Audio, 2 x Antennal Mounting
- Expansion Slot, M.2 Key-B, M.2 Key-E
- Fanless Operating from 0°C ~ 50°C
- DC Power Input +12V
- Compact Size, 115mm x 111mm x 45mm
- Supports VESA/Din-Rail Kit
- TPM 2.0 (Factory Option)
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EMS-TGL Fanless Rugged Embedded System 11th Gen11th Gen. Core i7/i5/i3 BGA Processor, Rich I/O, support 5G module, fanless operation temperature -40°C ~ 70°C
Key Features:
- On board 11th Gen. Intel Core i7/i5/i3 BGA Processor
- 2x 260-pin SODIMM socket Max. up to 64GB DDR4 3200MT/s
- Rich I/O, 4-USB3.1, 1-DP, 1-HDMI, 2-COM, 2-LAN, 1-8bit GPIO.
- Support 5G (Sub-6G) module, M.2 NVMe SSD Gen. III x 4, HDMI 2.0b (4K @ 60Hz), LAN 2.5G BaseTx GbE
- Fanless operation temperature from -40°C ~ 70°C (WT) / 0°C ~ 70°C (ST)
- CE, FCC Class B, IP50
- Wide range DC power input from +9~32V
- Support HW TPM 2.0
- Support vPro
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DRPC-124-EHL Fanless DIN-Rail Embedded SystemDiscover industrial computing excellence with the fanless DRPC-124-EHL Embedded System, featuring Intel Celeron power, four GbE LAN ports, and a compact design.
Key Features:
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Compact Industrial Mini PC
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Fanless system
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Intel Celeron J6412 2.0 GHz (up to 2.6 GHz, quad-core, TDP 10W)
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Four GbE LAN
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CE/FCC compliant
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ICO330 DIN-Rail Fanless Embedded SystemIntel Atom 3 x 2.5GbE LAN Isolated COM & DIO Fanless System
Key Features:
- Cost-effective with fanless design
- Intel Atom® x6212RE or x6414RE processor
- 6 isolated COM, isolated DIO (8-in/8-out), 3 2.5 GbE LAN
- Wide operating temperature range from -40°C to +70°C
- 9 to 36 VDC, typical 12-24V power input with OVP, UVP, OCP, RPP
- Supports TPM 2.0
- Supports cold boot at -40°C
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eBOX671B Fanless Embedded System with 13th/12th GeneBOX671B Fanless Embedded System 13th/12th Gen Intel® Core™ 2.5GbE M.2 Key M&E&B USB3.2
Key Features:
- 13th/12th Gen Intel Core i9/i7/i5/i3 and Celeron
- processors with Intel R680E chipset (Alder Lake S)
- Dual DDR5 SO-DIMM for up to 64GB of memory
- 4 LAN with optional PoE supported
- Dual 2.5" SATA HDD drive bays with RAID 0 & 1
- Supports MXM 3.1 Type A, up to 5 display outputs
- -40 °C to +65 °C wide operating temperatures
- Wide range power input from 9 to 36 VDC
- Flexible I/O window supported via mPCIe modules
