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TANK-870e-H110 High-Performance 6th/7th Gen PCRuggedized Fanless embedded system with 6th/7th Gen Intel® Core™ processor platform
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eBOX100-51R-FL - i5-7300U, Azure certifiedFanless Ultra Compact Embedded System with Intel® Core™ i5-7300U & Intel® Celeron® 3965U Processors, DisplayPort++, 2 COM, 4 USB and 2 GbE LANs
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eBOX640-521-FL Fanless Embedded System with 9th/8th GenFanless Embedded System with LGA1151 Socket 8th Gen Intel® Core™ & Celeron® Processor, Intel® H310, HDMI, DisplayPort, 6 USB, 2 COM and 8-CH DI/DO
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eBOX630-528-FL Fanless Embedded SystemFanless Embedded System with 8th Gen Intel® Core™ i7/i5/i3 & Celeron® ULT Processor, 2 HDMI, 1 VGA, 3 GbE LAN, 6 USB, Dual PCI Express Mini Card Slots and 9 to 36 VDC
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AIE900-902-FL Fanless Edge AI System Jetson AGX XavierFanless Edge AI System Jetson AGX Xavier™ 4 x POE
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eBOX560-52R-FL Fanless i5/Celeron Palm-Size PCFanless Embedded System with Intel® Core™ i5-8365UE/Celeron® 4305UE Processor, HDMI/DisplayPort, 2 GbE LAN, 2 COM, 4 USB
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AIE900A-AO Fanless Edge AI System w/ NVIDIA Jetson AGX OrinFanless Edge AI System with NVIDIA Jetson AGX Orin, 2 2.5GbE, 8 PoE, and 2 COM/CAN for 5G and Robotics Applications
Key Features:
- NVIDIA Jetson AGX Orin with 1792-core NVIDIA Ampere GPU
- 1 M.2 Key B slot for 5G/LTE, 1 M.2 Key E slot for Wi-Fi 6(E)
- 24 VDC with ignition power control
- Supports eight PoE for IP cameras and LiDAR connectivity
- -30°C to +50°C operating temperature range
- Supports device management and optional OTA deployment powered by Allxon
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eBOX630A Fanless Embedded System with 11th Gen CoreFanless Embedded System with 11th Gen Intel Core i7/i5/i3 or Celeron Processor, 2 HDMI, 1 DisplayPort, 3 LANs, 6 USB, 4 COM, and 9 to 48 VDC
Key Features:
- 11th gen Intel Core i7/i5/i3 or Celeron Quad-core ULT processor (Tiger Lake UP3)
- Dual-channel DDR4-3200 SO-DIMM for up to 64GB of memory
- Supports 3x 2.5 GbE, 6 USB, 4 COM
- -40°C to +60°C wide operating temperatures
- 9 to 48 VDC wide range DC power input
- Supports triple displays with 2 HDMI, and 1 DisplayPort++
- Intel Iris Xe integrated graphics (i7 & i5 SKUs)
- Trusted platform module (TPM 2.0 onboard)
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IPC960A Fanless Industrial System 12th GenLGA1700 Socket 12th Gen Intel Core i7/i5/i3 or Celeron Processor, Intel H610E/Q670E, and Front-access I/O
Key Features:
- Fanless embedded system
- Optional extension system I/O window
- Optional 5G network (Q670E)
- USB power on/off control via BIOS setting
- Intelligent power management - ACC ignition
- EN 61000-6-2 certified
- Supports Intel RST
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EMS-TGL Fanless Rugged Embedded System 11th Gen11th Gen. Core i7/i5/i3 BGA Processor, Rich I/O, support 5G module, fanless operation temperature -40°C ~ 70°C
Key Features:
- On board 11th Gen. Intel Core i7/i5/i3 BGA Processor
- 2x 260-pin SODIMM socket Max. up to 64GB DDR4 3200MT/s
- Rich I/O, 4-USB3.1, 1-DP, 1-HDMI, 2-COM, 2-LAN, 1-8bit GPIO.
- Support 5G (Sub-6G) module, M.2 NVMe SSD Gen. III x 4, HDMI 2.0b (4K @ 60Hz), LAN 2.5G BaseTx GbE
- Fanless operation temperature from -40°C ~ 70°C (WT) / 0°C ~ 70°C (ST)
- CE, FCC Class B, IP50
- Wide range DC power input from +9~32V
- Support HW TPM 2.0
- Support vPro
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ICO330 DIN-Rail Fanless Embedded SystemIntel Atom 3 x 2.5GbE LAN Isolated COM & DIO Fanless System
Key Features:
- Cost-effective with fanless design
- Intel Atom® x6212RE or x6414RE processor
- 6 isolated COM, isolated DIO (8-in/8-out), 3 2.5 GbE LAN
- Wide operating temperature range from -40°C to +70°C
- 9 to 36 VDC, typical 12-24V power input with OVP, UVP, OCP, RPP
- Supports TPM 2.0
- Supports cold boot at -40°C
