Find Your Technical Solution Below
Tekdis products are categorised into the groups below. Once you select the correct category use the filters to locate the best product for your application.
Depending on the category there are numerous filters to help you identify the ideal solution. If you have other questions or requests we are always available via phone or email and will aim to respond within the hour.
Tekdis can "build to order" a complete solution including Operating System and SSD imaging so systems will be preconfigured out of the box.
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SR700-X4D IP65 MXM-GPU Military Computer Xeon E-2276ME w/ GPU
Quadro RTX A2000 GPU with DTL38999 connector, 9th Gen Intel® Xeon E-2276ME (6C,4.5Ghz)
Key Features:
- IP65 MXM-GPU MIlitary Computer
- MIL-STD 810 Thermal, shock, vibration, Humidity, EMI
- Quadro® RTX A2000 (CUDA 2560, GDDR6-8GB) ; Options for GTX1050 Ti
- 9th Gen Intel® Xeon E-2276ME (6C,4.5Ghz)
- Up to DDR4-64GB, Options for DDR4-128GB
- 9V to 36V DC, Options for MIL-STD-461 18V~36V
- Extended operating temp. -40°C to 60°C
- Dimension : 360 x 230 x 86 mm (WxDxH)
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AV800-D27-A45S4 IP65 Military Server Xeon D-2796NT w/ GPU
Designed to meet MIL-810, MIL-461 EMC/EMI, IP65 Sealed with External Cooling Blade
Key Features:
- Ultra High-Performance Intel Xeon Ice Lake-D, D-2796NT (20xCores)
- NVIDIA MXM-GPU Quadro RTX4500 5888 CUDA
- MIL-STD 810 Thermal, Vibration, Shock, Humidity
- 1x 25GbE SFP28, 1x10GbE, 2x 1GbE LAN
- Up to 512GB LRDIMM/256GB RDIMM
- 2x NVMe PCIe Gen 4.0 U.2
- Dual Removable Anti-Drop Solid-State Disk
- IP65 Sealed with External Cooling Blade
- MIL-STD-810 Thermal, Shock, Vibration, Humidity
- MIL-STD 461 EMI/EMC 18V~36V DC-IN(28VDC)
- Extreme Temperature Support -20~+60°C
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EMS-TGL Fanless Rugged Embedded System 11th Gen
11th Gen. Core i7/i5/i3 BGA Processor, Rich I/O, support 5G module, fanless operation temperature -40°C ~ 70°C
Key Features:
- On board 11th Gen. Intel Core i7/i5/i3 BGA Processor
- 2x 260-pin SODIMM socket Max. up to 64GB DDR4 3200MT/s
- Rich I/O, 4-USB3.1, 1-DP, 1-HDMI, 2-COM, 2-LAN, 1-8bit GPIO.
- Support 5G (Sub-6G) module, M.2 NVMe SSD Gen. III x 4, HDMI 2.0b (4K @ 60Hz), LAN 2.5G BaseTx GbE
- Fanless operation temperature from -40°C ~ 70°C (WT) / 0°C ~ 70°C (ST)
- CE, FCC Class B, IP50
- Wide range DC power input from +9~32V
- Support HW TPM 2.0
- Support vPro
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ACS10-TGU 11th Gen Intel Fanless Compact System
Compact and easy to set up, highly expandable I/O interfaces and flexible storage design, and supports high-resolution graphics
Key Features:
- 11th Gen Intel Core i5/i3 Tiger Lake-UP3 Processor
- Intel Iris Xe/ UHD Graphics Engine
- 1-260-pin DDR4 3200MHz SO-DIMM, Supports Up to 32GB
- 2-Gigabit Ethernet, 1 x 2.5GbE, 1 x 1GbE
- 2-COM Port (RS-232/422/485 & RS-232)
- 2-Audio Jack (Line-Out & Mic-In)
- 2-Storage (M.2 Key-M NVMe & M.2 Key-B SATA)
- 2-Expansion Slot (M.2 Key-E, Key-B)
- 6-USB Port (3-USB 3.2 & 3-USB 2.0)
- CE, FCC Class A, UKCA