Find Your Technical Solution Below
Tekdis products are categorised into the groups below. Once you select the correct category use the filters to locate the best product for your application.
Depending on the category there are numerous filters to help you identify the ideal solution. If you have other questions or requests we are always available via phone or email and will aim to respond within the hour.
Tekdis can "build to order" a complete solution including Operating System and SSD imaging so systems will be preconfigured out of the box.
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TPPC3201 31.5” Full-HD Passenger Information Fanless Panel PC
31.5” Full-HD Passenger Information Panel PC Powered by Intel Atom® x5-E3930 Processor
Key Features:
- 31.5” TFT-LCD FHD 16:9 fanless panel computer
- Powered by Intel Atom® x5-E3930 processor, 1.3GHz
- Wide-range DC input of 9V to 36V DC
- Support ignition control for power on/off delay timing management
- Compliant with IP54 on the front panel
- Tempered glass, surface hardness 8H
- 1 x DDR3L up to 8GB, M.2 (2242) B-Key SSD for storage device
- 1 x mini-PCIe expansion available for wireless communication
- CE/FCC/E/e-Mark
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TPPC2902 28.8” Bar Passenger Information Fanless Panel PC
28.8” 1920x600 bar-type Passenger Information Panel PC Powered by Intel Atom® x5-E3930 Processor
Key Features:
- 28.8” TFT-LCD 1920 x 600 bar-type fanless panel computer
- Powered by Intel Atom® x5-E3930 processor, 1.3GHz
- Wide-range DC input of 9V to 36V DC
- Support ignition control for power on/off delay timing management
- Compliant with IP54 on the front panel
- Tempered glass, surface hardness 6H
- 1 x DDR3L up to 8GB, M.2 2242 Key B SSD for storage device
- 1 x mini-PCIe expansion available for wireless communication
- CE/FCC/E/e-Mark
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HSD470T Half-Slim SSDs
SATA III 6Gb/s interface, a powerful controller, and state-of-the-art 112-layer 3D NAND flash
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MTE672A PCIe M.2 SSD
PCIe M.2 SSD 112-layer 3D NAND flash and a PCI Express (PCIe) Gen 3 x4 interface
Key Features:
- Compliant with RoHS 2.0 standards
- Compliant with NVM Express specification 1.3
- Compliant with PCI Express specification 3.1
- Space-saving M.2 form factor (80mm) – ideal for mobile computing devices
- PCIe Gen 3 x4 interface
- Endurance: 3K P/E cycles (Program/Erase cycles) guaranteed
- Key components fortified by default with Corner Bond technology
- 30µ" PCB gold finger
- Anti-sulfur technology implemented to prevent sulfurization in the environment
- Power Shield (PS) to ensure data transfer integrity and minimize data corruption in the drive during an abnormal power outage
- Promised operational reliability in an extended temperature range (from -20°C to 75°C)