Find Your Technical Solution Below
Tekdis products are categorised into the groups below. Once you select the correct category use the filters to locate the best product for your application.
Depending on the category there are numerous filters to help you identify the ideal solution. If you have other questions or requests we are always available via phone or email and will aim to respond within the hour.
Tekdis can "build to order" a complete solution including Operating System and SSD imaging so systems will be preconfigured out of the box.
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eBOX565-500-FL Fanless Embedded System
Fanless Embedded System with Intel® Core™ i5-6300U/i3-6100U & Celeron® 3955U, 2 HDMI, 2 GbE LANs, 4 USB 3.0, 2 COM and 9 to 36 VDC
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eBOX640-500-FL Fanless Embedded System with 7th/6th Gen
Fanless Embedded System with LGA1151 Socket 7th/6th Gen Intel® Core™ & Celeron® Processor, Intel® H110, HDMI, DisplayPort, VGA, 6 USB, 4 COM, PCI Express Mini Card Slot and 10 to 30 VDC
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eBOX670-891-FL Fanless Embedded System with 7th/6th Gen
Fanless Embedded System with LGA1151 Socket 7th/6th Gen Intel® Core™ & Celeron® Processor, Intel® Q170, 2 HDMI, DisplayPort, 4 GbE LANs, 6 USB, 2 PCI Express Mini Card Slots
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eBOX671-517-FL Fanless Embedded System
Fanless Embedded System with LGA1151 Socket 7th/6th Gen Intel Core i7/i5/i3 & Celeron Processor, Intel Q170, HDMI, DVI-D, VGA, 8-CH PoE, 6 USB and 24 VDC
Key Features:
- 7th/6th gen Intel Core i7/i5/i3 & Celeron processors (35W/65W) and Intel Q170
- 8-CH PoE onboard
- 2 front-access SIM slots
- Supports 6-in/2-out isolated DIO
- -40°C to +70°C extended operating temperature
- Optional ignition feature supported
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NDiS-B560 8/9th Gen Fanless Embedded PC
Wide Temp Fanless Embedded PC - 8th/9th Gen Intel Core - 3 x HDMI
Key Features:
- Support 9th and 8th Gen Intel Core i9/i7/i5/i3 LGA socket type embedded processor, up to 35W
- Intel integrated UHD 630 graphic engine
- Support 3 x independent 4K2K 60Hz display output
- 3 x HDMI 2.0, 6 x USB 3.0, 2 x GbE LAN, 4 x COM, 1 x Line-out, 1 x Mic-in
- Support M.2 Key B/E/M
- Fanless design
- Support extended temperature -20~60°C
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Neu-X302 Edge Computing System
Edge Computing System Powered by 8th/9th Generation Intel Core Processor
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eBOX671-521-FL Fanless Embedded System 9th/8th Gen
Fanless Embedded System with LGA1151 9th/8th Gen Intel® Core™ i7/i5/i3 & Celeron® Processor, 4-CH PoE and MXM 3.1 Type A
Key Features:
- 9th/8th gen Intel Core i7/i5/i3 & Celeron with Intel Q370 chipset (Coffee Lake/Coffee Lake Refresh-S)
- 4-CH PoE (IEEE802.3at compliance)
- Dual swappable 2.5" SATA HDD drive bays with RAID 0 &1
- Supports MXM 3.1 type A graphics module (optional)
- DVI-I, HDMI, and DisplayPort with triple-view supported
- AMS.AXView intelligent remote monitoring software for IIoT
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CMC 300-F2x Cabinet Mount Fanless PC
Cabinet Mount Fanless PC with Intel Xeon E-2278GEL and 8th & 9th Gen Intel Core i7/i5/i3 Processors Two PCIe x4
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CMC 300-F0x Cabinet Mount Fanless PC
Cabinet Mount Fanless PC with Intel® Xeon® E-2278GEL and 8th & 9th Gen Intel® Core™ i7/i5/i3 Processors
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IPC960-525-FL Fanless Industrial System 8th/9th Gen CPU
LGA1151 8th/9th Gen Intel Core i7/i5/i3 & Celeron, Intel H310/Intel Q370, Front-access I/O, -10°C to +60°C
Key Features:
- LGA1151 Socket 9th/8th gen Intel Core processor, up to 65W
- M.2 Key B slot for 5G wireless connection (optional)
- Supports RAID 0,1 (Intel Q370)
- Supports Power-on delay function
- Supports TPM 2.0
- Supports AMT 12 (Intel Q370)
- Supports 2-slot/4-slot expansion kit for further expansion
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TANK-880-Q370 High-Performance 8th/9th Gen PC
Ruggedized Fanless embedded system with Intel® i7-9700TE 1.8GHz, (up to 3.8GHz, 8-core, TDP 35W), 8GB DDR4 pre-installed memory, 1 x PCIe by 16 & 2 x PCIe by 4 & 1 x PCIe by 1 expansion, HDMI/DP, 9~36V DC, RoHS
Key Features:
- 8th/9th Gen Intel Core processor platform with Intel® Q370 chipset and DDR4 memory
- Dual independent displays with high-resolution support
- Rich high-speed I/O interfaces
- On-board internal power connector for providing power to add-on cards
- Four accessible 2.5” HDD/SSD SATA 6 Gb/s bay (with RAID 0/1/5/10 support)
- Great flexibility for hardware expansion
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eBOX640-521-FL Fanless Embedded System with 9th/8th Gen
Fanless Embedded System with LGA1151 Socket 8th Gen Intel® Core™ & Celeron® Processor, Intel® H310, HDMI, DisplayPort, 6 USB, 2 COM and 8-CH DI/DO
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eBOX710-521-FL Fanless Embedded System 9th/8th Gen
Fanless Embedded System with LGA1151 Intel® Xeon®, 9th/8th Gen Intel® Core™ i7/i5/i3 & Intel® Celeron® Processor, Intel® C246, ECC Memory and 1 PCIe x4 Expansion Slot
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UST100-504-FL Fanless Compact Embedded System 7th/6th Gen
Fanless Embedded System with 7th/6th Gen Intel® Core™, Pentium® and Celeron® Processor for Video Analytics in Vehicle PC Market
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TANK-870e-H110 High-Performance 6th/7th Gen PC
Ruggedized Fanless embedded system with 6th/7th Gen Intel® Core™ processor platform
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TANK-870-Q170 High-Performance 6th/7th Gen PC
Ruggedized fanless embedded system with High-Performance 6th/7th Generation Intel® Core™ Processor
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eBOX700-891-FL Fanless Embedded System 7th/6th GenEnd of Life
Fanless Embedded System with LGA1151 Socket 7th/6th Gen Intel Core i7/i5/i3 & Celeron Processor, Intel H110, 2 HDMI, DisplayPort, 4 GbE LANs, 6 USB, PCIe x4/PCI Slot and 9 to 36 VDC
Key Features:
- Wide operating temperature range from -40°C to +50°C
- 7th/6th gen Intel® Core™ i7/i5/i3 & Celeron® processors
- PCIe x 4 or PCI slot supported
- Supports 6 USB ports and 4 GbE LAN
- 2 PCI Express Mini Card slots for WLAN/WWAN/mSATA modules
- 1 internal USB Type A connector for the Dongle kit
- AMS.AXView intelligent remote monitoring software for IIoT
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eBOX560-500-FL Fanless Embedded System
Fanless Embedded System with Intel® Core™ i7-6600U/i5-6300U/i3-6100U & Celeron® 3955U, 2 HDMI, 2 GbE LANs, 4 USB 3.0, 2 COM and PCI Express Mini Card Slot
Key Features:
- Intel Core i7-6600U 3.4 GHz/i5-6300U 3 GHz/i3-6100U 2.3 GHz & Celeron® 3955U 2.0 GHz (Skylake ULT SoC)
- 260-pin DDR4 SO-DIMM for up to 16GB of memory
- 12 VDC power input
- Supports 2 HDMI, 2 GbE LAN, 2 COM, and 4 USB 3.0
- Supports Jumbo Frame (9.5K), WoL, PXE and Teaming
- Ultra-compact enclosure design