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EMS-TGL Fanless Rugged Embedded System 11th Gen11th Gen. Core i7/i5/i3 BGA Processor, Rich I/O, support 5G module, fanless operation temperature -40°C ~ 70°C
Key Features:
- On board 11th Gen. Intel Core i7/i5/i3 BGA Processor
- 2x 260-pin SODIMM socket Max. up to 64GB DDR4 3200MT/s
- Rich I/O, 4-USB3.1, 1-DP, 1-HDMI, 2-COM, 2-LAN, 1-8bit GPIO.
- Support 5G (Sub-6G) module, M.2 NVMe SSD Gen. III x 4, HDMI 2.0b (4K @ 60Hz), LAN 2.5G BaseTx GbE
- Fanless operation temperature from -40°C ~ 70°C (WT) / 0°C ~ 70°C (ST)
- CE, FCC Class B, IP50
- Wide range DC power input from +9~32V
- Support HW TPM 2.0
- Support vPro
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NDiS-B360 11th Gen Core Slim Wide Temp Embedded Computer11th Gen Core Wide Temp -20~60°C embedded PC
Key Features:
- 11th Generation Intel Tiger Lake-UP3 Core processor SoC
- Dual 4K@60Hz display output, DP++, HDMI 2.0
- Support 4K@60Hz eDP display output
- Compact and slim design (H: 36mm)
- Dual LAN ports and USB3.0 ports for easy connection
- On-board M.2 Key M 2280 with PCIex4/SATA signal for storage module
- On-board M.2 Key E 2230 for optional WiFi modules
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NDiS-V1100 Fanless Embedded Computer 11th GenFanless Embedded Computer Powered by 11th Gen Intel Core Processor
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NISE-70 Celeron/Core Fanless SystemIntel Celeron 6305E Processor Dual Core Fanless System
Key Features:
- Onboard Intel Celeron 6305E Processor
- 4 x HDMI
- 3 x USB 3.0, 1 x USB 2.0
- 1 x RS232/422/485, 1 x RS232
- 3 x GbE LAN ports; support WoL, teaming and PXE
- Onboard TPM 2.0 chip
- 1 x M.2 socket for storage/4G LTE/5G modules
- 1 x mini-PCIe socket support optional mSATA/Wi-Fi/BT/4G LTE module
- Support operating temperature from-5 to 55 Celsius degree
- Support+12V to 24VDC input; support ATX power mode
