Find Your Technical Solution Below
Tekdis products are categorised into the groups below. Once you select the correct category use the filters to locate the best product for your application.
Depending on the category there are numerous filters to help you identify the ideal solution. If you have other questions or requests we are always available via phone or email and will aim to respond within the hour.
Tekdis can "build to order" a complete solution including Operating System and SSD imaging so systems will be preconfigured out of the box.
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AFL3-W22C-ADLP 21.5” Fanless Touch Panel PC
Wide 21.5" 350cd/m² 1920x1080 Panel PC with 12th Gen. Intel Core ion-board processor, PCAP touch, 2M camera, microphone
Key Features:
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12th Gen Intel Core Mobile i7/i5/i3 Processors
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Full HD capacitive touchscreen
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Anti-AG and Anti-UV PCAP
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One E-Window that supports an additional connector interface
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Support WiFi 6E and Bluetooth 5.2
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EMS-TGL Fanless Rugged Embedded System 11th Gen
11th Gen. Core i7/i5/i3 BGA Processor, Rich I/O, support 5G module, fanless operation temperature -40°C ~ 70°C
Key Features:
- On board 11th Gen. Intel Core i7/i5/i3 BGA Processor
- 2x 260-pin SODIMM socket Max. up to 64GB DDR4 3200MT/s
- Rich I/O, 4-USB3.1, 1-DP, 1-HDMI, 2-COM, 2-LAN, 1-8bit GPIO.
- Support 5G (Sub-6G) module, M.2 NVMe SSD Gen. III x 4, HDMI 2.0b (4K @ 60Hz), LAN 2.5G BaseTx GbE
- Fanless operation temperature from -40°C ~ 70°C (WT) / 0°C ~ 70°C (ST)
- CE, FCC Class B, IP50
- Wide range DC power input from +9~32V
- Support HW TPM 2.0
- Support vPro
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ACS10-TGU 11th Gen Intel Fanless Compact System
Compact and easy to set up, highly expandable I/O interfaces and flexible storage design, and supports high-resolution graphics
Key Features:
- 11th Gen Intel Core i5/i3 Tiger Lake-UP3 Processor
- Intel Iris Xe/ UHD Graphics Engine
- 1-260-pin DDR4 3200MHz SO-DIMM, Supports Up to 32GB
- 2-Gigabit Ethernet, 1 x 2.5GbE, 1 x 1GbE
- 2-COM Port (RS-232/422/485 & RS-232)
- 2-Audio Jack (Line-Out & Mic-In)
- 2-Storage (M.2 Key-M NVMe & M.2 Key-B SATA)
- 2-Expansion Slot (M.2 Key-E, Key-B)
- 6-USB Port (3-USB 3.2 & 3-USB 2.0)
- CE, FCC Class A, UKCA
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TANK-880-Q370 High-Performance 8th/9th Gen PC
Ruggedized Fanless embedded system with Intel® i7-9700TE 1.8GHz, (up to 3.8GHz, 8-core, TDP 35W), 8GB DDR4 pre-installed memory, 1 x PCIe by 16 & 2 x PCIe by 4 & 1 x PCIe by 1 expansion, HDMI/DP, 9~36V DC, RoHS
Key Features:
- 8th/9th Gen Intel Core processor platform with Intel® Q370 chipset and DDR4 memory
- Dual independent displays with high-resolution support
- Rich high-speed I/O interfaces
- On-board internal power connector for providing power to add-on cards
- Four accessible 2.5” HDD/SSD SATA 6 Gb/s bay (with RAID 0/1/5/10 support)
- Great flexibility for hardware expansion
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PCIE-Q870-i2 Full-size PICMG i7/i5/i3/Pentium/Celeron
Full-size PICMG 1.3 CPU card supports LGA 1150 Intel® Core™ i7/i5/i3, Pentium® and Celeron® CPU per Intel® Q87
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NANO-ULT3 EPIC SBC 6th Gen i7/i5/i3/Celeron
EPIC SBC supports Intel® 14nm 6th Generation Mobile Core™ i7/i5/i3 and Celeron® on-board Processor (ULT)
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TANK-870e-H110 High-Performance 6th/7th Gen PC
Ruggedized Fanless embedded system with 6th/7th Gen Intel® Core™ processor platform
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TANK-870-Q170 High-Performance 6th/7th Gen PC
Ruggedized fanless embedded system with High-Performance 6th/7th Generation Intel® Core™ Processor
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PPC2-CW215-ADLP 21.5” IP65-Front Fanless Panel PC with 12th Gen
21.5” Fanless Panel PC with Intel® Alder Lake P Processor
Key Features:
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12th Gen Intel® Core™ Mobile i7/i5/i3 Processors
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PCAP with USB interface (anti-UV/AG coating)
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Dual M.2 (M.2 M Key) support
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Newly Designed Panel Mount Kit
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Support Gloved and Wet Hand Operation
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