Find Your Technical Solution Below

Tekdis products are categorised into the groups below. Once you select the correct category use the filters to locate the best product for your application.

Depending on the category there are numerous filters to help you identify the ideal solution. If you have other questions or requests we are always available via phone or email and will aim to respond within the hour.

Tekdis can "build to order" a complete solution including Operating System and SSD imaging so systems will be preconfigured out of the box. 

Products
Filter  
  1. CPU Intel Xeon Remove This Item
  2. CPU NVIDIA Jetson Remove This Item
  3. Operating Temp +160°F (+70°C) Remove This Item
Clear All
Category  
  1. Products 6 items
  1. Mobile Computing 2 items
  2. Digital Signage 0 items
  3. Industrial Computing 4 items
  4. Panel PCs & Industrial Displays 0 items
  5. Cellular & RF 0 items
  6. Medical Solutions 0 items
  7. Cameras & LiDAR 0 items
  8. Storage & Memory 0 items
CPU  
Intel Gen.  
Rail/EN50155 Certified  
DIN-Mountable  
Fanless  
PCIe Expansion  
IP Rating  
AI Enabled  
Operating Temp  
LAN Ports  
POE Ports  
Memory  
brand  

6 Items

  1. eBOX671A Fanless Embedded System with LGA1200 Socket 11th/10th Gen
    eBOX671A Fanless Embedded System with LGA1200 Socket 11th/10th Gen

    With LGA1200 Socket 11th/10th Gen Intel Xeon, Core i9/i7/i5/i3 or Celeron Processor, Intel W480E, 2 HDMI, DisplayPort, 6 USB, 4 LAN, and 9 to 48 VDC

    Key Features:

    • LGA1200 11th/10th gen Intel® Xeon®, Core™ i9/i7/i5/i3 or Celeron® with Intel® W480E chipset (Comet Lake-S)
    • 4 GbE LAN with optional PoE supported
    • Dual 2.5" SATA HDD drive bays with RAID 0 & 1
    • 2 HDMI and 1 DisplayPort for triple-view
    • -40°C to +70°C wide range operation temperature
    • Wide range power input from 9 to 48 VDC
    • Flexible I/O window supported via mPCIe modules
  2. AV600-THT Military IP66 Mission GPU Computer
    AV600-THT Military IP66 Mission GPU Computer

    MIL-STD 810 Thermal, shock, vibration, Humidity/EMI/EMC conditions, IP66 Chassis with D38999 connectors

    Key Features:

    • MIL-STD 810 Thermal, shock, vibration, Humidity / EMI / EMC conditions
    • IP66 Chassis with D38999 connectors
    • Intel® 11th Gen. Tiger Lake(H) W-11865MRE Processors, up to 8 cores
    • Up to 96GB DDR4 SO-DIMM, non-ECC and ECC
    • NVIDIA RTX™ A4500 8GB/16GB GDDR6 memory 5888 CUDA cores
    • Soldered 64 GB NVMe
    • IP65 2 x 2.5” SATA SSD Easy Swap Tray
    • MIL-STD 461 18V~36V DC-Input (Options for MIL-704/1275)
    • Extreme Temperature : -40°C to 70°C
    • Dimensions : 246(L) x 313.5 (W) x 100 (H) mm
  3. ATC3750-IP7-6C NVIDIA Jetson AGX Orin Edge AI Computer
    ATC3750-IP7-6C NVIDIA Jetson AGX Orin Edge AI Computer

    NVIDIA Jetson AGX Orin Solution for Performance Edge AI Computing

    Key Features:

    • Built-in NVIDIA Jetson AGX Orin SOM, up to 200/275 TOPS (INT8) performance
    • Designed to be IP67-rated, rugged, and compact
    • 6-port GbE PoE+ for IP CAM/LiDAR sensors, optional 1-port 10GbE
    • HEVC/H.265 hardware DECODE, supporting up to 7 x 4K30
    • Wide range operating temperature of -25°C~70°C
    • Ultra-speed PCIe 4.0 x4 NVMe SSD for data integrity
    • Expansible for GNSS, LTE/5G NR & Wi-Fi 5/6
    • 9~36VDC & 24V rail combined, ignition control & OCP/OVP for In-vehicle/Rail
    • Military standard of MIL-STD-810H for anti-vibration/shock
    • CE/FCC, UKCA, E-mark, EN50155 (EN50121-3-2, EN61373, OT3) Certified
per page