VTC7260-xC4 Fanless AI-Aided Vehicle Computer

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SKU
VTC7260-xC4
Brand: Nexcom

Fanless AI-aided Vehicle Computer with Intel Core 11th Gen CPU

Key Features:

  • Intel 11th Gen Tiger Lake UP3, cost-efficient performance
  • Compact, rugged and fanless design
  • Rich I/Os, 4 x PoE+, GbE, 4 x USB 3.2/2.0&2 x RS232/422/485
  • 1 x 2.5” SSD, 1 x mSATA and 1 x NVMe SSD for data integrity
  • Up to 3 combinations of LTE/5G, and Wi-Fi 5/6 for mobile router function
  • Triple display, VGA, HDMI and DP for multi video-out
  • 9~36V DC-IN with ignition control & OCP/OVP
  • Wide range operating temperature of -30°C~60°C (15W TDP&PoE)
  • Military standard of anti-vibration/shock for OHV applications
  • CE/FCC, UKCA, Emark Certified
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The VTC 7260-xC4 is an in-vehicle AI-assisted telematics computer that uses Intel's 11th Gen. Tiger Lake UP3 processor, which has 25% more processing power than the previous generation. Additionally, its 10-year product lifespan can meet the requirements for long-term support appropriate for any in-vehicle applications. The VTC 7260-xC4 can be easily installed in any small cabinet space thanks to its compact, tough, and fanless design, which also helps to minimise maintenance requirements while providing round-the-clock services. The VTC 7260-xC4 is a sophisticated in-vehicle computer because it also includes a variety of peripherals, including triple displays, audio in/out, DI/DO, and 936VDC with IGN control. Other features include 2.5GbE, PoE+, USB 3.2, isolation CANBus, serial ports, ultra-speed NVMe storage, and isolation CANBus, USB 3.2, USB 3.0, and IGN control.

Key Features:

  • Intel 11th Gen Tiger Lake UP3, cost-efficient performance
  • Compact, rugged and fanless design
  • Rich I/Os, 4 x PoE+, GbE, 4 x USB 3.2/2.0&2 x RS232/422/485
  • 1 x 2.5” SSD, 1 x mSATA and 1 x NVMe SSD for data integrity
  • Up to 3 combinations of LTE/5G, and Wi-Fi 5/6 for mobile router function
  • Triple display, VGA, HDMI and DP for multi video-out
  • 9~36V DC-IN with ignition control & OCP/OVP
  • Wide range operating temperature of -30°C~60°C (15W TDP&PoE)
  • Military standard of anti-vibration/shock for OHV applications
  • CE/FCC, UKCA, Emark Certified
CPU Intel® Core™ 11th Gen Tiger Lake UP3Core i5-1145GRE, base frequency 1.5GHz/ 2.6GHz, 4c, 8 MBIntel® Smart Cache (VTC 7260-5C4)Core i7-1185GRE, base frequency 1.8GHz/ 2.8GHz, 4c, 12 MBIntel® Smart Cache (VTC 7260-7C4)Graphics:
- Intel® Iris® Xe graphics, 1.3GHz
- Max resolution: 4096 x 2304@60Hz (HDMI)
- DirectX: 12.1, OpenGL: 4.6
Memory 2 x SO-DIMM, DDR4-3200MHz4GB+4GB in default, 64GB in max.ECC (in-band ECC), dual-channel support
Storage 1 x 2.5” SSD (15mm height)1 x mPCIe for mSATA (SATA 3.0)1 x M.2 2242/2280 Key M NVMe SSD (PCIe 4.0 x4), Hailo AI card in option
Expansion slots 1 x mPCIe socket (PCIe 3.0 + USB 2.0/ USB 3.2), 2 x micro SIMs supported1 x M.2 3042/3050 Key B socket (USB 3.2), 2 x micro SIMs supported1 x M.2 2230 Key E socket (PCIe 3.0 x2 & USB 2.0), Wi-Fi or Hailo AI card in option)
Display 1 x HDMI 2.0a/b, up to 3840 x 2160@60Hz1 x VGA, up to 2560 x 1600@60Hz1 x DP, 4096 x 2304@60Hz
PoE+ 4-port independent 2.5GbE, RJ45 connector
- IEEE 802.3 af/at, total 60W
- 9K byte jumbo frame
- PTP (IEEE 1588) support
- Controller: Intel® I225-IT
GbE 1-port independent GbE, RJ45 connector
- vPro (iAMT) support
- 9K byte jumbo frame
- PTP (IEEE 1588) support
- Wake-up function (WoL)
- Boot from PXE (UEFI)
USB 3 x USB 3.2 Gen1:
- Host type-A connector
- 5V@900mA each
- Up to 10Gbit/s link speed & compliance with USB 2.0 (LS/FS/HS link speed)
1 x USB 2.0, host type-A, 2 x USB 2.0 water-type reserved
Serial Port 2 x full RS232/422/485, selectable2 x full RS232 wafer-type reserved
- RS232 working voltage, +- 9V, baud rate up to 115.2kb/s
Security TPM 2.0: Infineon SLB9665TT2.0FW5.62
Audio

Line-out, unbalance stereo, left & right channel

MIC-in, stereo

Line-in reserved (wafer connector)

MEMS Sensor

3D accelerometer and 3D gyroscope

Controller: ST LSM6DSLTR

DI/DO 4-bit input
- Source: 9~36VDC (12V@1.1mA/24V@2.2mA)
- External: 0~33VDC pull-high, high-level, 3.3-33 VDC; low-level, 0-2VDC
4-bit output
- Source: 9~36VDC (nominal 35mA@24V):
- External: 5~27VDC pull-high, sink current w/ 220mA for each bit, 500mA max (@25C)
Source or external can be selected by DIP switch (default: source type)
CAN bus 1 x CAN 2.0A/ 2.0BIEC 61000-4-2 Electrostatic Discharge (ESD): ± 8KV/15KV (contact/air)2.5KV isolated
GNSS

U-blox NEO-M9N GNSS module for GPS/GLONESS/QZSS/Galileo/Beidou

Optional DR (Dead Reckoning) function, NEO-M8U/M8L

Power Supply

Nominal voltage: 9~36V

Cranking voltage: 6V~9V (less than 20 sec)

OCP & UVP (shut down once exceeding 37V)

Ignition on/off control & programmable on/off delay timer

Optional for remote power on/off control

I/O ports, Front-plate

ATX power button, Reset button

9 x LED Indicators, 1 x VGA (DB15), 2 x COM (DB9, RS232/422/485), 1 x Multi-port (DB15, 4xDI, 4xDO, CAN, DR signal) , 1 x Ext. (DB15, reserved), 1 x PR-SMA for GNSS, 4 x PR-SMA for WLAN

I/O ports, Rear-plate

2 x Audio jack (Line-out & MIC-in)

3 x USB 3.2 type A, 1 x USB 2.0 type A

1 x HDMI, 1 x DP, 4 x PoE+ (2.5GbE, RJ45), 1 x GbE, 9~36VDC (3-pin Phoenix)

4 x SMA for WWAN, 4 x antenna holes reserved

I/O ports, side-plate 2 x SIM slots (SIM1-1, SIM2-1)
Dimensions & Weight

210.0mm x 173.0mm x 75.0mm (w/o mount brackets)

234.0mm x 173.0mm x 81.0mm (w/ mount brackets)

Weight: 3.5kg

Environment

Operating temperatures: -30°C~60°C (15W TDP & PoE)

Storage temperatures: -40°C~85°C

Relative humidity: 10%~95% (non-condensing)

Vibration & Shock Vibration in operating:
- MIL-STD-810H, 514.8C Procedure 6, Category 4
- IEC 60068-2-64: 2.0g@5~500Hz
Vibration in storage:
- MIL-STD-810G, 514.6E Procedure 1, Category 24, 7.7g
Shock:
- MIL-STD-810G, 516.6 Procedure I, trucks and semi-trailers=40g
- Crash hazard: Procedure V, ground equipment=75g
Certifications CE approval, FCC Class A, UKCA, E13 Certified
Operating System

Windows 10 64-bit/Windows 10 IOT 64-bit, Windows 11

Linux (Ubuntu 18.04)

External Cable (option) DB15 multi-port adapter cable, 20cm