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  1. EMS-TGL Fanless Rugged Embedded System 11th Gen
    EMS-TGL Fanless Rugged Embedded System 11th Gen

    11th Gen. Core i7/i5/i3 BGA Processor, Rich I/O, support 5G module, fanless operation temperature -40°C ~ 70°C

    Key Features:

    • On board 11th Gen. Intel Core i7/i5/i3 BGA Processor
    • 2x 260-pin SODIMM socket Max. up to 64GB DDR4 3200MT/s
    • Rich I/O, 4-USB3.1, 1-DP, 1-HDMI, 2-COM, 2-LAN, 1-8bit GPIO.
    • Support 5G (Sub-6G) module, M.2 NVMe SSD Gen. III x 4, HDMI 2.0b (4K @ 60Hz), LAN 2.5G BaseTx GbE
    • Fanless operation temperature from -40°C ~ 70°C (WT) / 0°C ~ 70°C (ST)
    • CE, FCC Class B, IP50
    • Wide range DC power input from +9~32V
    • Support HW TPM 2.0
    • Support vPro
  2. D613 Intel 13th Gen with vPro Technology
    D613 Intel 13th Gen with vPro Technology

    Giada D613 Intel 13th Gen vPro 5G Simultaneous 4K

    Key Features:

    • Intel® 13th Gen. Raptor Lake Processors provide high computing performance and efficiency.
    • Giada D613 supports four display outputs, allowing for simultaneous 4K video playback.
    • Intel® vPro Technology offers integrated hardware-based PC protection, including below-the-OS security and advanced threat detection.
    • The D613 is compatible with a 5G cellular network, providing significantly faster speeds, low latency, and increased capacity.
    • The combination of high-performance cores and efficient cores in the processors optimizes power consumption without sacrificing processing power.
  3. Neu-X303mini Edge Computing System 12th Gen CPU
    Neu-X303mini Edge Computing System 12th Gen CPU

    12th Gen. Core CPU, 4 x 4K@60Hz display output, DP, HDMI 2.1, 2 x USB 3.2 Type-C, Dual 2.5G LAN ports, 4 x USB 3.2 and 2 x USB 3.2 Type-C ports for easy connection

    Key Features:

    • 12th Generation Intel Core (Alder Lake - PS) processor SoC
    • Four 4K@60Hz display output, DP, HDMI 2.1 and 2 x USB 3.2 Type-C
    • Dual 2.5G LAN ports, 4 x USB 3.2 and 2 x USB 3.2 Type-C ports for easy connection
    • Onboard M.2 2280 Key M with PCIe signal for storage modules
    • Onboard M.2 2230 Key E for optional Wi-Fi modules
    • Compact design (L: 183mm, W: 137.9mm, H: 47.9mm)
    • 12V DC in
  4. NDiS-B560 8/9th Gen Fanless Embedded PC
    NDiS-B560 8/9th Gen Fanless Embedded PC

    Wide Temp Fanless Embedded PC - 8th/9th Gen Intel Core - 3 x HDMI

    Key Features:

    • Support 9th and 8th Gen Intel Core i9/i7/i5/i3 LGA socket type embedded processor, up to 35W
    • Intel integrated UHD 630 graphic engine
    • Support 3 x independent 4K2K 60Hz display output
    • 3 x HDMI 2.0, 6 x USB 3.0, 2 x GbE LAN, 4 x COM, 1 x Line-out, 1 x Mic-in
    • Support M.2 Key B/E/M
    • Fanless design
    • Support extended temperature -20~60°C
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